A loophole in US export controls reportedly lets high-bandwidth memory (HBM) made by Samsung Electronics and SK Hynix reach China's AI chip industry. The loophole shows how much Huawei's next-generation processors still depend on foreign memory, while China's domestic suppliers struggle to close the gap.

Apple's Greater China revenue rose 21% year-over-year to a record US$17.5 billion in the fourth quarter of fiscal 2026, ended September, while full-year revenue increased 28%, driven by the launch of the iPhone 18 Pro series. The results underscore the flagship iPhone's continued competitiveness in China, while rising memory prices threaten to pressure profit margins and growth.

AI data centers are increasing demand for high-speed optical communications, making optoelectronics supply chains increasingly strategic. Marvell's announced acquisition of Lumentum highlights chipmakers' growing integration of optical technologies. Huawei has pursued its own supply-chain strategy through sustained equity investments by Hubble Technology.

DeepSeek plans to use Huawei's Ascend 950 chips as the core training hardware for its next-generation V5 model, potentially extending the companies' partnership from inference to full model training in 2027.

Dutch chipmaker Nexperia is seeking US$2 billion in damages from its Chinese owner Wingtech and three other defendants, alleging they established a competing supply chain in China that disrupted its business.

Screen Holdings is expanding production of semiconductor cleaning equipment with a JPY25 billion (US$157.53 million) site in Nagaokakyo, Kyoto, while raising its capex budget for the year ending March 2027 to JPY58 billion (US$367.33 million). The new facility is scheduled to begin operating in January 2028.

Samsung Electro-Mechanics (Semco) has disclosed more than KRW5 trillion in long-term supply agreements (LTAs) this year after signing another AI server capacitor contract. The company expects such agreements to account for more than half of its multilayer ceramic capacitor (MLCC) revenue in 2027.

South Korea should tie government support for new semiconductor fabs to commitments that benefit domestic chip designers, equipment makers, and packaging suppliers, a state-funded researcher proposed on November 2, a move that could influence chipmakers' sourcing decisions if adopted.

Samsung Electronics' Galaxy Z Fold 8 weekly sales in South Korea increased by more than 20% in the week after Apple launched its first foldable iPhone Duo, according to Seoul Economic Daily and Financial News. The increase followed the iPhone Duo's South Korean debut on October 23, 2026, as reported problems involving shipment delays and cracked internal displays created additional attention for Samsung's competing foldable device.

Samsung Electronics is considering a major overhaul of its TV lineup for 2027, replacing technology-based product names with three tiers modeled on its Galaxy smartphones as it looks to increase shipments and expand its services business, South Korea's ETNews reported.

Japan's Mitsui Kinzoku has announced its third capacity expansion plan since the start of fiscal 2026 for MicroThin, its ultrathin copper foil used in optical communications equipment. The company is accelerating production expansion to meet sustained growth in market demand.

Samsung Electronics plans to shut down its remaining 8-inch foundry lines by the end of 2030, forcing South Korean chip designers to seek alternative manufacturing capacity as competing foundries operate near full capacity, The Elec reported.

China's leading solar manufacturers have reported their third-quarter 2026 financial results, showing signs of improving profitability but continued heavy losses, underscoring the persistence of excess production capacity across the industry.

China's memory chip industry heads into the final quarter of 2026 riding a global supply shortage: its leading DRAM maker booked more than CNY54 billion (US$8.11 billion) in third-quarter profit, and its chip designers are still lifting sales on tight supply. The same third-quarter results also show where risks are accumulating — rapid capacity expansion, swelling inventories, and a US policy debate that could reach the equipment domestic fabs depend on.

Micron Technology and China's CXMT have taken sharply different approaches to next-generation DRAM scaling, exposing a divide over the commercial viability of 4F-squared memory-cell architecture. While CXMT is advancing 4F-squared towards commercial production to improve bit density, Micron argues that capacitor-scaling constraints undermine its cost advantages and is prioritising 6F-squared technology and a longer-term transition to 3D DRAM. Samsung Electronics and SK Hynix, meanwhile, are pursuing alternative development paths, highlighting the industry's competing approaches to extending DRAM density and manufacturing efficiency.