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Tuesday 29 September 2026
DeepSeek paper says AI agents are learning reward hacking during training
DeepSeek founder Wen-Feng Liang's latest paper says AI agents are already learning to exploit system loopholes and bypass intended problem-solving methods during training, underscoring a new challenge for model development: how to stop models from taking shortcuts.
Monday 28 September 2026
South Korea's HBM-linked exports surge as Taiwan, Malaysia emerge as high-value destinations

South Korea's exports of the customs category that carries high-bandwidth memory (HBM) are no longer a two-destination story. Unit-value data show that the chips going to Taiwan and Malaysia are worth several times more per kilogram than those shipped to Hong Kong, China, or Vietnam. That points to a two-tier trade, with premium stacked memory heading to advanced packaging lines and cheaper multichip parts going to transit hubs and lower-unit-value destinations.

Monday 28 September 2026
China's Micro Han Xin code takes aim at Data Matrix in semiconductor traceability

China is trying to carve out a foothold in semiconductor supply-chain standards with Micro Han Xin, a miniaturized version of its home-grown barcode designed for chips and other components too small for conventional labels.

Monday 28 September 2026
Beyond ASML: China rethinks EUV race with light-source strategy
China is trying to broaden the definition of the extreme ultraviolet (EUV) race. Rather than focusing only on building a domestic equivalent to ASML's lithography platform, Chinese researchers are exploring alternative EUV light sources that could improve energy efficiency, support semiconductor metrology and eventually provide new options for advanced lithography.
Sunday 27 September 2026
Beijing escalates domestic chip drive with Broadcom audits

China is intensifying its push to replace foreign technology across critical computing infrastructure, targeting high-speed networking hardware alongside foreign AI accelerators.

Sunday 27 September 2026
South Korea's 300mm research gap: Daejeon pitches an open fab as a US$1.46 billion fix
Daejeon is seeking to build a roughly KRW2 trillion (approx. US$1.46 billion) national semiconductor research hub centered on an open 300mm manufacturing and demonstration fab, aiming to fill a gap between South Korea's research infrastructure and its large commercial chipmaking base.
Sunday 27 September 2026
Chinese automakers tighten control over supply chains as margins shrink

Chinese automakers are reshaping how they build, source, and sell vehicles as profits come under pressure, a shift with implications for suppliers, buyers, and global car markets. Industry moves toward in-house technology, tighter payment rules, and new supplier roles suggest a broader effort to capture more value across the automotive chain.

Saturday 26 September 2026
DIGITIMES Insight: China's memory makers seek scale, funding to close the gap with global leaders

China's two leading memory suppliers are moving to raise capital and expand output as demand for chips grows, a shift that could reshape the country's domestic supply chain. Their efforts reflect a new stage for the sector, but the long-term test will be whether fresh funding can translate into stronger technology, higher yields, and wider customer adoption.

Saturday 26 September 2026
Interview: Taiwan's H2U helps companies manage employee health with AI, eyes third markets with South Korea
When companies discuss ESG, they often emphasize environmental issues and compliance while paying less attention to employee health, a key component of the social dimension, according to Saxon Chen, founder and CEO of Taiwanese digital health technology company H2U Corp.
Saturday 26 September 2026
Samsung foundry recovery gains pace, but 2nm, Taylor fab remain hurdles

Samsung Electronics' foundry recovery is gaining pace as higher utilization, firmer pricing, and stronger advanced-node demand improve earnings, but a sustained return to profit will depend on 2nm yields and how quickly its Taylor fab in Texas ramps production.

Friday 25 September 2026
Trump, Xi back AI talks as hotline details remain unclear
The US and China have brought artificial intelligence into their bilateral economic dialogue and received leader-level backing to continue talks. Still, details of an AI safety hotline described by US officials remain unclear after US President Donald Trump and Chinese President Xi Jinping met in Washington.
Friday 25 September 2026
Samsung, SK Hynix in the running for PS6 GDDR7 orders
Samsung Electronics and SK Hynix are reportedly in the running to supply 24Gb GDDR7 memory for Sony's next-generation PlayStation, as tight memory supply complicates planning for the Japanese company's next hardware platform.
Friday 25 September 2026
BOE supplies panel for LG's 5K Mini LED gaming monitor
China's BOE is supplying the panel for LG Electronics' 27-inch UltraGear evo 27GM950B, putting the display maker's technology in one of LG's premium gaming monitors as BOE expands its push into higher-resolution and ultra-high-refresh-rate displays.
Friday 25 September 2026
China's autonomous-driving suppliers confront the limits of software moats

Chinese autonomous-driving software specialist Momenta posted a strong first-half performance, with gross margin reaching 73.2% and adjusted net loss narrowing by about 97%. Yet despite the sharp financial improvement, doubts remain over its longer-term prospects. Supply-chain sources say that as intelligent-driving technology matures, strong software algorithms alone may no longer be enough to build a durable competitive moat.

Thursday 24 September 2026
CXMT gains ground in DRAM as Samsung, SK Hynix shift more capacity to HBM
China's ChangXin Memory Technologies (CXMT) is gaining ground in the global DRAM market as Samsung Electronics and SK Hynix allocate more production capacity to high-bandwidth memory (HBM), tightening conventional memory supply and giving the Chinese supplier more room to expand without competing primarily on price.