As China continues to implement dynamic production cuts, the output reduction has stabilized LCD TV panel prices in August. Meanwhile, major Chinese TV brands such as TCL and Hisense have recently released urgent orders, leading industry experts to expect that LCD TV panel prices in September will likely remain stable

Yangtze Memory Technologies Corp. (YMTC), China's largest NAND flash producer, is expanding into the DRAM sector as part of Beijing's broader drive to compete in advanced memory markets like high-bandwidth memory (HBM). Industry sources indicate YMTC could begin investing in DRAM equipment by late 2025, while actively pursuing a strategic partnership with domestic DRAM leader ChangXin Memory Technologies (CXMT)

Starting September 1, 2025, China officially implemented the Measures for the Labelling of Artificial Intelligence-Generated and Synthetic Content. This regulatory framework is regarded as a new standard for AI content and will fundamentally transform the ecosystem of AI-generated online content in China. It will also directly affect behavioral norms from model developers to general creators

SK Hynix is expected to retain more than half of the global high-bandwidth memory (HBM) market through at least 2027, cementing its role as Nvidia's top supplier while broadening its reach across the memory semiconductor spectrum, according to forecasts cited by South Korean media, including Business Post, ZDNet Korea, and Yonhap

The US Commerce Department plans to revoke long-standing waivers that have allowed Samsung Electronics and SK Hynix to operate their Chinese chip plants using American equipment. The new rules, set to take effect within 120 days, heighten tensions between Washington and Beijing while putting South Korea in a difficult position

On August 29, 2025, local time, the US Department of Commerce (DOC) announced it will revoke the Validated End-User (VEU) exemptions previously granted to South Korean manufacturers Samsung Electronics and SK Hynix for using US-made semiconductor equipment in their China-based factories

The global surge in generative AI is driving explosive growth in the AI server market, making advanced CoWoS packaging a crucial battleground for GPU makers and custom chip developers. However, shortages of key upstream materials for IC substrates have created a chokepoint, forcing customers to scramble for supply

Alibaba Group is reportedly making progress in its development and supply strategies for AI chips. There are mixed reports regarding the company’s procurement of computing power chips. Some foreign and Chinese media sources have suggested that Alibaba's next-generation AI chip is currently in the testing phase and is compatible with Nvidia products. However, reportedly, this chip may not be manufactured by TSMC anymore and could instead be produced by a domestic Chinese foundry. Alibaba has not publicly confirmed these claims

China's drive to develop a homegrown GPU ecosystem is accelerating, but industry leaders warn of overheating and deep-seated bottlenecks. Cambricon Technologies, frequently portrayed as the nation's AI champion, cautioned investors against inflated expectations, projecting 2025 revenue of just CNY5–7 billion (approx. US$700 million–US$980 million). The guidance highlights the widening gulf between market hype and the hard realities of China's semiconductor ambitions

The global AI surge has turned computing power into a core strategic resource. With Washington tightening curbs on advanced GPU exports, Nvidia's revenue in China has collapsed, opening a rare market window for domestic AI chipmakers

BYD's financial report reveals a 30% year-over-year decline in profit for the second quarter of 2025. This drop not only fell short of market expectations but also marked the first decline since 2021, underscoring how intense price competition in China's automotive market is affecting even industry leaders

Taiwan's prosecutors are pursuing a 14-year prison term in a high-profile TSMC trade secrets case, underscoring how Taipei views semiconductor technology leaks as threats to national security. The indictment, handed down on August 27, 2024, charged three suspects with violating the National Security Act and misusing core technology abroad. The defendants face potential sentences of 14, nine, and seven years, according to the Intellectual Property Branch of the Taiwan High Prosecutors' Office

As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech aims to address the challenge with advanced fluxless bonding tools, targeting the market for HBM4 and beyond

South Korea-based optical wafer inspection equipment manufacturer Nextin has made strides in the high-bandwidth memory (HBM) segment, gaining traction after launching its dedicated HBM inspection system, KROKY, in 2023. The company has already supplied the tool to SK Hynix, the world's leading HBM vendor, and plans to roll out more advanced systems tailored to Micron and other major players