Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors, as the company works to strengthen the competitiveness of its proprietary mobile silicon. The South Korea-based company is exploring a side-by-side packaging technology, internally dubbed SbS, that places the application processor and memory chips adjacent to one another rather than stacking them vertically
Samsung Electronics is reportedly on track to post sharply higher operating profit in the fourth quarter of 2025 as demand tied to artificial intelligence infrastructure lifts memory chip prices. The reports, compiled by South Korean outlets including Korea Economic Daily and EBN and citing industry sources, said Samsung's preliminary fourth-quarter operating profit is expected to exceed KRW20 trillion, a level that would mark the first time a South Korean company has crossed that threshold in a single quarter
China's leading domestic DRAM maker, ChangXin Memory Technologies (CXMT), is seeking to raise CNY29.5 billion (approx. US$4.2 billion) through an IPO in Shanghai, as it looks to upgrade production lines and expand development of advanced memory technologies
Chinese chip designer GigaDevice Semiconductor is pressing ahead with plans to list its shares in Hong Kong, seeking to raise as much as HK$4.68 billion (approx. US$601.4 million) in what would be one of the latest semiconductor offerings amid a renewed IPO push by Chinese technology firms
Samsung Electronics plans to boost its high-bandwidth memory (HBM) production capacity by approximately 50% through late 2026, according to South Korean media outlet ET News, as the company secures key technical milestones with major AI customers
According to South Korean media reports and industry sources, TSMC is moving to pull forward the production schedule at its second Arizona facility, a shift that could reshape supply planning for major chip designers and weaken the long-running narrative that Samsung Electronics stands as the default alternative when TSMC capacity tightens
China is requiring semiconductor manufacturers to source at least 50% of their equipment from domestic suppliers when adding new production capacity, Reuters reported, citing people familiar with the matter
