Sumitomo Chemical plans to begin mass production of a halide-based solid electrolyte in Japan as early as fiscal 2028, positioning the material as a potentially lower-cost option for all-solid-state batteries while seeking performance comparable with leading sulfide-based electrolytes, Nikkei reported.
China is dismantling the tax shelter that helped build the world's largest battery industry, and the move looks less like a one-off revenue measure than the opening of a broad campaign to force consolidation across its clean-energy supply chains — with consequences that reach from Chinese carmakers to global energy-storage buyers.
The US and China are preparing to hold their first official artificial intelligence (AI) dialogue under President Donald Trump, a notable diplomatic milestone after years of escalating technology tensions. Yet the significance of the meeting lies less in whether it produces tangible agreements than in what it reveals about how both countries increasingly view AI: not as another fast-growing industry, but as strategic infrastructure requiring tighter state oversight and national control, according to Reuters.
LG Electronics plans to stop production at its Huizhou plant in China after October, ending manufacturing at the group's first production subsidiary in the country after more than three decades.
Chinese chip designer GigaDevice is investing another CNY500 million (approx. US$73.9 million) into its wholly owned subsidiary to support its DRAM research and industrialization project, continuing a series of capital injections aimed at expanding its memory business.
Chinese semiconductor equipment suppliers are beginning to secure production orders for through-glass via (TGV) manufacturing tools, marking a shift from prototype validation toward commercial deployment as the industry moves to develop glass substrates for next-generation AI chip packaging.
Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip sample with Shanghai Xianfeng Technology using glass-based Chip-on-Panel-on-Substrate (CoPoS) panel-level advanced packaging.
Chinese GPU developer Biren Technology unveiled a next-generation near-packaged optics (NPO) super node at the World Artificial Intelligence Conference (WAIC) 2026, targeting the growing computing demands of large language models and AI agents.
China is considering tighter export controls on artificial intelligence and semiconductor technologies amid intensifying competition with the US in frontier AI. The proposed measures, reported by Financial Times, would also target overseas acquisitions of advanced technology startups and could appear in the next revision of Beijing's export control catalogue.
Haesung DS has reportedly added China's CXMT as a customer for DDR5 package substrates as the South Korean supplier expands its DDR5 business and considers panel-based production for higher-layer-count products for the DDR6 generation.
