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NEWS TAGGED ADVANCED PACKAGING
Tuesday 31 October 2023
TSMC fab investments buoying STSP revenue
TSMC has become the primary revenue backer of the Southern Taiwan Science Park (STSP), as it is for the Hsinchu Science Park (HSP), which is nearly saturated with land, according...
Tuesday 31 October 2023
JCET sees growth accelerate in 3Q23
China's JCET Group, a provider of IC backend manufacturing and technology services, reported revenue climbed 30.8% sequentially to CNY8.26 billion (US$1.13 billion).
Monday 30 October 2023
Winbond upbeat about 2024 prospects
Winbond Electronics, a specialty DRAM and flash memory maker, has expressed optimism about its business and market prospects for next year, noting the resolution of the majority of...
Friday 27 October 2023
Intel expects 4Q23 revenue to return to on-year growth
Intel is optimistic that for the first time in two years, fourth-quarter 2023 revenue will return to positive year-over-year growth, and that the PC market, which accounts for the...
Friday 27 October 2023
Latest US sanctions drive China to review chiplet capabilities as the way forward
Following the US sanction updates against Chinese semiconductor development on October 17, which established Total Processing Performance and Performance Density as the new parameters...
Friday 27 October 2023
IC backend houses see AI chips, CPO stimulate advanced packaging demand
AI chips and co-packaged optics (CPO) will stimulate demand for advanced packaging in 2024, during which the semiconductor industry is expected to rebound.
Wednesday 25 October 2023
WinWay Technology takes the lead in CPO, silicon photonics advanced packaging
High-speed data transmission has come into the spotlight along with cloud-based AI accelerator chips as one of the most vital capabilities in the electronics industry, and silicon...
Wednesday 25 October 2023
Samsung unveils new-gen memory solutions for GenAI applications
Samsung Electronics has recently released its new-generation memory solutions aimed at the generative AI and large language model (LLM) markets, including the fifth-generation high-band...
Wednesday 25 October 2023
AI to boost terminal device replacement
AI will drive demand for PC, handset, and other terminal device replacements, according to sources at chipmakers.
Wednesday 25 October 2023
PTI expects strong rebound to take place in memory sector in 2H24
A strong rebound will likely take place in the memory industry in the second half of 2024, according to DK Tsai, chairman for backend house Powertech Technology (PTI).
Wednesday 25 October 2023
Chinese OSATs expanding production capacity in Jiangyin
Chinese OSATs such as JCET are expanding their capacity in the city of Jiangyin on China's east coast, according to industry sources. Their expansion focuses on advanced packaging.
Tuesday 24 October 2023
Ansys semiconductor simulation tools certified for UMC WoW advanced packaging
United Microelectronics (UMC) has certified Ansys' multiphysics solutions to simulate the foundry's latest 3D-IC WoW stacked technology, which will improve the power, efficiency,...
Tuesday 24 October 2023
Equipment supplier C Sun upbeat about advanced packaging demand
Robust demand for CoWoS and other advanced packaging will positively contribute to C Sun Manufacturing's sales operations in the second half of this year, according to the semiconductor...
Thursday 19 October 2023
TSMC expects 11% sequential revenue growth in 4Q23
TSMC expects to post revenues of between US$18.8 billion and US$19.6 billion in the fourth quarter of 2023, which is an 11.1% sequential increase at the midpoint. Gross margin and...
Tuesday 17 October 2023
Nvidia B100 high-end test to begin in 2H24, benefiting OSAT players
AI server supply chain sources reveal that companies such as Foxconn subsidiary Ingrasys are currently experiencing an excessive amount of orders. Their factory workers are working...