中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Intel
Nvidia
Meet the Analysts
Server EMS Tracker
Robotics Report
AI Server Report
SCMP Bundle
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
China's NSIG to absorb loss-making wafer subsidiaries in US$967M restructuring
Semiconductors
2min ago
YMTC launched third phase with hubei state capital support, no big fund stake
Tomorrow's Headlines
Sep 9, 18:37
Military and semiconductor sectors boost IPC growth momentum
Tomorrow's Headlines
Sep 9, 18:36
YMTC decade-long journey highlights the evolution of China tech sovereignty
Tomorrow's Headlines
Sep 9, 18:36
Sep 10, 06:46
Apple launches iPhone 17 Pro, Pro Max and thinnest-ever Air with new A19 Pro chip
Sep 10, 06:57
NXP taps former TI China chief to steer Greater China amid rising competition
Sep 10, 06:58
Advanced packaging battle intensifies as foundry, OSAT, and PCB sectors enter tripartite era
Sep 10, 06:58
Immigration crackdown exposes labor and capacity risks in US auto industry
Sep 10, 06:56
Taiwan pushes immersion cooling, CoWoS tech into US AI server supply chain
LATEST STORIES
7 days news
SEMICON Taiwan 2025: Memory giants compete in customized HBM race amid AI surge
Sep 10, 10:55
SEMICONDUCTORS
Nvidia unveils Rubin CPX GPU for massive-context AI, available end 2026
Sep 10, 10:48
SEMICONDUCTORS
AI chip demand drives future semiconductor growth trends
Sep 10, 10:41
ICT
OpenAI reportedly in talks to bring US$500 billion Stargate project to India, sparking data center expansion
Sep 10, 10:37
SOUTH ASIA
FOPLP progress is fastest in foundries, slower in testing and panel fabs
Compal partners with ZutaCore to redefine AI server cooling with waterless direct liquid technology
AI infrastructure investment may enter adjustment phase in 2026, with small-and medium-sized business demand driving new momentum
Switzerland launches open-source AI model Apertus developed by top research institutes
AI guru warns superintelligence could endanger humanity; praises China's AI governance
Global demand for 100-inch class TVs surges due to favorable timing and conditions
China AI surge with 5,000 firms and 788 EFLOPS capacity, yet supply-demand mismatch persists
DDI supply chain shakeup for Apple's iPhone puts LX Semicon at risk
Tesla to open new research and development center in Kopenick, Berlin
TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
Five years on, Taiwan's G2C positions local equipment makers at center of AI packaging shift
Anli posts third-highest revenue in August 2025, returns to profitability
Kemflo International expands into activated carbon regeneration for semiconductor industry
Czech Minister of Research and Innovation visits Taiwan; NSTC highlights complementary technologies
Microsoft signs US$19.4 billion deal with Nebius amid surging AI cloud demands
Kakao to integrate ChatGPT into KakaoTalk in strategic partnership with OpenAI
Dell reportedly initiates third round of China layoffs, impacting Shanghai and Xiamen
RongSemi denies fab halt as YMTC Veteran takes key role in Ningbo expansion
Lianyou Metals lists on Taiwan exchange, expands cobalt output amid tungsten supply squeeze
Malaysian IC design house Oppstar and Inventec to develop AI chips together
Asia-Pacific countries lead in AI application despite lagging in development, studies show
Khgears sees robot business drive record high revenue in first eight months of 2025
LG Electronics India expected to launch IPO in October 2025
Samsung Electronics sees growth in Taiwan despite market challenges
Chip, cloud, and AI firms unite to break Nvidia's stranglehold
Over 50 Taiwan IC design houses compete for govt subsidies
BIZ FOCUS
Sep 9, 12:48
Meet ADLINK's cExpress-R8: The compact solution to demanding and diverse industrial workloads
Tuesday 2 September 2025
Building the Foundation of Trust: Achieving ISO/SAE 21434 Compliance in Automotive Systems Using Sec
Tuesday 9 September 2025
PBA released their latest nano-precision dual gantry stage platform series for heterogeneous semiconductor advanced packaging and metrology equipment
Monday 8 September 2025
Holtek launches its new electric two-wheeler solution; drives green travel innovation
MOST-READ
Samsung-Nvidia CEO embrace hints at HBM4 deal amid Seoul's U$150B US pledge
TSMC to raise foundry prices by 5-10% across advanced nodes in 2026
Inside TSMC's 2nm leak involving TEL: How a job application became an international incident
CoWoP packaging takes on TSMC’s CoWoS, pressures CoPoS in AI chips
China's YMTC moves into DRAM, teams with CXMT to target HBM market
AMD CEO calls export controls noise, reveals counter-strategy
Exclusive: NAND flash rally gains steam with SanDisk's 10% price hike
MULTIMEDIA
France makes the case for Foxconn in its chip strategy
Tech Forum 2025
With SEMICON Taiwan 2025 about to start, DIGITIMES held an exclusive Tech Forum on September 4.
Tech Forum 2025: Global smartphone market plateaus as Apple and Samsung bet on chips and ecosystems
Tech Forum 2025: US-based server assembly surges as Taiwan's EMS leaders navigate rising costs and trade uncertainties
Tech Forum 2025: AI-semiconductor convergence will double global market to US$2 trillion by 2040, says Etron chair
...More
EV
Tuesday 9 September 2025
CATL unveils Shenxing Pro battery, expands EU capacity with US$8.6 billion Hungary plant
Tesla to open new research and development center in Kopenick, Berlin
Tuesday 9 September 2025
VinFast enters India with locally made EVs as first foreign pure-play manufacturer
Tuesday 9 September 2025
Research Insights: Global auto market forms multi-track pattern
Tuesday 9 September 2025
TECH
Tuesday 9 September 2025
TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
Nvidia CEO's third Taiwan trip in 2025: talk H20, US govt stake and visits TSMC
Friday 22 August 2025
DDI supply chain shakeup for Apple's iPhone puts LX Semicon at risk
Tuesday 9 September 2025
Tesla to open new research and development center in Kopenick, Berlin
Tuesday 9 September 2025
ASIA
Tuesday 9 September 2025
DDI supply chain shakeup for Apple's iPhone puts LX Semicon at risk
Kakao to integrate ChatGPT into KakaoTalk in strategic partnership with OpenAI
Tuesday 9 September 2025
Dell reportedly initiates third round of China layoffs, impacting Shanghai and Xiamen
Tuesday 9 September 2025
Malaysian IC design house Oppstar and Inventec to develop AI chips together
Tuesday 9 September 2025
OPINIONS
Friday 5 September 2025
Commentary: As Trump heightens global tensions, Taiwan needs to consider industrial policy responses
Commentary: Advanced AI packaging driving semiconductor industry toward 'virtual integration'
Friday 5 September 2025
Analysis: BOE supplies over 40M OLED panels for iPhone, testing supply chain management
Friday 5 September 2025
Commentary: YMTC's 3D DRAM push challenges CXMT and global memory leaders
Thursday 4 September 2025
TOPICS
TECH FORUM 2025
EMS WATCH
GEOWATCH
TSMC UPDATES
SPECIAL REPORTS
Monday 8 September 2025
Global automotive panel shipments, 2025
The shipment share of 9-inch and above center console panels surpassed 70% for the first time in 2025, driving the proportion of 9-inch and above automotive displays to 58.8%.
Wednesday 3 September 2025
Global smartphone, 2Q 2025
Global smartphone shipments reached 292.5 million units in the second quarter of 2025, and shipments are estimated to decrease by 0.4% year-over-year in the third quarter.
Friday 29 August 2025
Notebook shipment update, July 2025
Due to strong shipment momentum in the second quarter of 2025 and the off-season in the education market, the combined shipments of the top five notebook brands fell by as much as 28% month-over-month.
Monday 25 August 2025
AI investments of top-4 Chinese CSPs
Top-4 Chinese cloud service providers are expanding their investment in AI infrastructure, accelerating the promotion of AI hardware and software solutions with Chinese characteristics in 2025.
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first