Below are the top DIGITIMES Asia stories from November 3 to November 10, 2025.
LGES probes alleged leak linked to India's Ola Electric
LG Energy Solution (LGES) is investigating a serious security breach after a former researcher at its China branch allegedly stole and sold confidential high-density battery technology to India's Ola Electric. The stolen data, related to next-generation batteries classified as "national core technology" by South Korea, was reportedly leaked in November 2023. The researcher has been referred to prosecutors, and the incident has raised significant concerns about industrial espionage and the protection of critical technologies, especially as Ola Electric is also an LGES customer.
ASML reframes its China strategy with advanced packaging debut of TWINSCAN XT:260
ASML has unveiled a strategic new tool, the TWINSCAN XT:260, marking its first major push into the advanced packaging market. This new lithography system is designed for 3D chip integration and delivers up to 4x the productivity of current tools, offering a cost-effective solution for manufacturing complex chips. The system's launch in China highlights a significant pivot for ASML, allowing the company to strengthen its business in the critical packaging sector, which is essential for AI and high-performance computing, even as it navigates export restrictions on its top-tier chipmaking machines.
Exclusive: Samsung delays DDR5 contract pricing to mid-November as spot prices triple
A severe memory shortage, driven by surging AI demand and increased spending from major cloud providers, is intensifying. Samsung Electronics unexpectedly halted its DDR5 contract pricing in October, delaying it until mid-November, a move quickly followed by SK Hynix and Micron. This has triggered chaos in the spot market, causing DDR5 prices to more than double since late September and shifting the industry into a "seller's market," leaving many buyers unable to secure inventory.
Jensen Huang dined with CC Wei tonight in Tainan and will attend TSMC's annual sports day in Hsinchu
Nvidia CEO Jensen Huang is in Taiwan for his fourth visit this year, underscoring the critical partnership with TSMC. He toured TSMC's advanced 3nm fab in Tainan and later dined with CEO CC Wei and other top executives. Huang, who stated "business is very strong," will also attend the company's annual sports day alongside founder Morris Chang to personally thank the team for its crucial support in manufacturing Nvidia's high-demand AI chips.
Nexperia China accuses Dutch parent of US$140 million debt
A major internal conflict at semiconductor firm Nexperia has escalated, with its Chinese arm publicly accusing the Dutch headquarters of owing it over US$140 million in unpaid fees. This accusation is a direct response to the Dutch parents' recent decision to halt wafer shipments to Nexperia's key facility in Dongguan, China. The dispute is rooted in the Dutch government's 2024 seizure of the company from its Chinese parent, Wingtech, citing national security concerns. Nexperia China insists its operations remain stable as it is securing new suppliers.
TSMC unveils four-year price hike for advanced chips starting 2026
TSMC has informed global customers of a rare, four-year price hike on its advanced chips, effective from 2026. This new strategy, affecting 5nm, 4nm, 3nm, and sub-2nm nodes, is driven by soaring AI demand and the high costs of its overseas fabs, like the one in Arizona. The steepest increases, approaching 10% annually, will target AI and HPC chips, while some major customers like Qualcomm and MediaTek are reportedly exploring alternatives in response.
Samsung's HBM4 yields surge toward Nvidia certification, SK Hynix keeps edge
Nvidia is evaluating HBM4 memory for its next-generation "Rubin" AI chip, setting off a fierce race between its suppliers. While SK Hynix still holds a timing advantage, Samsung has dramatically closed the technical gap, with its HBM4 yields surging to 50% and securing its position as a "core partner." Both South Korean companies are already sold out for 2026 and are aggressively expanding fab capacity, yet the industry still faces a massive supply bottleneck, with the HBM shortage projected to exceed 40% by 2027 as AI demand continues to soar.
Article edited by Jack Wu
