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Monday 14 September 2026
Z.ai reloads with US$5 billion for China's AI race

Chinese artificial intelligence developer Z.ai (formerly Zhipu AI) plans to raise about US$5 billion through a Hong Kong share placement and convertible bond sale, which would give the company fresh capital for next-generation model development, computing infrastructure and business expansion.

Monday 14 September 2026
Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
Samsung Electronics and Qualcomm are expanding discussions over 2nm foundry cooperation, with pricing, yield, and process optimization still unresolved as Samsung seeks to regain a share of Qualcomm's flagship processor business.
Monday 14 September 2026
Gritek to take full control of 12-inch silicon wafer venture in major restructuring
Gritek plans to strengthen its position in China's large-diameter silicon wafer market by acquiring the remaining stakes in two semiconductor materials companies, according to a company announcement.
Monday 14 September 2026
China's OLED expansion narrows South Korea's auto, IT panel lead
China's OLED supply push is gathering pace, with BOE Technology Group (BOE), TCL China Star Optoelectronic Technology and Visionox rapidly expanding production and closing in on South Korean rivals. South Korean companies still hold an edge in OLED for smartphones and TVs, but their room to grow in IT devices and automotive OLEDs is likely to narrow.
Monday 14 September 2026
Hua Hong Grace completes Huali Micoelectronics acquisition, state parent raises stake

Hua Hong Grace (HHGrace) has completed the share issuance for its acquisition of a 97.4988% stake in Huali Microelectronics (HLMC), strengthening the company's position in China's semiconductor foundry market.

Monday 14 September 2026
Renesas readies second price hike amid stronger power-chip demand

Renesas Electronics is reportedly preparing a second product price increase this year, with new pricing set to take effect January 1, 2027, as rising manufacturing costs coincide with stronger demand for power semiconductors used in data centers and other high-growth applications.

Sunday 13 September 2026
China's robot champions can run; now they have to prove they can earn

China's humanoid robot boom is entering a harder phase. After years of headline-grabbing demonstrations and heavy private funding, companies are being pressed to prove something less theatrical but more consequential: that robots can perform reliable work, generate recurring revenue, and justify their valuations.

Sunday 13 September 2026
China auto exports hold above 1 million as new energy shipments surge

China's auto exports stayed above 1 million units for a third straight month in August 2026, reaching 1.01 million vehicles, according to the China Association of Automobile Manufacturers. The increase of 65.3% from a year earlier came as weaker domestic demand pressured the home market and exports became a larger growth driver for Chinese automakers.

Saturday 12 September 2026
Renault sets 2-year car development quality line

Facing an aggressive push by Chinese automakers to launch new models at short intervals and rapidly seize market share, major automakers in Europe, the US, Japan, and South Korea are confronting a new trade-off between R&D speed and quality control. Renault Group CEO Francois Provost said the French automaker will not blindly follow suit at the expense of quality and will not bring a new model to market if its development cycle is under two years.

Saturday 12 September 2026
Apple foldable plans drive new demand for Japanese smartphone parts makers
Apple’s move into foldable smartphones is creating fresh business for Japanese component makers with expertise in thin, lightweight and compact designs. According to Nikkei Asia, suppliers that once helped shape Japan’s feature phone era are seeing renewed interest in foldable display materials, hinges and battery-related parts.
Saturday 12 September 2026
Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line
Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains traction, Resonac CTO for semiconductor materials Hidenori Abe told DIGITIMES that the company sees five major materials challenges: warpage, plating, coating, bonding, and polishing.
Saturday 12 September 2026
Luxshare eyes AR glasses breakthrough through car HUD model

At the 2026 China International Optoelectronic Exposition (CIOE), Luxshare and its lens module unit Luxvisions jointly showcased multiple optical and sensing technologies, including automotive camera modules, robot vision modules for autonomous guided vehicles (AGVs) and autonomous mobile robots (AMRs), as well as tracking modules and waveguide display components for augmented reality (AR), virtual reality (VR), and extended reality (XR) wearables. The display underscored the group's push for vertical integration in optics.

Friday 11 September 2026
Why Chinese automakers' aggressive push only further tightens CATL's grip
Supply diversification has long been a recurring — and difficult — issue confronting the high-tech manufacturing ecosystem. But efforts to diversify component and materials sourcing have proved particularly challenging for automakers, which remain tied to a relatively concentrated upstream battery market.
Friday 11 September 2026
Samsung Electro-Mechanics, LG Innotek vie in AI package substrates
At South Korea's recent KPCA Show 2026, Samsung Electro-Mechanics and LG Innotek showcased their next-generation package substrate technologies. As AI semiconductors evolve toward higher performance, increased density, and larger footprints, both companies are competing for dominance in this high-value-added advanced packaging market.
Friday 11 September 2026
Memory makers gain the upper hand as Apple's iPhones pay the price
Apple has raised prices on both its new iPhone 18 Pro series and older models, including the iPhone 17, as rising memory costs push up component expenses.