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Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS

Julian Ho, Feature; Charlene Chen, DIGITIMES Asia Monday 8 December 2025 0

Former TSMC R&D vice president Douglas Yu (R). Credit: DIGITIMES

Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending Moore's Law amid its slowdown. He emphasized how these innovations...

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