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Tuesday 28 July 2026
Samsung eyes Chinese DRAM sourcing to cut costs, expand budget-phone share in China
Samsung Electronics is evaluating the use of lower-cost Chinese DRAM in some smartphones as it seeks to offset rising component costs and regain momentum in China's highly competitive budget handset market.
Tuesday 28 July 2026
SK Hynix's HBM paradox: DDR5 surge builds leverage for HBM4 price hikes

AI spending is broadening the memory upcycle beyond high-bandwidth memory, lifting prices for conventional DRAM, NAND flash and enterprise SSDs while reshaping earnings at SK Hynix and Samsung Electronics.

Tuesday 28 July 2026
LG wins Nvidia certification for 600kW CDU and lands North America data center project
LG Electronics said on July 27 that its 600kW coolant distribution unit has received Nvidia certification after passing more than 100 standardized AI factory technology validations. The company also said it recently secured cooling projects for a North America hyperscale cloud service provider and the Sinar Mas data center in Jakarta, Indonesia.
Tuesday 28 July 2026
Anthropic seeks SK Hynix supply for AI chips, SK chair says

Anthropic has asked SK Hynix to help supply chips for its own in-house AI chip production, SK Group chairman Chey Tae-won said. He made the remarks at a recent AI summit in San Francisco, where he also disclosed that South Korea's three new investment plans in semiconductor expansion, AI data centers and physical AI would total more than US$3 trillion.

Tuesday 28 July 2026
China reportedly starts making homegrown DUV chipmaking tools; threatens ASML's stranglehold on semiconductor equipment
China has begun manufacturing domestically developed immersion deep ultraviolet lithography machines, a potential turning point in its effort to build a self-sufficient semiconductor industry free from Western equipment controls.
Tuesday 28 July 2026
Samsung, SK Hynix race to secure chipmaking tools before equipment lead times hit one year
Samsung Electronics and SK Hynix are considering placing semiconductor equipment orders earlier as a global wave of fab investment stretches delivery times for key chipmaking tools to as much as twice their previous levels.
Tuesday 28 July 2026
China display giant BOE rejects low-price race, turns to innovation to lift panel value
BOE, the world's largest display-panel maker and one of China's leading technology companies, is moving away from low-price competition and plans to raise the value of Chinese display products through technological innovation.
Tuesday 28 July 2026
Moonshot AI opens Kimi K3 weights, challenging US closed-model economics

Moonshot AI officially released the model weights for its Kimi K3 large language model on July 27, allowing developers to download, fine-tune, and deploy it.

Tuesday 28 July 2026
From models to chips: Anthropic chip ambitions pull Korea deeper into the AI silicon race
The push toward deeper sovereign control over the critical hardware stack underpinning AI models is gaining traction following news of Anthropic's outreach to SK hynix for supplies related to producing its own chips, spanning early design planning and key component procurement.
Tuesday 28 July 2026
EYEQ Lab completes 200mm SiC line validation with yield above 90%

South Korean power semiconductor maker EYEQ Lab has completed mass-production validation of its dedicated 8-inch, or 200mm, silicon carbide (SiC) line in Busan, achieving an average yield above 90%, ET News reported, citing industry sources.

Tuesday 28 July 2026
Energy storage unicorn expands in Baotou as China's industry chain accelerates integration
Inner Mongolia HyperStrong Technology is a major production subsidiary established by Beijing HyperStrong Technology in Baotou, Inner Mongolia. Its development offers a useful case study as competition intensifies among China's battery energy storage system integrators.
Tuesday 28 July 2026
China's Yunnan Germanium wins long-term InP wafer order as AI optical demand rises
Yunnan Germanium has secured a major supply deal for indium phosphide (InP) wafers, underscoring how AI data center buildouts are reshaping global demand for high-speed optical parts. The contract could bolster the company's revenue base, but execution risks, capacity expansion, and market swings will determine how much benefit reaches investors and customers worldwide.
Tuesday 28 July 2026
China faces AI compute divide as advanced capacity falls short and lower-tier resources sit underused
China's AI computing infrastructure is developing along two sharply divergent paths. As large language models and AI agents gain traction across industries, rapidly rising token consumption is driving shortages of advanced computing capacity. At the same time, portions of the country's installed lower- and mid-tier capacity remain underutilized because of software compatibility issues, weak coordination between supply and demand, and inadequate resource scheduling.
Monday 27 July 2026
South Korea, AMD team up to integrate homegrown NPUs with CPUs and GPUs
South Korea and AMD have agreed to build and demonstrate heterogeneous AI computing infrastructure integrating AMD CPUs and GPUs with homegrown neural processing units, as Seoul seeks to give its AI chip industry practical reference models and a path into the global AI computing supply chain.
Monday 27 July 2026
Samsung converts AMD and OpenAI ties into HBM4 supply wins

Samsung Electronics is showing renewed momentum in the AI memory race as it deepens ties with both OpenAI and AMD, two partnerships that could strengthen its position in the next-generation HBM4 ecosystem after ceding early ground in AI memory to rival SK hynix.