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Monday 8 June 2026
Nvidia, SK Telecom plan gigawatt-scale AI cloud in Korea
According to Nvidia's press release, SK Telecom plans to build a gigawatt-scale AI cloud in Korea, with the first AI factory set to go online in 2027. The project signals how telecom operators may evolve into global AI infrastructure providers, shaping access to computing capacity, energy use, and industrial AI deployment
Monday 8 June 2026
KT Cloud speeds AI data center builds with modular construction and digital twin ops
KT Cloud is accelerating its artificial intelligence data center rollout in South Korea with modular construction, alternative power sourcing, and a digital twin operations platform. The move highlights how long permitting timelines, grid limits, and evolving GPU demands could shape AI infrastructure availability for users far beyond Korea
Sunday 7 June 2026
South Korea data center market to hit KRW11T by 2029
South Korea's private data center market is set to expand rapidly as generative AI demand drives a global investment boom, with AI infrastructure, power supply, geographic dispersion, and data sovereignty reshaping the industry's development path. Jong-hyun Shin, a researcher at the Korea Data Center Council (KDCC), said 2028 is expected to be the peak year for data centers finishing construction
Sunday 7 June 2026
JCET opens 3D packaging plant to target AI power modules, CPO demand
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing, power modules, and next-generation data centers
Sunday 7 June 2026
BOE says glass-based packaging substrate pilot line has yet to reach mass-production yield

BOE Technology Group's push into glass-based packaging substrates remains short of mass production, even as the Chinese display maker expands into new materials and advanced display technologies to build growth beyond conventional panels

Sunday 7 June 2026
Japan injects JPY150B into Rapidus to push for 2nm production by 2027
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus, the national semiconductor champion formed to commercialize advanced node chips, to fund plant construction, equipment and research for 2nm and 1.4nm chips. The funding was executed through the Information-Technology Promotion Agency, according to reports by Nikkei and Reuters
Sunday 7 June 2026
China’s space-computing push draws chipmakers, satellite firms, and rocket companies

As artificial intelligence drives an insatiable demand for computing power, China is beginning to look beyond terrestrial data centers and edge computing toward a new frontier: space

Saturday 6 June 2026
AI demand squeezes mainstream DRAM supply as DDR5, DDR4 prices rise

DRAM prices are climbing as Samsung Electronics, SK Hynix, and Micron Technology prioritize high-bandwidth memory, or HBM, for AI applications, tightening supply of mainstream DDR5 and DDR4 products used in PCs, servers, and other electronics, according to Nikkei

Friday 5 June 2026
OECD data show China-based semiconductor makers receive outsized industrial support
Industrial subsidies reached their highest level since the global financial crisis in 2023 and 2024, according to a June 2026 OECD release based on its new MAGIC database of industrial subsidies. The database tracks support received by 525 of the world's largest manufacturing groups across 15 industrial sectors from 2005 to 2024
Friday 5 June 2026
FADU wins new contracts as AI workloads reshape data storage
As artificial intelligence (AI) workloads place unprecedented demands on data storage systems, South Korean SSD controller designer FADU is betting that next-generation storage architecture will become a critical battleground in the AI infrastructure race
Friday 5 June 2026
Alibaba opens Qwen to KFC, Luckin Coffee, and airlines in AI agent battle
Alibaba is opening its Qwen AI assistant to external brands and third-party agents, turning the consumer app from a chatbot into a transactional platform for food orders, travel planning, and other everyday services
Friday 5 June 2026
Nexchip carves out BGBM assets to back Wuhu wafer project, refocuses on 12-inch foundry business
Nexchip Semiconductor plans to carve out its BGBM business by contributing specialised equipment assets to Anhui Ruijing Semiconductor, a newly established power device wafer-processing venture in Wuhu, Anhui Province, as the Chinese foundry seeks to focus capital and management resources on its core 12-inch wafer foundry platforms
Friday 5 June 2026
US targets China's PCB grip as AI and defense supply risks mount
As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed circuit boards (PCBs), which sit beneath chips and connect critical electronics, are increasingly being viewed by the US government and defense sector as a supply chain risk
Friday 5 June 2026
Jiin Ming debuts Raven remote controller at Japan Drone 2026
Taiwanese firm Jiin Ming Industry unveiled its self-developed JMG flight remote controller — Raven — at the Japan Drone 2026 exhibition, marking the first time the company has showcased an in-house flight remote controller at an international trade show. The debut highlights its technological progress in drone control systems
Friday 5 June 2026
South Korea finalizes US$520 million on-device AI chip budget amid industry doubts
South Korea has finalized the budget for a state-backed on-device AI chip development project at KRW800.23 billion (US$520 million), about KRW200 billion below an earlier proposal, as industry concerns persist over whether the chips developed under the program will reach commercial products, according to The Elec