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Friday 4 September 2026
Taiwan to expand industrial land for AI hardware boom
Taiwan's government says it will expand industrial land development to meet surging demand for AI infrastructure hardware, as global suppliers race to add capacity through 2027...
LATEST STORIES
Monday 7 September 2026
SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the company prepares for HBM4E and seeks greater cost efficiency.
Monday 7 September 2026
Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV
China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density while access to advanced EUV lithography remains restricted.
Monday 7 September 2026
India says it cannot build electronics without China and has started easing the rules to prove it
India is selling its semiconductor build-out abroad as a hedge against an over-concentrated supply chain. The officials running it are unusually candid that the hedge cannot be built without the country it hedges against. Asked at a media briefing in Taipei on 4 September how New Delhi views the role of Chinese companies in India's chip and electronics supply chain, S. Krishnan, secretary of India's Ministry of Electronics and Information Technology, opened with a line that would be politically awkward in most capitals: "We need to be realistic."
Monday 7 September 2026
Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law
Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more heat.
Monday 7 September 2026
Every Chinese CPU maker grew in 1H26 but only one grew on processors
Revenue rose at every Chinese chip company examined in the first half of 2026 amid the domestic-substitution push, but the interim filings show three quite different businesses hiding under one label. One has reached real scale and is now funding its expansion from the balance sheet rather than from operations. One is repairing its margins on a genuinely homegrown instruction set at a fraction of the scale. And the cohort's most spectacular profit number is not a processor story at all.
Monday 7 September 2026
China's JCET seeks US$968M for AI-driven packaging expansion

JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity across high-performance computing (HPC), power modules, wafer-level packaging and memory, sharpening its exposure to AI infrastructure and China's domestic semiconductor supply chain.

Monday 7 September 2026
Exclusive: DIGITIMES' top 3 at K-Safety Expo 2026 shows where intelligent safety is heading — act 'before' disaster strikes
The most consequential safety technologies are often judged by what happens after something goes wrong: how fast an alarm sounds, how quickly rescuers arrive, or how effectively protective equipment limits injury.
Sunday 6 September 2026
K-Safety Expo 2026: Safety gets smarter as six innovators win foreign media honors
The BEST OF K-SAFETY EXPO Global Media Awards on September 3 offered a revealing snapshot of where safety technology is heading: away from passive protection and toward systems that can sense danger, interpret it, and increasingly act before humans intervene.
Sunday 6 September 2026
Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands
South Korea's Hanmi Semiconductor has reportedly begun supplying 2.5D packaging bonders to an unnamed Taiwanese foundry after the equipment passed mass-production qualification, giving the company an important production foothold as Taiwan's advanced-packaging supply chain expands beyond foundry-owned lines.
Sunday 6 September 2026
K-Safety Expo 2026: Beyond AI, Korea re-engineers the human layer of industrial safety
Not every safety breakthrough spotted across the K-Safety Expo 2026 floor in Busan came with an AI camera attached.
Saturday 5 September 2026
Exclusive: South Korea's safety AI boom is being built from the top down, BEXCO says
South Korea's safety-tech sector may be increasingly filled with AI cameras, robots, drones, and predictive systems, but BEXCO general manager Tom Choi argues that the force pushing many of those technologies toward actual deployment begins somewhere less glamorous: government policy.
Saturday 5 September 2026
Samsung, SK chiefs to meet Nvidia's Huang in New York amid US investment pressure
Samsung Electronics Chairman Jay Y. Lee and SK Group Chairman Tae-won Chey are traveling to New York at the end of September 2026 to meet Nvidia CEO Jensen Huang again as Washington presses South Korean companies to expand US investment. The planned trip is drawing market attention because Samsung Electronics and SK Hynix are already pursuing large-scale spending in the US and could discuss further business ties on the sidelines of the event.
Saturday 5 September 2026
Interview: China Tier 1 supplier Jingwei Hirain shares lessons from EV race
"Demo is not a product," Jingwei Hirain president Chengjian Fan told DIGITIMES in an interview, arguing that China's new-energy vehicle industry has learned hard lessons as fast-moving startups, deep in-house development, and tougher supplier scrutiny reshape the market. He said software demand has increased more than tenfold compared with the internal combustion engine era, while the fastest mass-production delivery cycle in China has been as short as 12 months.
Saturday 5 September 2026
Samsung SDI nears solid-state battery mass production, eyes China supply chain
Reports that Samsung SDI's procurement team recently visited the Chinese production facilities of battery material maker Tinci Materials have drawn significant attention within China's industry. As Samsung SDI prepares to initiate mass production of all-solid-state batteries in the second half of 2027, its supply chain strategy and upcoming moves are rapidly becoming a major focal point in the Chinese market.
Saturday 5 September 2026
Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC
China's memory industry is shifting from a single-champion model towards a three-pronged structure. ChangXin Memory Technologies (CXMT) is building its position in DRAM, Yangtze Memory Technologies (YMTC) in 3D NAND, while Wuhan Xinxin Semiconductor Manufacturing (XMC) is concentrating its next phase on NOR Flash, 3D integration and optoelectronics.