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Wednesday 16 September 2026
Analysis: Jensen Huang is in Trump's ear; what it means for Taiwan's chip supply chain
"The narrative is much more practical," Nvidia CEO Jensen Huang said of China's approach to artificial intelligence (AI) at the All-In Summit 2026, contrasting it with US warnings about AI bringing civilization to an end.
Wednesday 16 September 2026
Taiwan, South Korea should stop comparing, says DIGITIMES chairman

As global AI investment continues to expand and US-China geopolitical pressure intensifies, how Taiwan and South Korea can preserve their semiconductor and manufacturing advantages has become a focal point. DIGITIMES and IC975 chairman Colley Hwang said the two sides should look for complementary strengths, work together to help Vietnam, Malaysia, and other countries develop, and first increase corporate exchanges to build a positive environment for cooperation.

Wednesday 16 September 2026
Nvidia's Jensen Huang expected to attend Trump-Xi Summit as tech and trade take center stage
US President Donald Trump and Chinese President Xi Jinping are scheduled to meet on September 24 in Washington for a state dinner now dubbed the "G2 Summit". The meeting follows a turbulent economic period marked by an April 2025 tariff surge where both nations raised levies above 100% before reaching a temporary stalemate. Alongside traditional trade discussions and potential climate change or pandemic prevention talks, technology leadership, export controls, and regulatory frameworks are set to dominate the agenda.
Wednesday 16 September 2026
EV batteries cannot simply power humanoid robots, with energy density and costs posing key hurdles
Power battery technology has reached maturity in the new energy vehicle (NEV) market, but transferring it to humanoid robots presents two major barriers: the need for significant technological upgrades and the difficulty of spreading costs across a market characterized by low-volume, highly customized demand.
Wednesday 16 September 2026
SK Hynix union approves revised pay deal after 25-vote rejection

SK Hynix's production workers' union has approved a revised pay agreement that raises the cash share of employee profit-sharing bonuses, ending weeks of uncertainty after members rejected the previous proposal by just 25 votes.

Wednesday 16 September 2026
SK Hynix, Intel in talks on US production to ease memory crunch
SK Hynix is in talks with Intel about a potential deal that could give the South Korean company its first memory chip manufacturing operation in the US, as tight supply pushes customers and governments to secure more domestic capacity.
Wednesday 16 September 2026
Apple reportedly accepts Samsung's 1Q27 memory hike, raising the 2027 smartphone cost floor
Apple's acceptance of sharply higher Samsung Electronics memory prices for early 2027 is putting a number on the cost of the AI boom for smartphones. The reported agreement comes just days after Apple limited the iPhone 18 Pro price increase to US$100, highlighting its willingness to absorb part of a historic rise in memory costs to defend shipments and market position.
Wednesday 16 September 2026
Hanmi Semiconductor reportedly lands first back-end foothold at Terafab
Hanmi Semiconductor has reportedly secured an order to supply advanced packaging equipment to Elon Musk's Terafab, marking the first known entry by a South Korean back-end equipment supplier into the planned US semiconductor megaproject.
Wednesday 16 September 2026
Huawei reportedly scales back AITO role as Seres takes greater control
Huawei and Seres, a Chongqing-based premium manufacturer of high-end electric NEVs, are reportedly adjusting their smart vehicle partnership in the AITO brand. Huawei would shift toward a more asset-light role, and Seres would take greater control over AITO's product, marketing, sales, and service operations.
Wednesday 16 September 2026
Apple, Intel links sharpen focus on Lens Technology's next glass growth markets
Lens Technology is pushing its precision-glass expertise into two higher-value markets that could reshape its growth profile: Apple-linked foldable devices and Intel-linked through-glass-via (TGV) substrates.
Wednesday 16 September 2026
Commentary: China's US$4.5 trillion electronics target confronts the limits of manufacturing scale

Where will China's electronics manufacturing industry find growth over the next five years? The answer is taking shape in the 15th Five-Year Plan for the sector, released by the Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC): industry revenue is targeted to exceed CNY30 trillion (US$4.47 trillion) by 2030.

Wednesday 16 September 2026
South Korean NPU startups face validation hurdle in push for global sales

South Korea's neural processing unit (NPU) startups are moving from chip development toward commercial deployment, but limited experience operating at scale remains a major hurdle to winning global customers.

Wednesday 16 September 2026
China's humanoid robot race, Part 2: Upstream profits gather around dexterous hands
Humanoid robot makers are cutting prices and scaling production, yet much of the industry remains unprofitable. Upstream suppliers are starting to show a different economics — especially in dexterous robotic hands.
Wednesday 16 September 2026
DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with the HBM4E generation, a move that could reduce its reliance on TSMC and give the memory maker greater supply and cost flexibility.

Tuesday 15 September 2026
Tesla's rare-earth-free Cybercab challenges China's grip on EV magnets
With Tesla's EV ambitions growing amid a years-long push toward full electrification, the deployment of the Cybercab has emerged as a major experiment testing the boundaries of autonomous driving.