中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
Electronica
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Apple
Huawei
Nvidia
AI Search
Scaling AI Glasses
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
Xiaomi-backed RISC-V chip designer Nuclei starts IPO process
Tomorrow's Headlines
6h 59min ago
Xpeng expands Turing chip from EVs into humanoid robots
Tomorrow's Headlines
6h 59min ago
Corning sees CPO and glass core as new semiconductor battlegrounds
Tomorrow's Headlines
6h 59min ago
China optical transceivers avoid US FCC curbs as NPO and CPO compete in high-speed links
Tomorrow's Headlines
6h 59min ago
China's AIDC token costs hinge on access to advanced GPUs
Tomorrow's Headlines
6h 59min ago
Sep 14
DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker
Sep 14
Behind the BRICS handshake: How far can the China-India reset go?
Sep 14
Samsung, SK Hynix reject US$19 billion power prepayment as Korea speeds chip expansion
Sep 14
China optical firms target photonics with mixed high-end, lower-cost push
Sep 14
China accelerates e-SIM's leap from wearables to smartphones
LATEST STORIES
7 days news
The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips
Sep 15, 00:09
SEMICONDUCTORS
Taiwan drone maker Twoway breaks into US defense supply chain with Oklahoma procurement deal
Sep 14
AEROSPACE
Yole Group takes outside capital for the first time, selling minority stake to new French fund
Sep 14
SEMICONDUCTORS
Fujitsu's Monaka targets 2027 mass production with TSMC 2nm boost
Sep 14
SEMICONDUCTORS
AI demand lifts UMC, VIS, PSMC revenue
DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
DIGITIMES Insight: China's GaN challengers are no longer playing catch-up
Beijing municipality bans civilian drones starting mid-November
Australia sets LNG reserve rules to protect domestic supply and cap prices
Kokusai Electric gains from Hitachi split as AI memory demand surges
LG sells 15 US image patents to Honor as IP monetization expands
UAE commits EUR40B to expand Germany ties in AI, energy and defense
AI power demand pushes Taiwan to overhaul energy rules
STMicro lead times top 1 year, boosting Taiwan chip makers
Taiwan eases investment rules for AI center infrastructure projects
Foxconn subsidiary broadens AI interconnect role as 1.6T enters deployment
Sandisk recruits engineers in Korea as memory talent race heats up
South Korea broadens espionage law to counter rising tech leaks
Gogoro sees turnaround ahead of schedule as Vietnam rollout gathers pace
LG Display's AI transformation turns employees into AI builders, yielding 450+ in-house projects
Taiwan taps Amazon Leo for next-generation government satellite network
Z.ai reloads with US$5 billion for China's AI race
Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
Gritek to take full control of 12-inch silicon wafer venture in major restructuring
iPhone Duo's price opens room for Android rivals
AI's energy demand ignites global nuclear rush, straining Taiwan's restart
Foldable smartphone panel shipments to grow 23% in 2026
Lab self-investigations show AI agents improvising past their own guardrails
China's OLED expansion narrows South Korea's auto, IT panel lead
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
More news
BIZ FOCUS
Sep 14, 08:00
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
Friday 11 September 2026
DAS Expands in Taiwan and Unveils World First at SEMICON
Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
MOST-READ
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Update: ABF substrate maker Unimicron searched in origin-labeling probe
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
SK keyfoundry expands 8-inch capacity as China demand strains supply
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow
Winstar's AI push gains momentum with some orders extending into 2027
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
CIOE 2026
The 27th China International Optoelectronic Exposition (CIOE 2026) took place September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions.
CIOE 2026: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom
CIOE 2026: Automotive optical-module demand could rival FTTx shipments by 2030
CIOE 2026: Smartphone camera market faces deeper slump as Apple draws attention in Shenzhen
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Gogoro sees turnaround ahead of schedule as Vietnam rollout gathers pace
Monday 14 September 2026
Blokcert launches Gefjon AI to help Taiwan charging operators improve profitability as EV demand rebounds
Monday 14 September 2026
Hiroca revenue jumps 35% as auto summer slowdown fades
Monday 14 September 2026
TECH
Monday 14 September 2026
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
Micron Taiwan junior engineers to average NT$3.4 million, production workers up to 68 months’ pay amid memory boom
Friday 11 September 2026
Qualcomm's AWS deal raises stakes for MediaTek and Alchip
Thursday 10 September 2026
Kioxia rules out deeper SK Hynix ties, resists further NAND price hikes
Wednesday 9 September 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
DIGITIMES Insight: China's GaN challengers are no longer playing catch-up
Monday 14 September 2026
Fujitsu's Monaka targets 2027 mass production with TSMC 2nm boost
Monday 14 September 2026
Samsung, SK Hynix reject US$19 billion power prepayment as Korea speeds chip expansion
Monday 14 September 2026
OPINIONS
Monday 14 September 2026
DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker
DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
Monday 14 September 2026
Analysis: China chases EUV as chipmakers move to High-NA
Thursday 10 September 2026
Commentary: Huawei's Kirin comeback, Xiaomi's Xring entry widen China's chipmaking race
Wednesday 9 September 2026
TOPICS
CIOE 2026
TSMC UPDATES
GEOWATCH
EMS WATCH
SPECIAL REPORTS
Monday 14 September 2026
Notebook shipment update, July 2026
DIGITIMES' survey of July 2026 notebook shipments (excluding detachable models) from the world's top five notebook brands (excluding Apple) and the top three notebook ODMs
Thursday 10 September 2026
From cHBM to 3D Stacked SRAM, AI inference drives AI accelerators toward memory architecture innovation
DIGITIMES identifies three main directions for memory development in cloud AI accelerators: processing near memory, 3D Stacked SRAM, and high-bandwidth flash.
Wednesday 2 September 2026
Global smartphone industry, 2Q 2026
According to DIGITIMES, smartphone memory contract prices surged by 50% to 80% in the first half of 2026, prompting most vendors to continue cutting shipments of mid- and low-end models and to raise product prices.
Friday 28 August 2026
AI data center 800VDC power architecture takes shape; future hurdles require balancing multiple key factors
DIGITIMES believes that 2026 will be a pivotal year in the stabilization of 800VDC power architectures for AI data centers.
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first