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Thursday 30 July 2026
Kumamoto quake exposes Kyushu auto supply-chain fault lines
Ongoing coverage: This article will be updated as new information becomes available on the operating and recovery status of affected plants.
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Friday 31 July 2026
ByteDance merges Lark with Doubao after AI revenue hits US$4B run rate
ByteDance is reorganising Doubao, Lark and Volcengine around a more unified enterprise AI strategy, combining product development, cloud commercialisation and workplace software as its large-model business reaches an annualised revenue run rate of US$4 billion.
Friday 31 July 2026
Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war
Nvidia CEO Jensen Huang recently appeared alongside SK Group Chairman Chey Tae-won and Samsung Electronics Executive Chairman Lee Jae-yong at a high-profile AI gathering in San Francisco, highlighting the deepening ties among the companies driving the global AI supply chain.
Friday 31 July 2026
Shanghai rises as China's lithography hub, powered by SMEE, Huawei and rising DUV rivals

China's lithography equipment sector has returned to the global semiconductor spotlight following reports that a domestically developed immersion deep ultraviolet (DUV) system has entered mass production.

Friday 31 July 2026
Kioxia begins sampling 1TB 3D flash memory for AI devices
Kioxia has begun shipping samples of 1TB triple-level cell memory devices built with its 9th-generation BiCS FLASH 3D flash memory technology. The move signals faster, lower-cost storage options for AI-enabled PCs and smartphones, while also underscoring broader supply-chain developments that may shape device performance for users worldwide.
Friday 31 July 2026
AI server boom reshapes MLCC pricing as capacity shifts upmarket

The rapid expansion of AI infrastructure is reshaping one of the semiconductor industry's most overlooked component markets. Soaring demand for high-end multilayer ceramic capacitors (MLCCs) is prompting suppliers to reallocate production capacity and driving a new round of price increases that extend beyond AI-specific products.

Thursday 30 July 2026
Samsung signs five-year memory deals as chip shortage stretches to 2028
Samsung Electronics has signed five-year memory supply agreements with five leading global data center customers and is in the final stages of talks with five more, tying a growing share of its DRAM and NAND output to commitments that run years into the future.
Thursday 30 July 2026
South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth memory (HBM) moves into advanced packaging processes led by TSMC.

Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
China's 28nm DUV lithography programme has entered a new phase after Shanghai Aishengna Electronic Technology delivered its first five immersion deep ultraviolet lithography systems.
Thursday 30 July 2026
China rejects 'overcapacity' claims in new policy paper, defends industrial strategy
China's Ministry of Commerce (MOFCOM) has released a policy paper rejecting allegations that the country's manufacturing sector suffers from "overcapacity," arguing that the concept has been misused to justify protectionist trade measures against Chinese exports. The document, published on July 28, 2026, outlines Beijing's position on industrial policy, trade balances and global supply chains.
Thursday 30 July 2026
China's robot vacuum makers race ahead as innovation cycle outpaces smartphones

While humanoid robots have yet to achieve meaningful economies of scale, service robots have already entered an intensely competitive phase.

Wednesday 29 July 2026
China's glass substrate supply chain takes shape for AI chip packaging
Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the industrialisation of glass core substrates.
Wednesday 29 July 2026
China's GenAI race shifts to open source ecosystems
The global GenAI race has remained intense, with major US players including Google, Meta, Microsoft, Amazon, and OpenAI investing heavily. But with Beijing-based startup Moonshot AI launching Kimi K3, a new large language model (LLM) with multimodal and long-context reasoning capabilities, along with the rapid rise of DeepSeek, Alibaba's Qwen, and Z.ai's GLM models, China is increasingly outlining a new competitive model centered on open-source AI ecosystems and large-scale commercial deployment.
Wednesday 29 July 2026
US blocks new foreign-made robots and power inverters in AI security crackdown

The US has barred new foreign-produced advanced robots and power inverters from receiving regulatory approval, extending its technology restrictions into two industries considered critical to artificial intelligence, energy infrastructure and industrial automation.

Wednesday 29 July 2026
China's first home-grown immersion DUV production reveals real test beyond prototypes
China has begun producing domestically developed immersion deep-ultraviolet (DUV) lithography machines, moving a critical semiconductor-equipment programme beyond prototypes and towards limited commercial deployment.
Wednesday 29 July 2026
Samsung reportedly weighs Chinese DRAM for budget smartphones as memory inflation squeezes mobile market
Samsung Electronics is considering using low-cost Chinese mobile DRAM in smartphones sold in China as it looks to cut manufacturing costs and expand its presence in the country's budget handset market, according to Asia Time.