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    Adata, Team Group post record March sales, expect 40% contract price hike in 2Q26
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    China intervenes in memory supply; Apple outpaces local smartphone vendors
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    HomeRegionsEast Asia
    Tuesday 7 April 2026
    China AI platforms compete for developer access via OpenClaw mirror
    Open-source AI agent project OpenClaw, colloquially referred to as "raising lobsters," is gaining momentum in China. The launch of its official China mirror on April 1 is pushing activity beyond developer circles into cloud platforms and major tech firms, turning the project into a focal point for platform competition
    Tuesday 7 April 2026
    Weekly news roundup: China's special AI chip supply ends; TSMC plans 12 fabs in Arizona
    Below are the most-read DIGITIMES Asia stories from the week of March 30-April 5, 2026
    Tuesday 7 April 2026
    China channels billions into space start-ups through IPO pipeline
    In recent years, space has emerged as a central arena of global strategic competition, drawing heavy investment from the US, China, Russia, Japan, South Korea, and India. Among them, China has moved aggressively to commercialize its space sector, encouraging private start-ups to develop rockets and satellites while building an independent ecosystem in low-Earth orbit. The aim is to narrow the gap with SpaceX
    Monday 6 April 2026
    China 2.5D packaging demand surges, supporting Korean backend equipment growth
    China's semiconductor equipment market is emerging as a critical growth engine for South Korean suppliers, driven by accelerating AI deployment and tighter restrictions on US vendors. Demand for advanced packaging tools is running ahead of expectations, with high-bandwidth memory (HBM) and 2.5D packaging advancing in tandem as central pillars of future growth. At the same time, Beijing's push for supply chain localization is reshaping competitive dynamics and limiting foreign access
    Sunday 5 April 2026
    Samsung and SK Hynix to reportedly bolster helium supply chain as Iran conflict risks rise
    Facing the risk of a prolonged Iran conflict, Samsung Electronics and SK Hynix have reportedly begun strengthening their helium supply chain management for semiconductor manufacturing. Both companies plan to diversify suppliers beyond the Middle East and adjust import ratios by country to maintain stable supply chains
    Sunday 5 April 2026
    China storage module maker Techwinsemi gains from AI-driven NAND cycle, expands smartphone ties
    AI data center demand is tightening memory supply while NAND makers phase out low-capacity legacy nodes. Shenzhen Techwinsemi Technology said rising NAND prices are squeezing margins for devices priced near CNY1,000, even as supply shifts create new growth opportunities. The company has secured partnerships with leading Chinese smartphone vendors
    Saturday 4 April 2026
    Semco raises ABF substrate prices as AI server demand surges
    The explosive growth in artificial intelligence (AI) servers and high-performance computing (HPC) is driving up the value of key components like ABF substrates. With ongoing bottlenecks in the global supply chain for advanced packaging substrates, South Korea's Samsung Electro-Mechanics (Semco) has proactively restructured its product lineup and increased prices. This move reflects not only rising raw material costs but also a structural shift where demand far exceeds supply
    Saturday 4 April 2026
    Memory interface chip maker Montage sees DDR5 surge drive 2025 growth
    Montage Technology reported full-year 2025 revenue of CNY5.46 billion (US$750 million), up 49.9% year on year, while net profit rose 58.4% to CNY2.24 billion, broadly in line with expectations. Adjusted net profit reached CNY2.02 billion, up 62.0%, reflecting solid underlying demand
    Saturday 4 April 2026
    Samsung strike threat clouds PMIC, mature-node outlook
    Samsung Electronics reportedly faces renewed strike risk after union talks stalled, threatening already tight mature-node semiconductor supply chains. Power management ICs (PMICs) and display driver ICs (DDICs) are seen as the most exposed segments, given constrained capacity and firm demand
    Friday 3 April 2026
    US faces split Asia: allies build 'sovereignty walls' as digital tensions rise

    The 2026 National Trade Estimate (NTE) Report signals a new era of digital friction between the US and its closest Asian allies

    Friday 3 April 2026
    US-China trade tensions deepen as supply chains fracture despite tariff truce

    The trade environment for US businesses operating in or trading with China deteriorated sharply between 2025 and 2026, according to a comparative analysis of the latest National Trade Estimate (NTE) Reports, underscoring a widening gap between high-level diplomacy and on-the-ground economic realities

    Thursday 2 April 2026
    South Korea reportedly advances GaAs localization with 95% yield on 4-inch process
    South Korea is moving closer to localizing high-performance compound semiconductor components long reliant on imports after achieving a key manufacturing milestone, according to ET News
    Thursday 2 April 2026
    South Korea exports hit record US$86bn, chip demand drives breakout above US$80bn
    South Korea's exports climbed to a record US$86.1 billion in March 2026, marking the first time monthly shipments have exceeded the US$80 billion threshold, even as the Middle East conflict disrupted logistics and energy flows. According to the Ministry of Trade, Industry and Energy (MOTIE), the figure was up 48.3% year on year, extending a 10-month run of record monthly exports and lifting the country's trade surplus to US$25.7 billion — its 14th straight month in the black
    Thursday 2 April 2026
    Asahi Kasei enters AI chip fiberglass market to challenge Nittobo's dominance
    Japan's Asahi Kasei has announced its official entry into the AI chip supply chain with fiberglass cloth as an insulating substrate material, targeting the current global leader Nittobo, which holds a 90% market share. Meanwhile, Nippon Electric Glass (NEG) also plans to invest in AI-specific fiberglass cloth, signaling accelerated competition among Japanese materials makers for semiconductor opportunities
    Thursday 2 April 2026
    Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM

    Samsung Electronics and SK Hynix are reportedly stepping up efforts to advance hybrid bonding for next-generation high-bandwidth memory (HBM), as the two memory makers move to secure key packaging technologies for AI-driven demand, according to The Elec

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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook