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Thursday 3 September 2026
China chip tool makers expand beyond import substitution at CSEAC 2026
China's semiconductor equipment industry is moving beyond replacing imported tools at mature nodes, with CSEAC 2026 highlighting deeper advances in etching, thin-film deposition, cleaning, metrology, advanced packaging and core components.
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Thursday 3 September 2026
Mitsubishi Heavy Industries and NEC form alliance to advance defense tech, AI sovereignty
Japanese industrial giants Mitsubishi Heavy Industries (MHI) and NEC Corporation have signed a memorandum of understanding (MOU) to establish a strategic partnership in the defense sector. The alliance aims to fortify Japan's defense industrial base while bolstering national data and AI sovereignty amid shifting global security dynamics.
Thursday 3 September 2026
CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade

Chinese DRAM maker CXMT has launched its 2027 global recruitment campaign, opening roles across circuit design, R&D, mass-production technology, manufacturing operations, information technology and artificial intelligence. Positions are based in Hefei, Beijing, Shanghai, Xi'an and overseas markets including Japan.

Thursday 3 September 2026
China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration
Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser integration of multiple dies and high-bandwidth memory for AI chips and high-performance computing (HPC).
Thursday 3 September 2026
UniVista expands China EDA stack with AI agents, native 3DIC tools
Shanghai UniVista Industrial Software Group has launched an Agentic EDA framework, a native 3DIC physical-design tool and an advanced-process closure platform, expanding China's domestic toolchain for chip verification, 3D integration and digital back-end design.
Thursday 3 September 2026
China optical module makers ride AI boom as 800G, 1.6T orders stretch into 2027
AI infrastructure expansion is accelerating demand for 800G and 1.6T optical modules, lifting first-half 2026 results across major Chinese suppliers and extending order visibility into 2027.
Thursday 3 September 2026
Samsung Electro-Mechanics eyes 30% MLCC price hikes, ABF up too
Samsung Electro-Mechanics (SEMCO) is set to expand the scope of its price increases, with market reports saying the company will raise direct-supply prices for multilayer ceramic capacitors (MLCCs) sold to OEMs and ODMs in the fourth quarter of 2026, while ABF substrate prices are also climbing. With supply constrained and demand for AI servers strong, further price increases are likely in the near term.
Thursday 3 September 2026
MiniMax, Z.ai revenues surge on API demand but adjusted losses widen
Two of China's first listed foundation-model developers are showing that demand for their technology can translate into rapidly growing revenue. Turning that demand into profit remains a much harder problem.
Thursday 3 September 2026
TIME AI 100 spotlights China's new AI guard, from Moonshot, Z.ai to AgiBot, Manus
TIME recently unveiled its 2026 list of the 100 most influential people in AI. Alongside leaders of major technology companies, the list includes a new generation of Chinese entrepreneurs spanning AI models, humanoid robots, and AI agents, highlighting how China's AI industry is expanding beyond large language models into a broader range of technologies and applications.
Wednesday 2 September 2026
Samsung, SK Hynix inventories surge as valuation reserves fall
Samsung Electronics and SK Hynix ended the first half of 2026 holding sharply more inventory than six months earlier, an unusual development in a memory market where demand continues to strain available supply.
Wednesday 2 September 2026
World's first legged robot standard sets global benchmark for humanoids, robot dogs
China-led experts have released what CCTV described as the world's first international standard for legged robots, creating a common framework for evaluating humanoid robots, robot dogs and other machines designed to walk, run, climb slopes and cross obstacles.
Wednesday 2 September 2026
China's Galactic Energy puts PALLAS-1 in orbit, raising stakes in reusable rocket race
Chinese private launch company Galactic Energy Space Technology Co. has successfully flown PALLAS-1, its medium-to-large reusable liquid-fuel rocket, marking its expansion into a dual solid- and liquid-fuel portfolio.
Wednesday 2 September 2026
Meta reportedly taps SeeYA for Phoenix OLEDoS panels as BOE fails to qualify

Meta has reportedly tapped Chinese microdisplay maker SeeYA Technology to supply OLED-on-silicon (OLEDoS) panels for its next-generation lightweight mixed-reality headset, codenamed Phoenix, while rival BOE failed to obtain supplier qualification, according to South Korea's The Elec.

Wednesday 2 September 2026
Manus resumes independent operations after Meta deal collapses
Manus has resumed independent operations under its founding team, closing a turbulent chapter that began with Meta Platforms' multibillion-dollar acquisition of the AI agent startup and ended after Chinese regulators ordered the transaction canceled.
Wednesday 2 September 2026
ByteDance-ZTE Nubia NaviX Ultra clears launch hurdle, takes agentic AI beyond smartphone assistants
ByteDance and ZTE are preparing to launch the Nubia NaviX Ultra in September after the AI smartphone received China's network access approval, clearing the regulatory process from large-model filing to device certification.
Wednesday 2 September 2026
Chinese foundry Hua Hong Grace adds 55,000-wpm Wuxi capacity in US$4.17 billion Phase III buildout
Chinese foundry Hua Hong Grace Semiconductor (HHGrace) is preparing another major expansion of its 12-inch wafer capacity, reinforcing its specialty-process footprint after a sharp earnings rebound and record shipments in the first half of 2026.