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Friday 17 July 2026
China, Netherlands urge Nexperia talks as Wingtech warns of 1H loss

China and the Netherlands agreed that their governments should create a favorable environment for companies to resolve the Nexperia dispute through consultation, China's Ministry of Commerce said July 16.

Friday 17 July 2026
WAIC 2026 puts China's AI race on supernodes, domestic chips, and real-world deployment

China's AI industry is shifting from model scale to the infrastructure needed to train, deploy and commercialize AI, with supernodes, high-speed interconnects, and computing efficiency dominating WAIC 2026.

Friday 17 July 2026
China's DRAM milestone arrives with CXMT IPO; HBM now separates contenders from leaders

ChangXin Memory Technologies (CXMT) opened subscriptions for its STAR Market IPO on July 16, launching one of China's largest A-share listings of 2026 and marking the country's first complete DRAM journey from technology acquisition and manufacturing validation to mass production and capital market recognition.

Friday 17 July 2026
China moves to institutionalize its vision for global AI governance as Xi launches cooperation body
China used the opening of the 2026 World Artificial Intelligence Conference (WAIC) in Shanghai to institutionalize its bid to shape global governance of artificial intelligence (AI), with President Xi Jinping unveiling a package of measures aimed at the developing world and endorsing a new Shanghai-based intergovernmental body. The push positions Beijing as a self-styled champion of the "Global South" on AI at a moment of intensifying rivalry with the US over who writes the rules for the technology.
Friday 17 July 2026
Analysis: Unveiling the low-profile engineer building China's CXMT into a DRAM heavyweight

ChangXin Memory Technologies' (CXMT) STAR Market IPO is more than just one of China's biggest semiconductor listings. It also marks the culmination of Zhu Yiming's two-decade effort to build a domestic memory industry, taking the entrepreneur from founding flash memory designer GigaDevice to creating China's first globally competitive DRAM maker.

Friday 17 July 2026
SK Group chair floats 'memory as a service' model for SK Hynix

SK Group chairman Chey Tae-won has floated a "memory as a service" model for SK Hynix, saying the memory chipmaker needs to build a higher-value business beyond manufacturing and selling chips.

Friday 17 July 2026
Exclusive: PC brands reportedly rush to secure CXMT memory as orders extend to end-2027
Chinese DRAM maker ChangXin Memory Technology's (CXMT) IPO has entered its final stage, drawing close market attention. PC supply chain sources said the US had briefly planned to add CXMT to its entity list but had not announced it, and that easing US-China tensions, along with reports that Apple had tested CXMT memory and lobbied the US government, had signaled a possible green light and triggered a rush of orders from brands, with shipments reportedly booked through the end of 2027.
Friday 17 July 2026
Hygon forecasts higher first-half 2026 revenue and profit
Hygon Information Technology said its first-half 2026 results are expected to rise sharply, signaling continued demand for domestic high-end chips as AI, cloud computing, and localization trends reshape technology supply chains for global customers, investors, and competitors. The company said the forecast is preliminary and unaudited.
Friday 17 July 2026
Japan steps up sovereign AI ambitions as Noetra launches multimodal AI project, plans infrastructure of 27,500 Nvidia Rubin GPUs
Noetra has launched full-scale R&D for a Japan-developed multimodal foundation model, a move that could shape the future of AI robots, industrial automation, and so-called physical AI worldwide. The project highlights Japan's push for sovereign AI, with implications for how countries build and control advanced AI infrastructure and data.
Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
Friday 17 July 2026
Moonshot's free Kimi K3 matches Anthropic's Opus 4.8, closing the gap between open and proprietary AI
Chinese AI developer Moonshot AI released Kimi K3 on July 16, a 2.8-trillion-parameter model the company bills as the first open model in the roughly 3-trillion-parameter class, pushing the distance between freely downloadable systems and the industry's top proprietary models to its narrowest point yet. Moonshot said it will publish the full model weights by July 27.
Friday 17 July 2026
China auto sales slump deepens as exports face rising trade scrutiny
China's passenger vehicle market posted its sharpest slowdown in years in the first half of 2026, with private passenger car sales falling 20% year on year, according to the China Passenger Car Association. The slide has pushed exports from a growth driver to the main support for automakers, while also exposing the sector to growing geopolitical risk.
Friday 17 July 2026
Australia strips voting rights from China-linked holdouts in rare-earths miner, curbing Beijing's mineral leverage

Australia has escalated a two-year campaign to force Chinese investors out of Northern Minerals Ltd., barring three China-linked shareholders that defied divestment orders from voting or exercising other rights in the heavy rare-earths developer — a signal that Canberra now intends to police foreign ownership on an ongoing basis, not just at the point of a transaction.

Friday 17 July 2026
South Korean bill could let SK Hynix bring in outside investors for new fabs

A South Korean lawmaker has introduced a bill that would allow a second-tier subsidiary of a general holding company to retain a stake of at least 50% in a jointly funded semiconductor venture, rather than the 100% currently required under the country's holding-company rules.

Friday 17 July 2026
China's AI chips hit three walls — and bet on 3D memory to break through
China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.