Recent market reports indicate that CoWoP has shown preliminary test results exceeding expectations. Nvidia, which leads its development, is expected to accelerate mass production timelines. This development has sparked growing attention on whether the positions of China and Taiwan's printed circuit board (PCB) industries will be reshuffled

IAA Mobility in Munich, Germany, is generally seen as a key indicator for the global automotive industry, compared to CES in Las Vegas, the US, which is a showcase of the strengths of innovative technologies. However, the EU is set to review carbon emission regulations in mid-September 2025, shortly after this year's IAA Mobility. At this sensitive juncture, the direction of the IAA seems to have taken a sharp turn

China's DRAM maker CXMT is reportedly developing compute express link (CXL) DRAM modules, a move that could escalate rivalry with Samsung Electronics and SK Hynix as the CXL market takes off in 2026. According to South Korea's EBN, CXMT has outlined its CXL roadmap to Korean semiconductor component suppliers and begun early design work, with one major substrate partner confirming initial joint R&D on CXL substrates

According to Ddaily, Samsung announced it will expand its India Innovation Campus (SIC) program from four states to ten this year, aiming to train 20,000 students, six times last year's intake. The program, aligned with India's "Make in India" and "Skill India" initiatives, covers AI, IoT, big data, and coding, with potential to feed talent into Samsung's Noida facility, the world's largest smartphone plant

Nvidia has reportedly abandoned its initial SOCAMM1 low-power DRAM module for AI workloads, shifting focus to SOCAMM2 with faster speeds and broader supplier collaboration, including Micron, Samsung, and SK Hynix. This move signals a strategic push to address technical challenges and advance AI memory solutions ahead of mass production in 2026

The technological rivalry between China and the US escalated further on September 12, when the US Department of Commerce's Bureau of Industry and Security (BIS) added 23 Chinese companies, including Fudan Microelectronics Group, to its entity list. Thirteen of these firms are related to semiconductors, with the US alleging the entities undermine national security or foreign policy interests

On September 11, Chinese media reported that Huawei's semiconductor unit HiSilicon has entered a new leadership phase. Eric Xu resigned as chairman, with Jeffrey Gao assuming the role. Huawei senior executives Ken Hu, Guo Ping, and Steven Ren also stepped down from their directorships, leaving He Tingbo — HiSilicon's president and long-time steward — as the sole continuing board-level figure. He Tingbo also holds multiple senior posts at Huawei, serving as Director, Chair of the Huawei Scientist Committee, ITMT Director, and President of the Semiconductor Business Department

Despite ongoing US sanctions that constrain its smartphone sales overseas, Huawei said it has held the No. 1 position in global wearable device shipments for two straight quarters

Navitas Semiconductor is expanding its portfolio beyond consumer chargers to include advanced power solutions for solar inverters, motor drives, and AI data centers, Senior Field Applications Engineering Manager Rome Luo said. Speaking at SEMI-e 2025, Luo noted that the company has shipped over 300 million gallium nitride (GaN) devices, achieving high yields and very low failure rates in the field

At the packed China International Optoelectronic Exposition (CIOE) held at the Shenzhen World Exhibition & Convention Center, Taiwan's OtO Photonics stood out for its specialized focus on spectrometers. With over 3,800 exhibitors in attendance, OtO has carved out a leading role in the industry

XPeng Aeroht, the flying car subsidiary of XPeng Motors, is accelerating its global expansion with plans for a debut overseas eVTOL test flight in Dubai in October 2025. Pending successful trials, the company expects to deliver flying cars to European customers by the second half of 2026, positioning itself among China's most ambitious players in urban air mobility

Talent has long been the defining currency in the global semiconductor race. For decades, Chinese-born engineers with deep overseas experience drove China's rapid catch-up, fueling its chip ambitions through a steady flow of returning expertise

SK Hynix, a key supplier of HBM to Nvidia and other global clients, is reportedly scaling back its aggressive investment plans in thermo-compression bonders (TCB), equipment crucial for HBM production. Industry watchers say this shift could reshape the competitive landscape for suppliers such as Hanmi Semiconductor, even as the broader market for bonding equipment is set for strong growth in the coming years

Micron Technology is reportedly deepening its ties with the Trump administration to secure a stronger foothold in the global semiconductor market. According to South Korean media, this move could intensify competitive pressure on non-US rivals such as Samsung Electronics and SK Hynix