China's DeepSeek has reportedly carried out an internal assessment of potential risks posed by its AI models to public safety and social stability, although it has not made the results public

Huawei is pressing ahead with its in-house chip and AI infrastructure strategy despite escalating US–China tech tensions. At Huawei Connect 2025 in Shanghai, deputy and rotating chairman Eric Xu unveiled the company's first detailed Ascend AI chip roadmap in six years, highlighting Huawei's advances in high-performance computing and long-term ambitions in AI infrastructure

China's State Administration for Market Regulation (SAMR) announced on September 15, 2025, that Nvidia had breached Chinese antitrust law and conditions imposed when Beijing cleared its 2020 acquisition of Mellanox. The watchdog decided to open a deeper antitrust investigation

Tencent said this week it has integrated AI chips from Chinese suppliers and plans to scale up its use in cloud-based AI services. Alongside Alibaba and Baidu, which have already adopted domestic or in-house processors, the 'BAT' tech giants are accelerating a pivot away from Nvidia's dominance in advanced computing

A pair of major technology expositions in China has concluded, offering a look into the country's tech supply chain, which is navigating US trade tensions with a firm commitment to self-reliance. The China International Optoelectronic Exposition (CIOE) and the SEMI-e Shenzhen International Semiconductor Exhibition underscored both the ambition and inherent challenges facing the industry

Baidu, one of China's leading internet companies, has cultivated its in-house Kunlun chip for years and recently secured a significant contract with China Mobile, marking the first step in its commercialization process of supplying external customers

Alibaba Group founder Jack Ma has stepped back into the spotlight, reclaiming a central role in the company's strategy after years of relative absence since his 2019 exit as chairman. Multiple reports suggest Ma is once again actively steering key decisions, with a sharpened focus on artificial intelligence and Alibaba Cloud — areas critical to the company's long-term competitiveness

Nissan Motor held a media briefing on September 17 to outline its plans to reduce variable costs in vehicle production, aiming to cut JPY250 billion (approx. US$1.7 billion) by fiscal 2026 (April 2026-March 2027) compared with fiscal 2024. The company plans to achieve these savings through wider adoption of Chinese-made components and a review of logistics operations, according to reports by Nikkei and Reuters

Samsung Electronics is the only South Korean tech company invited to a new US government initiative focused on modernizing the nation's healthcare system. The program, dubbed "Make Health Tech Great Again," is a public-private partnership launched by US President Donald Trump

Amid uncertainties posed by major powers such as the US and China, Japan and Europe are strengthening their ties. The scope of Japan-EU cooperation could potentially expand to include the development of rare earth resources in Greenland

Tencent Holdings has unveiled its most comprehensive AI and cloud strategy to date, opening its artificial intelligence capabilities and confirming full compatibility with China's mainstream domestic processors. The company framed AI as a core driver of industrial efficiency and global expansion, aligning with Beijing's tech self-sufficiency agenda amid tightening US export restrictions

Just as Washington and Beijing are preparing to resume trade talks, China's State Administration for Market Regulation (SAMR) has thrown a wrench into the works. The agency accused Nvidia of violating the country's antitrust laws, putting the company back in the spotlight just months after a controversy over its H20 chips had begun to fade

Global DRAM shipments saw their sharpest increase in nearly two years during the second quarter of 2025, solidifying SK hynix's lead over Samsung Electronics. The surge was driven by the rapid expansion of artificial intelligence, with high-bandwidth memory, or HBM, emerging as the key growth engine for the sector

Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment suppliers are racing to bring their systems to market ahead of that transition