At the 2025 ZGC Forum, Chinese chipmaker Loongson introduced the 3C6000/D—its first dual-socket 2U server fully designed and manufactured in-house. The launch highlights China's efforts to advance homegrown high-performance computing (HPC) technologies amid tightening US export restrictions and signals progress in building domestic alternatives to foreign server chips

Towa, a prominent name in Japan's semiconductor manufacturing equipment industry, has introduced a new technology specifically designed for the sixth-generation high bandwidth memory (HBM4) advanced packaging. In addition to this development, the company revealed a strategic three-year midterm plan set to culminate in March 2028. The aim is to expand its sales channels throughout Asia for its leading equipment. Towa forecasts a 31% increase in consolidated revenue from March 2025 figures, expecting it to reach JPY71 billion (US$473.97 million), while net profit is projected to rise by 39% to JPY10.9 billion

At the 2025 ZGC Forum in Beijing, held from March 27 to 31, artificial intelligence (AI) dominated the agenda. At the event's flagship "Future AI Pioneer Forum," 01.AI CEO and Sinovation Ventures founder Kai-Fu Lee shared his perspective on the trajectory of generative AI in China

As China rapidly advances in artificial intelligence, local smartphone brands are integrating AI technology to strengthen their market positions. Meanwhile, Apple has yet to launch its AI chatbot in China, raising questions about its ability to compete. Given China's strong demand for AI services, Apple must collaborate with local firms to meet regulatory requirements and remain relevant in the market

Rapidus officially launched its IIM-1 semiconductor fab in Chitose City, Hokkaido, on April 1, marking a major milestone in Japan's ambition to produce cutting-edge 2nm chips. However, company executives caution that improving yield rates and securing future customers remain key challenges, reports Nikkei and Bloomberg

Chinese companies like BYD are now leaders in autonomous driving technology, bolstered by a strong ecosystem and government support, putting significant pressure on Tesla

Samsung Electronics Chairman Lee Jae-yong was recently joined by senior executives from the company's semiconductor and display departments on a rare visit to China. Industry analysts in South Korea say the joint trip is highly unusual and likely points to a strategic pivot in Samsung Group's China operations

Rapidus, a Japanese company focused on semiconductor innovation, officially opened its first facility, IIM-1, in Chitose City, Hokkaido, on April 1, 2025. Aiming to advance in the production of next-generation semiconductors, the company has commenced operations on a trial production line dedicated to 2nm chips

Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting April 1. This marks the company's first price hike for TCB equipment, according to reports from South Korean media outlets ET News and Money Today

China's electronic product trade-in initiative is driving stronger electronics sales in the first half of 2025, with the smartphone sector showing particular strength. Industry sources report that Chinese smartphone sales are growing compared to the same period in 2024, with flagship models capturing an increased market share

Among China's six Hangzhou start-ups, Unitree Robotics is one of the standout players. Founded in 2016, Unitree has been consistently profitable since 2020, achieving steady growth year after year. How has Xingxing Wang, a Chinese entrepreneur and founder of Unitree, managed to achieve such remarkable success

In a remarkable power shift over the past decade, Xiaomi has transformed from an industry underdog to a dominant force. While CEO Lei Jun once waited hours to secure Samsung display panels, Samsung's chairman now visits Xiaomi's electric vehicle (EV) factory. Similarly, Xiaomi has surpassed Chinese home appliance giant Gree in revenue and market value, with its ecosystem strategy proving superior to Gree's single-product focus in today's digital economy

LG Innotek is expanding its focus beyond camera module manufacturing and is preparing to venture into the field of next-generation glass substrates. The company has revealed its intention to produce sample glass substrates by the end of 2025, with plans to potentially commercialize these products by 2027