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NEWS TAGGED ADVANCED PACKAGING
Friday 30 August 2024
G2C+ alliance expects robust demand for advanced packaging
The global expansion of semiconductor advanced packaging capacity is just beginning, which is promising enormous business opportunities for equipment suppliers, such as the G2C+ alliance...
Thursday 29 August 2024
Panel-level packaging looks promising
Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...
Wednesday 28 August 2024
Chinese OSAT eyes advanced packaging opportunities
In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...
Thursday 15 August 2024
FitTech bets on advanced packaging, silicon photonics CPO to drive 2025 growth
LED equipment manufacturer FitTech is gearing up to begin contract production of CoWoS advanced packaging equipment in the fourth quarter of 2024.
Thursday 8 August 2024
Advanced packaging market sees rapid growth fueled by AI and global expansion
As AI applications proliferate, global tech giants are ramping up investments in data centers worldwide. While traditional hubs like the US, Europe, Japan, and China remain pivotal,...
Tuesday 9 July 2024
Samsung develops FOWLP-HPB packaging solution to curb mobile AP overheating
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...
Thursday 27 June 2024
ASEH steps up production expansion for advanced packaging
ASE Holdings (ASEH) has stepped up production expansion for advanced packaging and does not rule out establishing additional facilities in Japan, the US, or Mexico, according to company...
Thursday 27 June 2024
Equipment makers see demand boom for TSMC CoWoS packaging
With TSMC planning to boost production capacity for CoWoS packaging, related fab toolmakers are confident about orders from the contract chipmaker.
Wednesday 26 June 2024
ASE sees better prospects in 2H24, thanks to robust advanced packaging demand
ASE CEO Tien Wu said at the company's 2024 shareholder meeting on June 26 that the semiconductor industry will have better performance in the second half of 2024, thanks to the demand...
Wednesday 26 June 2024
Passive component companies expand production for AI demand
Companies across industries, including the passive component sector, are optimistic about generative AI's business potential.
Wednesday 26 June 2024
Malaysia fast becoming semiconductor hub
Malaysia is fast becoming a semiconductor hub in Southeast Asia, with efforts being devoted particularly to expanding its advanced packaging, IC design, and AI sectors.
Wednesday 26 June 2024
ASE sets up new facility in southern Taiwan for advanced packaging
ASE Technology Holding (ASEH) recently announced that its subsidiary Advanced Semiconductor Engineering (ASE) will collaborate with Hung Ching Development & Construction to build...
Tuesday 25 June 2024
Intel Foundry ecosystem partners add reference flows for EMIB advanced packaging
Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect...
Tuesday 25 June 2024
Taiwan OSATs to see sales growth in 2H24
Taiwan-based backend houses have seen demand for advanced packaging and testing services growing from the AI chip segment, which is expected to fuel sales growth in the second half...