Driven by the AI frenzy, high-performance computing (HPC) chips are becoming pivotal in the semiconductor landscape, spotlighting advanced packaging technologies like CoWoS. Heat...

According to Korean media Money S, the South Korean government and major semiconductor firms have signed a "Semiconductor Advanced Packaging Technology Cooperation Development...

In light of the fact that Chinese foundries can still obtain used equipment and consumables for process technology upgrades despite the US ban, the US could target advanced packaging...

Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...

Artificial Intelligence (AI) is driving demand for servers, high-end chips, and advanced packaging, with 3D chips as a potential star in next-generation advanced packaging technology...

Advanced packaging and testing technologies shined brightly at SEMICON Taiwan 2023 due to a focus on AI, HPC, and automotive chips. This included various showcases of new products...

InnoCare Optoelectronics (INCX), a subsidiary of panel maker Innolux that specializes in the development of flat panels for medical applications, is collaborating with Smart Chain...

Micron Technology has disclosed plans for its Taiwan facility to become the hub of advanced packaging for high bandwidth memory (HBM).

Topco Scientific (TSC), a leading semiconductor material distributor, is expanding its advanced packaging material supply operations. In addition to silicon wafers and photoresist,...

High-end AI server shipments are forecast to reach 337,000 units in 2024, with the generative AI market reaching US$109 billion by 2030, at a compound annual growth rate (CAGR) of...

Recent statements by TSMC and Intel regarding their ambitious capital expenditure plans for advanced packaging have raised the bar for incumbent competitors and new entrants alike,...

Intel has invested a total of US$8 billion in Malaysia, and is committing an additional US$6 billion for the construction of new semiconductor facilities there, including a 3D advanced...

With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...

The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.

Since ChatGPT ignited a race among competitors to develop their generative AI system in early 2023, the high-computing power demand has pushed up the sales of AI GPUs.