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Sunday 12 April 2026
US expands tech curbs on China with MATCH Act and FCC testing ban proposal

US lawmakers from both parties have recently introduced a new bill aimed at further restricting China's access to advanced semiconductor manufacturing equipment. The move seeks to strengthen efforts to curb China's ambitions in semiconductor development and to achieve closer alignment with allies such as the Netherlands and Japan on export controls

Sunday 12 April 2026
China's Hwatsing ships 1,000th CMP system, targets advanced chip manufacturing growth

Hwatsing Technology has emerged as one of China's most prominent domestic suppliers of chemical mechanical planarization (CMP) equipment, a critical process step in advanced chip manufacturing

Sunday 12 April 2026
TSMC's Kumamoto impact drives Autopass one-stop mobile payment launch in Japan
As TSMC's entry into Kumamoto accelerates local industry, population, and tourism growth, Taiwanese smart mobility integrator Autopass announced on April 9, 2026, its plan to export integrated mobile and payment services to the Japanese market, starting with Kumamoto. The company aims to further expand across the entire Kyushu region
Sunday 12 April 2026
From modules to market: Chinese storage going global
As concerns over energy security converge with the push for low-carbon transition, energy storage has emerged as a central arena in the global energy shift—and China's companies are moving quickly to claim a larger role
Saturday 11 April 2026
DJI tops US$11bn, targets imaging leadership within 10 years

SZ DJI Technology founder Frank Wang gave his first interview to Chinese online media in a decade, outlining a shift behind the company's global leadership—from a product-driven model toward a dual focus on products and management

Saturday 11 April 2026
Samsung Exynos 2700 benchmark leak offers early look at 2nm SF2P performance
Samsung's next-generation mobile processor, the Exynos 2700, has appeared in early benchmark tests, offering one of the first real-world signals of how its second-generation 2nm process may perform ahead of mass production
Friday 10 April 2026
Cmsemicon seeks suppliers to expand MCU production as supply tightness remains primary limitation
Shenzhen China Micro Semicon (Cmsemicon) chairman and general manager Yang Yong announced that the microcontroller unit (MCU) market is gradually recovering and that prices are gradually rebounding. However, the main problem at present remains tight supply, he said during the company's 2025 annual results and dividends briefing held on April 9
Friday 10 April 2026
US expands China lab ban, testing orders shift to Taiwan
The US is moving to broaden restrictions on Chinese laboratories testing electronics, a step that could effectively exclude a large portion of China's testing ecosystem if the proposal is approved
Friday 10 April 2026
South Korea targets 2035 i-SMR commercialization, Doosan Enerbility eyes global contract manufacturing lead
South Korea has been actively advancing the development of small modular reactor (SMR) technology in recent years. The government, together with Korea Hydro & Nuclear Power (KHNP), is moving forward with next-generation i-SMR standard design certification and site selection for the first plant. Private-sector player Doosan Enerbility is taking the lead in positioning itself in the global SMR contract manufacturing market, backed by its largest-ever order volume
Friday 10 April 2026
Analysis: Agent computers target next PC role, push AI compute to the edge
AI agents are moving beyond chat into execution, handling tasks, workflows, and decisions. That shift is giving rise to a new hardware category: the agent computer. Built for persistent, local AI operation with direct control over tools and data, it is emerging as a contender for the next core of personal computing
Friday 10 April 2026
SK Hynix M15X reportedly ramps early production
SK Hynix's M15X is widely viewed as the company's next-generation DRAM manufacturing hub in Cheongju, South Korea. Designed primarily to support high-bandwidth memory (HBM) output and advanced 1b DRAM production, the facility is built for AI-era workloads. Its exact status remains partially unconfirmed, but recent media reports point to early production activity and faster-than-expected equipment installation
Friday 10 April 2026
China's export controls spark 140x yttrium price surge, fueling chip equipment fears
Yttrium, a critical rare earth element used in semiconductor manufacturing equipment, has seen its global supply tighten sharply due to China's export restrictions, driving prices up about 140x within a year and raising concerns over impacts on the semiconductor, aerospace, and energy sectors
Friday 10 April 2026
China OSATs step up investment drive as AI demand lifts advanced packaging race

China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading players ramping investment to capture rising demand from AI, high-performance computing (HPC), and automotive electronics

Friday 10 April 2026
Spingence and Advantech accelerate AI edge deployment plans in South Korea manufacturing
In response to strong demand for data security and on-premises AI deployment within South Korea's manufacturing and semiconductor sectors, Taiwanese AI company Spingence Technology is aggressively expanding into the South Korean market starting this year through its enterprise edge large language model (LLM) platform, Edgestar
Friday 10 April 2026
Why South Korean panel makers see rising profits despite chip price inflation
Amid rising chip prices, the industry generally anticipates a downturn in the mobile phone and notebook markets in 2026. For South Korea's panel industry, however, optimism continues to emerge. Analysts have pointed out that as demand for lower-end products continues to shrink, the overall end-user market is gradually consolidating toward high-end products. This puts South Korean manufacturers, which have long cultivated the high-end panel market, on a path to robust performance and resilience