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    CXMT's server DRAM push raises margin concerns for Samsung, SK Hynix
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    Grab plays up Singapore roots, rules out Huawei maps in Taiwan as Foodpanda deal nears decision
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    Taiwan panel makers enter semiconductor fight as structural challenges persist
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    Taisic Materials expands SiC capacity for AI data centers, 8-inch markets
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    HomeRegionsEast Asia
    Tuesday 13 October 2026
    China's AI revenue gap with US exposes deeper monetisation divide
    China's leading artificial intelligence companies are gaining users and global recognition, but their commercial returns remain far behind those of US rivals. The growing disparity raises a question for China's AI industry: can low-cost, open-weight models generate sustainable profits, or will the greatest financial rewards flow to the platforms distributing them?
    Tuesday 13 October 2026
    Samsung to pay chip workers special bonuses in stock, pending shareholder approval
    Samsung Electronics plans to pay its semiconductor employees special bonuses entirely in company shares in late March or early April 2027, with two-thirds of the stock subject to selling restrictions for up to two years. The payments, funded by 10.5% of the chip division's operating profit, remain subject to shareholder approval.
    Tuesday 13 October 2026
    China's Jinai Tech backed by state, targets 2027 advanced process pilot-line launch with ambition laid upon SEA
    China's 15th Five-Year Plan and the Ministry of Industry and Information Technology's strong chip project are accelerating the domestic replacement of semiconductor equipment and materials amid intensifying US-China competition. Xiamen-based Jinai Tech, which integrates resources from both sides of the Taiwan Strait, is leveraging plasma, chemical vapor deposition (CVD), and atomic layer deposition (ALD) technologies to enter the advanced process equipment market, with its pilot production line scheduled to begin operations in mid-2027.
    Monday 12 October 2026
    China proposes physical controls and tougher testing for new vehicles
    China proposed tighter vehicle design and safety requirements that would restrict fully hidden door handles, virtual controls for critical functions and several interior features in new vehicles. The draft rules, issued by the Ministry of Industry and Information Technology and three other government departments, are intended to reduce safety risks associated with rapidly developed vehicle models and would affect automakers seeking approvals in China.
    Monday 12 October 2026
    Samsung reportedly secures long-term contracts covering up to 80% of 2027 memory supply
    Samsung Electronics has committed 75–80% of its 2027 memory supply, including high-bandwidth memory (HBM), to long-term agreements (LTAs), the Korea Economic Daily reported on October 9, 2026, citing industry sources. Nvidia, Google and Microsoft were among the major customers that had largely finalized contracts. Samsung has not confirmed the allocation or named the buyers.
    Monday 12 October 2026
    Moonshot AI's Hong Kong IPO faces a critical ownership dispute ahead of US$50 billion debut
    China's Moonshot AI is seeking to settle a shareholder dispute involving claims potentially exceeding US$700 million ahead of a potential US$5 billion Hong Kong initial public offering (IPO). Allegations concerning asset transfers and corporate governance could complicate the AI startup's listing preparations.
    Monday 12 October 2026
    Biren's BR20X GPU targets 1,024-chip AI systems, but US curbs cloud mass production

    China's Biren Technology has successfully powered on its next-generation BR20X GPU, advancing to post-tapeout validation while preparing for customer sampling and mass production. The milestone advances its AI accelerator roadmap, though US export controls and manufacturing constraints remain major obstacles.

    Monday 12 October 2026
    Samsung could unseat SK Hynix as HBM leader in 2027
    Samsung Electronics could overtake SK Hynix as the world's largest supplier of high-bandwidth memory (HBM) in 2027, as HBM4 prices climb and memory manufacturers compete for limited DRAM production capacity, according to forecasts presented at an October 6 semiconductor industry forum in Seoul.
    Monday 12 October 2026
    Apple's iPhone 18 order cuts expose widening divide in premium demand

    Apple's iPhone 18 Pro lineup is showing mixed demand signals weeks after launch. Reports of component order cuts suggest weaker-than-expected sales, while Chinese supply-chain sources point to stronger demand for the pricier Pro Max and foldable iPhone Duo. The divergence highlights growing pressure on Apple's premium strategy as rising memory costs drive smartphone prices higher.

    Monday 12 October 2026
    Rapidus targets customers underserved by TSMC, but can it convince them to take the risk?
    Backed by US$15 billion in Japanese government funding, Rapidus announced an alliance with 17 semiconductor design-related companies, including US-based Synopsys and India's Infosys, on October 5. The partnership aims to expand its potential customer base by helping companies develop custom chips.
    Monday 12 October 2026
    SK Hynix's US$299 billion chip plan faces military base hurdle
    SK Hynix's proposed KRW400 trillion (approx. US$299 billion) semiconductor expansion in southwestern South Korea faces a major obstacle as the company races to increase memory production capacity: the planned manufacturing site includes military facilities used by US forces, complicating construction timelines as competition intensifies with Micron Technology and Chinese chipmakers.
    Monday 12 October 2026
    LG Display unveils maskless OLED technology, targeting more efficient IT displays
    LG Display has unveiled a new organic light-emitting diode (OLED) manufacturing technology designed to improve production efficiency and display performance, and reduce manufacturing costs as it prepares to expand into the information technology display market.
    Monday 12 October 2026
    Former iPhone display plant in Japan reportedly to enter AI chip supply chain
    A former iPhone display factory in Mobara, Japan, is set for a new role in the semiconductor supply chain, with Shinko Electric Industries planning to convert the site into a production base for semiconductor package substrates used in artificial intelligence (AI) applications.
    Monday 12 October 2026
    Kawasaki Heavy Industries bets JPY550 billion on physical AI, robotics
    Kawasaki Heavy Industries is betting on physical AI as part of a multibillion-dollar growth plan to modernize factories, address labor shortages, and expand robotics across shipbuilding, aerospace, and healthcare. The move signals how one of Japan's major industrial groups plans to compete in a global market where automation is increasingly central to productivity, resilience, and long-term growth.
    Monday 12 October 2026
    CXMT targets 2026 debut of 4F² DDR5 RDIMM in bid to challenge server DRAM rivals

    China's ChangXin Memory Technologies (CXMT) plans to introduce DDR5 registered DIMMs (RDIMMs) based on its new 4F² DRAM architecture by the end of 2026, advancing its efforts to increase memory density and compete in the higher-value server market.

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    Thursday 8 October 2026
    Edge-Cloud Computing Blocks Scams Before the Click
    Thursday 8 October 2026
    Dietary Therapy in Traditional Chinese Medicine and Modern Nutritional Science
    Wednesday 7 October 2026
    Chunghwa Telecom's Simplified Modular Data Center delivers fast turnkey deployment