The US and China are preparing to hold their first official artificial intelligence (AI) dialogue under President Donald Trump, a notable diplomatic milestone after years of escalating technology tensions. Yet the significance of the meeting lies less in whether it produces tangible agreements than in what it reveals about how both countries increasingly view AI: not as another fast-growing industry, but as strategic infrastructure requiring tighter state oversight and national control, according to Reuters.
LG Electronics plans to stop production at its Huizhou plant in China after October, ending manufacturing at the group's first production subsidiary in the country after more than three decades.
Chinese chip designer GigaDevice is investing another CNY500 million (approx. US$73.9 million) into its wholly owned subsidiary to support its DRAM research and industrialization project, continuing a series of capital injections aimed at expanding its memory business.
Chinese semiconductor equipment suppliers are beginning to secure production orders for through-glass via (TGV) manufacturing tools, marking a shift from prototype validation toward commercial deployment as the industry moves to develop glass substrates for next-generation AI chip packaging.
Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip sample with Shanghai Xianfeng Technology using glass-based Chip-on-Panel-on-Substrate (CoPoS) panel-level advanced packaging.
Chinese GPU developer Biren Technology unveiled a next-generation near-packaged optics (NPO) super node at the World Artificial Intelligence Conference (WAIC) 2026, targeting the growing computing demands of large language models and AI agents.
China is considering tighter export controls on artificial intelligence and semiconductor technologies amid intensifying competition with the US in frontier AI. The proposed measures, reported by Financial Times, would also target overseas acquisitions of advanced technology startups and could appear in the next revision of Beijing's export control catalogue.
Haesung DS has reportedly added China's CXMT as a customer for DDR5 package substrates as the South Korean supplier expands its DDR5 business and considers panel-based production for higher-layer-count products for the DDR6 generation.
Ishihara Sangyo Kaisha plans to double production capacity for high-purity titanium dioxide used to make dielectric materials for multilayer ceramic capacitors, as rising AI server power requirements increase demand for the components.
China's exports of rare-earth permanent magnets reached record levels in the first half of 2026, yet the same customs data reveal a market increasingly shaped less by demand than by Beijing's discretion — flowing freely to most of the world, throttled to the US, and, since January, newly restricted to Japan.
