A significant ramp-up in CoWoS production capacity at TSMC is anticipated to propel server companies' AI server sales to new heights in 2024, according to industry sources.
With TSMC and ASE Holdings (ASEH) gearing up to build additional fab capacities for advanced packaging, relevant supply chain participants are optimistic about growth driven by their...
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.
According to sources at IC packaging material distributors, advanced packaging and heterogeneous integration are driving demand for high-end materials.
As Moore's Law slows down, the semiconductor industry is transforming and facing challenges. As a crucial technological segment in the post-Moore era, the role of packaging and testing...
Marking the beginning of 2024, DIGITIMES Asia compiled the list of the top 100 semiconductor companies based on their market values in dollar terms at the end of 2023. The median...
There are three ways to grow the economic scale in the modern-day semiconductor industry: continuous miniaturization of processes, advanced packaging, and the application of new ma...
OSAT Advanced Semiconductor Engineering (ASE) will acquire facilities from its fully-owned subsidiary ASE Test to boost packaging capacity, according to the former's parent company,...
Industry sources indicate that Taiwan-based panel maker Innolux has received orders occupying the entire capacity of its first-phase chip-first advanced fan-out panel level packaging...
US power amplifier (PA) vendor Qorvo's decision to sell its packaging and testing plants in China to Luxshare Precision Industry, a key Chinese player in Apple's supply chain, has...
Winbond Electronics, a Taiwan-based memory chipmaker, has signed a letter of intent to collaborate with OSAT Powertech Technology (PTI) to jointly develop 2.5D and 3D advanced packaging,...
The US Defense Advanced Research Projects Agency's (DARPA) 2023 Electronic Resurgence Initiative 2.0 has inspired Taiwan to develop its electronic design automation tools for heterogeneous...
A Reuters report quoted three people familiar with the fact that more and more Chinese IC design houses are having their chips packaged in Malaysia, worrying that the US...
