CONNECT WITH US
NEWS TAGGED ADVANCED PACKAGING
Tuesday 17 October 2023
Nvidia B100 high-end test to begin in 2H24, benefiting OSAT players
AI server supply chain sources reveal that companies such as Foxconn subsidiary Ingrasys are currently experiencing an excessive amount of orders. Their factory workers are working...
Monday 16 October 2023
Micron opens new assembly and test facility in Malaysia
Micron Technology recently commemorated its 45th anniversary with the inauguration of its state-of-the-art assembly and testing facility in Batu Kawan, Penang,
Monday 16 October 2023
Competition heats up for semiconductor construction projects amid market downturn
The semiconductor market's slowdown has reshaped the landscape of contractors vying for projects, with TSMC's prominence in factory construction projects leading the way. The dynamic...
Friday 13 October 2023
Samsung set to roll out HBM4 in 2025 incorporating advanced packaging solution
Samsung Electronics has unveiled a strategic memory roadmap, aiming to release a new generation of high-bandwidth memory (HBM) product, HBM4, by the year 2025. In this ambitious endeavor,...
Wednesday 11 October 2023
TSMC to maintain 2023 outlook despite stronger 3Q
Despite better-than-anticipated third-quarter revenues, TSMC is expected to reiterate its previously stated revenue and capex projections for 2023 at its upcoming investors conference,...
Wednesday 4 October 2023
ASE intros integrated design ecosystem for advanced packaging
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the launch of its integrated design ecosystem (IDE), a collaborative design toolset optimized...
Monday 2 October 2023
Applied Materials cuts into supply chain for Intel glass substrate technology
Applied Materials and its equipment and materials partners have entered the supply chain for Intel's recently announced glass substrates for advanced packaging, according to industry...
Thursday 28 September 2023
TSMC talks about new 3Dblox 2.0, 3DFabric achievements
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Wednesday 27 September 2023
Intel CEO talks about company resilience, competitiveness
During a Q&A session with the press at Intel Innovation 2023, Intel CEO Pat Gelsinger discussed the company's current focus and strategy in light of intensifying competition among...
Friday 22 September 2023
SKC invests in US startup Chipletz to strengthen packaging capability
SKC, the specialized materials manufacturer under the SK Group is poised to invest in Chipletz, a US IC packaging startup, to enhance its capability in IC packaging.
Wednesday 20 September 2023
Taiwan, US delegations explore cybersecurity, 5G, EV cooperation and investment opportunities at Taipei forum
A Taiwan-US supply chain partnership forum held in Taipei alongside the US Business Day on September 19 saw delegations of government and corporate representatives from both sides...
Wednesday 20 September 2023
Taiwan OSATs step up SiPh deployment
Taiwan-based OSATs, such as ASE Technology and Winstek Semiconductor, have stepped up their silicon photonics (SiPh) deployments and are evaluating its potential in furthering advanced...
Tuesday 19 September 2023
AI boom sparks silicon photonics applications
Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...
Tuesday 19 September 2023
Packaging material distributors see stable demand for automotive, advanced packaging
Semiconductor material distributors, such as Niching Industrial, Chang Wah Technology (CWTC), Topco Scientific, and Wahlee Industrial, continue to observe relatively stable demand...
Tuesday 19 September 2023
Intel gearing up for glass substrate production for advanced packaging
Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030.
Research Report Database
Summary of Tech Supply Chain News!
Silicon shield doesn't guarantee military deterrence for Taiwan, says DIGITIMES Research
Taiwan IPC makers pushing integrated services to boost profits and to see revenues grow in 2024, says DIGITIMES Research
Global smartphone shipments hit 2023 peak in 4Q23, but decelerate in 1Q24 due to seasonality, says DIGITIMES Research