When companies discuss ESG, they often emphasize environmental issues and compliance while paying less attention to employee health, a key component of the social dimension, according to Saxon Chen, founder and CEO of Taiwanese digital health technology company H2U Corp.
GMI Cloud is making Taiwan a key part of its global AI infrastructure expansion, with a US$500 million investment in an AI factory powered by Nvidia's Blackwell GPUs. Announced in late 2025, the facility is expected to deploy roughly 7,000 GPUs and serve customers including Trend Micro and Wistron.
India's new semiconductor incentive regime is putting more capital at risk for manufacturers, but the first wave of investment commitments suggests lower subsidies have not stopped companies from considering fresh projects.
After more than a decade away, Apple may be preparing to return to the enterprise server market. According to The Information, as reported by Reuters, the company is developing an enterprise AI server powered by its planned M8 Ultra chip and has discussed adopting Nvidia's NVLink Fusion interconnect technology.
When Donald Trump and Xi Jinping discuss artificial intelligence, the deeper divide may not be over whether AI needs rules, but over what those rules are designed to protect.
Online rumors that Huawei founder Zhengfei Ren and his family had disappeared from public view have reignited concern over the fate of Chinese technology executives. Ren's younger daughter, Annabel Yao, appeared at a Beijing press conference on September 14, but China's new exit-and-entry rules took effect the next day, drawing fresh attention to executives who have fled, vanished, or faced restrictions.
Foxconn Group's electric vehicle business is entering a new phase as it shifts from proving the concept to preparing for mass production and wider regional expansion. The change could reshape Taiwan's auto industry and strengthen Foxconn's case as a cross-border EV manufacturer with ambitions far beyond its home market.
Following Apple's executive transition, former CEO Tim Cook and new chief John Ternus have presented contrasting visions for the next generation of mobile devices, spotlighting a key strategic divide as the company prepares for the post-iPhone era.
The industry has converged on a single precondition for consumer adoption of augmented reality (AR) glasses: the product must look like ordinary eyewear. The China International Optoelectronic Exposition (CIOE) 2026 showed how differently the two critical component groups — microdisplays and waveguides — are responding to that constraint. Microdisplay makers are trading away a modest amount of resolution for smaller Micro LED panel areas, pushing light engines below 0.1cc, and pairing those engines with geometric, surface-relief, and volume-holographic waveguides from multiple suppliers to demonstrate complete near-eye modules and, in some cases, complete glasses. Taken together, the show indicates that AR display technology has reached a workable level of maturity.
A new Anthropic threat intelligence report offers an unusual glimpse into how advanced AI systems are being used under heavy, real-world workloads. The findings suggest that the decision to buy or host AI servers may depend less on model quality alone, and more on which tasks consume tokens, how long they run, and how much operational state they must preserve.
DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and I/O channels but also in integration complexity. Higher integration of high-bandwidth memory (HBM), high-speed SerDes, and chiplet designs makes signal transmission, power delivery, and component interconnects within the package far more complex, driving high-end IC substrates toward larger surface areas and higher layer counts.
The extraordinary technological progress humanity has witnessed since AI first emerged has propelled a fundamental shift in industrial development. With experts hailing AI as the next phase of the digital revolution and an extension of Industry 4.0, the technology is increasingly reshaping how industries operate.
Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass substrates are increasingly common as packaging moves deeper into system-level design.
China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have highlighted ultra-wide bandgap (UWBG) semiconductor materials, including gallium oxide (Ga₂O₃) and synthetic diamond, in their draft development plan for the electronic information manufacturing sector.
