China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly remained around 25%, highlighting the difficulty of translating its progress in conventional DRAM into high-performance AI memory.
China's next-generation communications push is beginning to reveal a broader ambition than simply putting faster wireless connections into future smartphones.
Apple's expected first foldable iPhone is set to channel a significant share of its component value to South Korean suppliers, with Samsung Display (SDC), LG Innotek, Samsung Electro-Mechanics (Semco), Samsung Electronics, and SK Hynix securing positions across displays, cameras, substrates, passive components, and memory.