中文網
Taipei
Thu, Jan 20, 2022
13:06
light rain
16°C
CONNECT WITH US
FSP
Sponsored
NEWS TAGGED AMKOR
Monday 9 November 2020
Top foundries to maintain tight partnerships with OSATs, says Amkor executive
Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...
Friday 6 November 2020
ASE, Win Semi cut into supply chain for new Qualcomm chips
Taiwan's backend houses ASE and affiliated Siliconware Precision Industries (SPIL) reportedly have landed orders for Qualcomm's Snapdragon X60 modem chips while GaAs foundry Win Semiconductors...
Wednesday 9 September 2020
OSAT providers to enjoy impressive SiP sales growth in 2020
Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...
Monday 18 May 2020
TSMC may move mature CoWoS tech to US fab, say sources
As TSMC plans to build a 5nm wafer fab in the US, how the company will handle backend support for the fab is drawing concerns from Taiwan's backend supply chain, and a possible solution...
Thursday 16 April 2020
AiP substrate shipments for mmWave 5G handsets may not take off in 2020
It remains premature for Taiwan's IC substrate makers to expect AiP (antenna in package) substrate shipments for mmWave 5G smartphones to contribute positively to their revenues in...
Friday 21 February 2020
USI may enter backend supply chain of AirPods Pro series
Taiwan-based Universal Scientific Industrial (USI), a unit of ASE Technology, is likely to obtain system-in-package (SiP) orders for AirPods Pro Lite, which may also benefit Taiwanese...
Thursday 20 February 2020
ASE Technology to secure backend orders for Qualcomm 5nm 5G modem chips
Qualcomm has newly unveiled the world's first 5nm 5G modem-RF system, the Snapdragon X60, to be paired with its latest, third-generation 5G mmWave antenna module, QTM 535, with Taiwan's...
Thursday 26 December 2019
Chinese backend firm JCET enters supply chain of Samsung, LG
China-based backend house Jiangsu Changjiang Electronics Technology (JCET), through its production subsidiary JCET STATS ChipPAC Korea (JSCK), has reportedly cut into the supply chain...
Wednesday 11 December 2019
ASE to see strong 1Q20 with robust 5G mobile SoCs backend orders
Robust orders for 5G smartphone application processors from the world's major Android phone vendors will allow backend house ASE Technology Holding to enjoy a particularly strong...
Thursday 5 December 2019
Qualcomm intros new 5G SoC lineup
Qualcomm has introduced its new Snapdragon 865 and 765 seies SoC chips designed for 5G-capable Android smartphones slated for launch in 2020. TSMC and Samsung Foundry reportedly are...
Thursday 3 October 2019
ASE provides SiP for TWS device SoC
Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS)...
Wednesday 2 October 2019
Yangtze Memory to ship 64-layer NAND chips for SSD
Yangtze Memory Technology (YMTC) is aggressively improving its 64-layer 3D NAND flash memory production yield rate, gearing up to ship the chips for SSD applications in the first...
Tuesday 20 August 2019
MediaTek 5G SoC on track; Qualcomm faces 7nm EUV yield issues at Samsung, sources say
Unsatisfactory yield rates at Samsung's 7nm EUV process may affect production for the upcoming Qualcomm Snapdragon 7250 mobile SoC, but MediaTek's development of 5G chips, with support...
Monday 5 August 2019
Amkor reportedly grabs orders for MediaTek 7nm SoC
MediaTek has placed backend orders with Amkor Technology for its new 7nm SoC designed for low-band (sub-6GHz) 5G handsets, according to industry sources.
Monday 10 June 2019
Shennan Circuits expanding IC substrate market presence
China's Shennan Circuit has managed to generate profits from its IC substrate business, and has expanded its IC substrate offerings to include those for handset-use application processors...