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Friday 10 July 2026
SK Hynix breaks Alibaba's US listing record — but HBM customers will wait until 2028 for the capacity it funds
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging and leading-edge manufacturing equipment at the same time.
Friday 10 July 2026
Samsung plans new PC chip in push beyond smartphones
Samsung Electronics is developing a new chip for personal computers (PCs) as its System LSI business seeks growth beyond smartphone processors, according to ET News and the Korea Economic Daily, citing industry sources.
Friday 10 July 2026
SK AI Summit postponed as SK eyes closer alignment with Nvidia GTC
SK Group, which hosts the annual SK AI Summit as its flagship technology event to showcase its latest AI and semiconductor developments, is reportedly postponing the 2026 edition. Originally scheduled for the second half of 2026, the event is now expected to take place in the first half of 2027. Industry sources believe the move is intended to better align the summit with Nvidia GTC, which is held each March.
Friday 10 July 2026
JCET sets US$1.4bn capex for AI packaging expansion as China orders stay strong
JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected mainstream packaging capacity while its major Chinese plants run on strong orders.
Friday 10 July 2026
Luxshare's weak HK debut highlights investor skepticism over AI transition

Luxshare Precision's highly anticipated Hong Kong debut got off to a shaky start despite securing the city's largest IPO of 2026, underscoring investor skepticism over the Apple supplier's long-term transformation strategy.

Friday 10 July 2026
Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening a new front in the competition over advanced memory performance, yield and supply.

Friday 10 July 2026
Huawei joins China Mobile, Baidu to build China's first NPO optical interconnect standard

Huawei has joined more than 20 Chinese technology companies and research bodies to launch OPEN NPO, the country's first multi-source agreement for near-packaged optics, in an effort to standardise high-speed optical interconnects for AI supernodes and large-scale computing clusters.

Friday 10 July 2026
GigaDevice's 1H26 profit surges 1,099% on memory chip shortage, higher prices

GigaDevice Semiconductor expects first-half 2026 net profit to reach about CNY6.9 billion (US$960 million), a 1,099% increase from a year earlier, after tight memory chip supply lifted both shipment volumes and prices.

Friday 10 July 2026
HBM prices set to double in 2027 as AI demand and supply deals tighten the memory market

High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production costs, and long-term agreements lock up an increasing share of global DRAM capacity, according to memory industry sources.

Friday 10 July 2026
China's AI talent demand spreads into chips, rare earths, and new materials
China's graduate job market is shifting toward semiconductors, materials, and manufacturing, with global implications for supply chains, AI development, and critical minerals. Fresh salary data show computer science and software engineering losing ground as strategic industries draw more talent, while hard tech majors gain pay advantages across the country.
Friday 10 July 2026
BOE profit surges on LCD recovery and 8.6G OLED AI PC ramp

BOE Technology expects first-half 2026 net profit to rise sharply as China's largest display panel maker benefits from a stronger LCD cycle, higher-end AMOLED shipments, and the start of mass production at its 8.6-generation OLED line for medium-sized panels.

Friday 10 July 2026
China's silicon-to-agent AI stack headlines WAIC 2026 in Shanghai

When the 2026 World Artificial Intelligence Conference (WAIC) opens on July 17, its exhibition halls will double as a statement: China now fields a domestic AI stack running from silicon to agentic devices, at a moment when US export controls are tightening around the country's access to the most advanced foreign chips and models.

Friday 10 July 2026
China's StepFun, ZTE's Nubia vie for 'world's first AI agent smartphone' at WAIC
Two Chinese technology players will use the 2026 World Artificial Intelligence Conference (WAIC), running July 17-20 in Shanghai, to present what each bills as the world's first AI agent smartphone—a device whose on-device AI operates apps on the user's behalf rather than merely answering questions.
Friday 10 July 2026
Mitsubishi Chemical, JSW ramp GaN substrate capacity for EVs and data centers

Mitsubishi Chemical and Japan Steel Works are preparing a fresh capacity expansion in gallium nitride (GaN) substrates, aiming to capture growing demand from next-generation power semiconductors used in EVs, inverters and data center power systems.

Friday 10 July 2026
Xiaomi Auto launches new sub-brand for long-range SUVs

Xiaomi Auto has unveiled a new brand aimed at long-range SUVs, a move that could broaden its appeal beyond China and intensify competition in a global electric-vehicle market still shaped by range, charging access, and family-use demand. The startup also reported another month of strong deliveries, while continuing to expand production capacity in Beijing to support growth.