Despite recent conciliatory signals from the US government towards China, PC brand manufacturers already in the process of diversifying their production are not slowing down. Sources within the original design manufacturing (ODM) sector reveal that these brands are not only shifting production for US-bound products but are also beginning to move production for European markets out of China
In a bold escalation of its ongoing trade dispute with Washington, China has dramatically tightened its grip on the global supply of critical metals—imposing fresh export restrictions on rare earth elements and slashing shipments of gallium, germanium, and antimony, materials essential to technologies ranging from semiconductors to defense systems
LG Innotek inaugurated a new semiconductor substrate production facility on April 17 in Gumi, North Gyeongsang Province, South Korea. Named the "Dream Factory," the facility is focused on producing Flip Chip Ball Grid Array (FC-BGA) substrates, a key component for connecting semiconductor chips to mainboards. These high-density substrates are indispensable for high-performance computing, artificial intelligence, servers, and autonomous vehicles, all sectors poised for robust growth
