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Monday 21 September 2026
Taiwan delays 2026 power rate decision as war drives fuel costs higher
Taiwan's Ministry of Economic Affairs delayed a 2026 electricity rate decision on September 18 after the Middle East war pushed up fuel prices and raised Taiwan Power's generation costs. The ministry said it would first seek NT$71.1 billion (approx. US$2.24 billion) in government funding, while the current tariff will stay in place through December 2026.
LATEST STORIES
Tuesday 22 September 2026
Vivo unveils X500 strategy to bolster premium phone push

Vivo unveiled its new X500 series imaging flagship phones in Shanghai on September 21, 2026, aiming to build a stronger moat in mobile imaging and break through more aggressively in the premium smartphone market. As rising memory prices force handset makers to lift retail prices, IDC expects worldwide smartphone shipments to fall 16.7% in 2026 to just over 1 billion units.

Tuesday 22 September 2026
China prepares business delegation as Xi seeks steadier US trade ties

China is preparing a business delegation for President Xi Jinping's Washington visit as Beijing pursues more predictable trade relations and opportunities for companies facing US market-access barriers. The preparations combine official economic talks with a proposed corporate entourage, although the sources reviewed have not publicly confirmed the individual executives attending.

Tuesday 22 September 2026
Unitree targets humanoid robots' next bottleneck with 22-DoF Dex5-S hand
Humanoid robot makers are accelerating investment in dexterous hands as the component becomes increasingly important to fine manipulation. Chinese robotics company Unitree Robotics launched its new Dex5-S dexterous hand on September 21, raising the degrees of freedom to 22 and adopting dimensions close to those of a human hand. Prices start at CNY39,900 (approx. US$6,000), underscoring a shift from demonstration-focused products toward practical tasks and deeper integration with complete humanoid robot systems.
Tuesday 22 September 2026
Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging
Hanmi Semiconductor said on September 22 that it has shipped its first FC Bonder 75 to a customer, expanding the South Korean equipment maker's reach beyond high-bandwidth memory (HBM) into the broader system semiconductor packaging market.
Tuesday 22 September 2026
Alibaba speeds V900 rollout, targeting 20GW of data centers
Alibaba Group is accelerating the rollout of its next-generation Zhenwu V900 accelerator by about six months as it expands a vertically integrated computing platform spanning processors, networking, storage and data centers.
Tuesday 22 September 2026
DeepSeek bets on Huawei chips for model training as Nvidia's China sales slip

DeepSeek CEO Liang Wenfeng said during a call with investors that he aims to rely on Huawei chips to train the startup's models in the future, and that a batch of training chips from Huawei are set to begin arriving at his company as early as the fourth quarter of 2026.

Tuesday 22 September 2026
DEEPX targets smart glasses with low-power NPU, eyes 6G AI RAN
South Korean AI semiconductor company DEEPX is reportedly conducting a proof of concept with a US smart glasses company to test whether its low-power neural processing unit (NPU) can balance power consumption, thermal performance, and AI computing capability.
Tuesday 22 September 2026
Chinese automakers step up battery in-house push to reclaim cost control

As Li Auto, NIO, Xiaomi, Geely, GAC, GWM, Chongqing Changan Automobile, and Chery step up efforts to develop and manufacture batteries in-house, the tug-of-war between China's automakers and battery leader CATL over self-production versus outsourcing is intensifying.

Tuesday 22 September 2026
Alibaba expands full-stack AI push as cloud data centers target 20 GW by 2032
Alibaba Group Holding Ltd. doubled down on its full-stack AI strategy at the 2026 Apsara Conference, which opened on Sept. 22 at the Hangzhou International Expo Center. Alibaba Group chairman Joe Tsai made a rare appearance at the opening ceremony and said AI is moving from frontier exploration toward real-world deployment and large-scale applications.
Tuesday 22 September 2026
BOE looks beyond displays with glass substrates for AI packaging
Chinese display maker BOE Technology is expanding beyond its core panel business. Chairman Chen Yanshun said at the BOE Global Innovation Partner Conference 2026 on September 22 that the company's glass substrates are undergoing customer validation, marking a shift from technology development toward customer adoption.
Tuesday 22 September 2026
Chinese AMOLED material suppliers set for revenue gains as Gen 8 fabs boost localization
Chinese AMOLED material suppliers are poised to gain market share as new 8G OLED fabs expand capacity in China. The shift could reshape supply chains for global display buyers, while also accelerating global demand for materials used in notebooks, premium panels, and future OLED Macs.
Tuesday 22 September 2026
Exclusive: China SiC capacity tightens, spilling orders over to Taiwanese foundries

China's silicon carbide (SiC) end-market demand is expanding rapidly, driven by high-voltage charging infrastructure and AI servers. The surge in orders has tightened SiC wafer capacity in China, and some offshore companies seeking foundry partners there have reportedly been turned away, pushing spillover business toward Taiwan, where Episil, HYS, and Diodes are among the names cited as potential beneficiaries.

Tuesday 22 September 2026
Huaqin challenges Quanta for Steam Deck ODM order

Industry sources say Valve is expected to launch a new Steam Deck in 2027, setting up a tougher contest for Taiwanese original design manufacturer (ODM) Quanta as China's Huaqin moves to win the manufacturing order. The winner has not yet been confirmed.

Tuesday 22 September 2026
China puts AI computing into orbit with first integrated satellite launch
China has taken another step toward deploying artificial intelligence (AI) computing infrastructure in space after a commercial rocket launched nine satellites, including the country's first integrated "rocket-and-satellite" AI computing project.
Tuesday 22 September 2026
YMTC's capital arm enters FD-SOI — China's 12-inch SOI build-out gathers pace

China's FD-SOI supply chain is taking shape through a new round of investment. Changcun Capital, the investment platform backed by YMTC, participated in a strategic investment in FD-SOI developer Ruili Pingxin Microelectronics in August, drawing attention to whether Chinese semiconductor capital is expanding beyond memory manufacturing into specialty logic and wafer foundry technologies.