CONNECT WITH US
Tuesday 9 December 2025
Baidu evaluates Kunlun chip spin-off for Hong Kong IPO, but offers no guarantee
Baidu has responded to reports that its in-house chip business, Kunlunxin, is planning a separate listing on the Hong Kong Stock Exchange by stating it is currently evaluating the possibility, but does not guarantee the move will proceed
Tuesday 9 December 2025
Moore Threads CEO leverages Nvidia legacy to challenge GPU giant
In a global GPU market dominated by US-based Nvidia, Chinese startup Moore Threads is rapidly emerging as a formidable local challenger. The driving force behind this bold counterattack is founder and CEO Jianzhong Zhang, whose 14-year career at Nvidia adds another dimension to the company's strategy
Tuesday 9 December 2025
Samsung moves to narrow gap with TSMC as silicon photonics race heats up
Samsung Electronics is accelerating development of silicon photonics (SiPh) technology in an effort to solve bottlenecks in advanced AI processors and narrow the competitive gap with TSMC. The company is expanding its global research network and targeting the commercialization of co-packaged optics in 2027. Industry sources say that the timeline will mark the beginning of direct competition with its Taiwanese rival in next-generation packaging
Tuesday 9 December 2025
Analysis: Why isn't Huawei trying to win the tech war?
Huawei founder Ren Zhengfei recently gave a public talk at the Huawei Lianqiuhu R&D Center in Shanghai. He shared insights on AI, quantum computing, computing power, and chips. He also answered questions from domestic and foreign researchers about the US-China tech competition
Monday 8 December 2025
SK Hynix restructures global operations amid reported HBM4 production delay
SK Hynix announced a comprehensive organizational restructuring to expand its global research network and reinforce its leadership in the high-bandwidth memory sector. The strategic shift comes as a ZDNet Korea report indicates the South Korean chipmaker may postpone mass production of its next-generation HBM4 chips due to timeline changes for Nvidia's Rubin AI accelerators
Monday 8 December 2025
Commentary: Moore Threads' record IPO echoes Cambricon's trajectory as investors bet on unproven profitability
Chinese GPU startup Moore Threads debuted on the STAR Market on December 5, 2025, with its opening price soaring to CNY650 (US$91.94) per share—a staggering 468.78% increase—pushing its market capitalization beyond CNY300 billion at one point
Monday 8 December 2025
Research Insight: 800V systems, LiDAR, and multi-screen cabins dominate China's 2025 models

The 2025 Guangzhou International Automobile Exhibition concluded on Nov. 30, offering one of the clearest snapshots yet of where China's auto market is headed. After an on-site review of the show, DIGITIMES identified three defining trends for China's 2025 model-year vehicles: the rise of 800V high-voltage architectures, the rapid adoption of roof-mounted front LiDAR, and the emergence of multi-screen cabins. Together, these features are becoming essential for any carmaker hoping to compete in the world's largest auto market

Monday 8 December 2025
3Q25 global top 20 EMS/ODM rankings: Chinese firms shift to automotive electronics and AI servers
The global electronics manufacturing services (EMS) and original design manufacturing (ODM) supply chain experienced many structural changes during the third quarter of 2025. In the face of generative AI competition and geopolitical pressure, the global supply chain has been reshaped. For China's electronics manufacturers, this shift is a transformation from "Made in China" to becoming global manufacturing service providers
Monday 8 December 2025
Samsung reportedly gains momentum in foundry and memory with improved 4nm yields
Samsung Electronics is reportedly gaining momentum across its foundry and memory operations as higher yields on its 4nm process and a broad recovery in DRAM demand position the company for a strong finish to 2025. South Korean analysts expect operating profit to reach as much as KRW19 trillion (US$13 billion) in the fourth quarter of 2025, significantly above market expectations
Monday 8 December 2025
Geopolitics push AI chip packaging into Taiwan-US duopoly
Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip packaging capacity will consolidate around two critical hubs: Taiwan and the United States. The key beneficiaries are expected to be ASE Holdings and Siliconware Precision Industries (SPIL) in Taiwan, and Amkor Technology in the US and South Korea
Monday 8 December 2025
Tesla mounts late-2025 China comeback as Europe sales crater
Tesla, the world's leading electric-vehicle maker, mounted a striking late-2025 comeback in China's battery-electric market — a rebound that stands in sharp contrast to the company's sharp downturn in Europe and underscores the growing complexity of its global strategy
Monday 8 December 2025
China expected to surpass Taiwan as second-largest IC design revenue generator by 2026, IDC forecasts
According to IDC's latest forecast, released on December 5, 2025, China is expected to overtake Taiwan, accounting for the world's second-largest integrated circuit (IC) design revenue starting in 2026. The shift is attributed to China's aggressive pursuit of chip demand autonomy and the rapid emergence of domestic startups focused on edge computing and AIoT markets
Monday 8 December 2025
Weekly news roundup: TSMC veteran's Intel move sparks debate, Samsung reportedly secures TPU HBM4 nod, Korean memory firms tighten supply as DRAM prices surge
These are the most-read DIGITIMES Asia stories in the week of December 1 to December 7, 2025
Monday 8 December 2025
Auto supply chains face stricter demand for non-Chinese standards
As geopolitical tensions between China and multiple countries intensify alongside China's aggressive expansion into overseas automotive markets, supply chain players reveal that customer demands for non-Chinese standards are becoming increasingly stringent. At the same time, more brand vendors require local production, testing suppliers' capabilities, of expanding their global footprints. Clearly, supply chain players need multiple approaches to address current challenges
Monday 8 December 2025
Schmidt says China’s AI ascent is losing lift as capital thins—but the real bubble, he argues, is in doubting AI
Eric Schmidt, former Google CEO, has warned that China may fall behind the US in artificial intelligence (AI) development due to restricted access to funding. Speaking at a Harvard Kennedy School forum, Schmidt argued that the market currently underestimates AI's potential economic impact and dismissed notions of an AI investment bubble