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Thursday 11 December 2025
Commentary: China's PCB edge survives G2 decoupling
As the US–China tech confrontation drags on, discussions consistently return to chips, semiconductors, rare earths, and tariffs. Despite accelerating supply-chain decoupling and overseas clients pushing for "Out-of-China" capacity, China remains the world's largest PCB manufacturing base and has fully captured both the volume and value gains from the AI server cycle. The country continues to demonstrate cost and efficiency advantages over production in Taiwan and Southeast Asia
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Friday 12 December 2025
Exclusive: Ex-TSMC R&D VP on advanced packaging and Morris Chang's vision
Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's leadership
Tuesday 9 December 2025
Commentary: Are East Asia tensions a threat to supply chains?
The Indo-Pacific region has become the world's most critical theater for both technology manufacturing and geopolitical competition. As military tensions escalate across East Asia, executives are increasingly questioning whether their supply chains can withstand potential disruptions
Tuesday 9 December 2025
Analysis: Why isn't Huawei trying to win the tech war?
Huawei founder Ren Zhengfei recently gave a public talk at the Huawei Lianqiuhu R&D Center in Shanghai. He shared insights on AI, quantum computing, computing power, and chips. He also answered questions from domestic and foreign researchers about the US-China tech competition
Monday 8 December 2025
Research Insight: Strong momentum expected for data center AI chip packaging in 2025-2030
According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center AI chip category includes high-end and mid-range GPUs, application-specific AI chips (such as Google's TPUs), AI server CPUs, and networking/interconnect-related chips (e.g., Switch ASICs/rack-scale-up Interconnect Chips/DPUs & NICs)
Monday 8 December 2025
Research Insight: 800V systems, LiDAR, and multi-screen cabins dominate China's 2025 models
The 2025 Guangzhou International Automobile Exhibition concluded on Nov. 30, offering one of the clearest snapshots yet of where China's auto market is headed. After an on-site review of the show, DIGITIMES identified three defining trends for China's 2025 model-year vehicles: the rise of 800V high-voltage architectures, the rapid adoption of roof-mounted front LiDAR, and the emergence of multi-screen cabins. Together, these features are becoming essential for any carmaker hoping to compete in the world's largest auto market
Friday 5 December 2025
Commentary: Infineon-Innoscience GaN ruling delivers 'disputed victory' for both sides
The US International Trade Commission (ITC) has issued its initial determination in Infineon's Section 337 case against China-based GaN supplier Innoscience. In a telling move that reveals the stakes of the dispute, both companies immediately declared victory
Thursday 4 December 2025
Commentary: Micron exits consumer memory market as structural chip shortage hits
Micron has announced it will exit its Crucial consumer product business, including SSDs and memory modules, with all shipments ending by February 2026. This move amid escalating memory supply shortages signals that the chip scarcity is no longer a temporary issue but a structural challenge reshaping the entire industry
Thursday 4 December 2025
Commentary: Why Onsemi, STMicro, and Nvidia are all converging on Innoscience's GaN factory floor
Onsemi and Innoscience have signed a memorandum of understanding to expand mass production of GaN power devices using Innoscience's mature 8-inch GaN-on-silicon technology. Onsemi expects component sample testing for the jointly developed devices to begin in the first half of 2026
Thursday 4 December 2025
Exclusive: Qualcomm SVP says AI PC still in early stage, focuses on tech and market education
Qualcomm is hosting another summit with Taiwan's local PC ecosystem by the end of 2025, following its 2023 event. Kedar Kondap, Qualcomm's senior vice president responsible for PC and gaming computing divisions, delivered a keynote speech in Taiwan and spoke exclusively with DIGITIMES
Tuesday 2 December 2025
Column: Quantum software growth accelerates
The UN has designated 2025 as the International Year of Quantum Science and Technology, recognizing significant breakthroughs in quantum hardware, quantum error correction, and practical quantum applications throughout the year. Research firm QURECA reports that worldwide investment in quantum technologies has exceeded US$55.7 billion, reflecting growing global interest
Tuesday 2 December 2025
Interview: Cybercrime enters AI-driven era with precise, scalable attacks, experts warn
Cybercriminal networks are evolving rapidly as artificial intelligence (AI) reshapes the landscape of cyber threats. Derek Manky, vice president of global threat intelligence at Fortinet, described the current phase as a third-generation cybercrime era marked by "AI-enabled scale." Unlike earlier attacks that used automated scripts to cast wide nets, today's cyber assaults employ AI to carry out highly tailored strikes against numerous victims simultaneously
Monday 1 December 2025
Commentary: Nvidia’s trillion-dollar test as the AI build-out hits a harder phase
Michael Burry, famed for predicting the 2008 financial crisis, has launched a paywalled Substack called Cassandra Unchained. In his debut post, he targets the AI boom and warns that Nvidia may now sit in the same systemic hotspot Cisco occupied during the dot-com era
Monday 1 December 2025
Commentary: TSMC veteran's Intel defection exposes cracks in Taiwan's silicon shield
Since April 5, 2025, a series of geopolitical tensions have unfolded—from US President Donald Trump's remarks and reciprocal tariffs to Japanese Prime Minister Sanae Takaichi's public comments on sensitive Taiwan-related issues. These developments have forced the global semiconductor industry to confront mounting political risks
Friday 28 November 2025
Commentary: Taiwan's IC design edge in ASIC development
Taiwan's IC design sector has rapidly expanded in the application-specific integrated circuit (ASIC) market, driven by growing demand for AI applications. MediaTek has entered Google's TPU supply chain, Alchip Technologies has secured new Amazon Web Services programs, and Global Unichip (GUC) continues to win additional projects. Market chatter indicates GUC has landed the full back-end turnkey order for Tesla's AI5 chip, expected to contribute revenue starting in 2027
Friday 28 November 2025
Analysis: Auto suppliers push into robotics and servers as traditional markets cool
In recent years, a growing number of Taiwanese auto–parts suppliers have accelerated their push into the robotics and server supply chains. Most remain in the sampling or small-batch shipment stage, but industry analysts say their products are often highly interchangeable. As a result, turning this cross-sector move into a meaningful revenue surge remains challenging