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Saturday 11 July 2026
Interview: Why Geckos bets materials, not chips, will decide the next AI performance leap
As generative AI fuels rapid growth in demand for high-performance computing (HPC), the semiconductor industry is shifting from a process race to a materials race. Geckos chairman Shen Tsung-huan says that as chip manufacturing moves to 2nm and even more advanced nodes, gains in AI computing power are no longer just a chip design issue, but are increasingly constrained by the thermal conductivity and high-frequency signal transmission capabilities of materials.
Friday 10 July 2026
Insight: TSMC's 2nm lead widens, Intel 14A slips beyond 2030, Samsung 4nm fills on HBM4 demand
Samsung Electronics' preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence analyst Luke Lin examined the actual progress of advanced-node capacity expansion at TSMC, Intel, and Samsung, arguing that market expectations in several areas have run ahead of reality.
Thursday 9 July 2026
Commentary: China's AI chip race leaves 15 chipmakers chasing SMIC's 7nm capacity
China's bid to replace Nvidia in AI chips faces a constraint more immediate than design capability: SMIC's limited 7nm-class manufacturing capacity.
Thursday 9 July 2026
Analysis: Sovereign AI is chipmaking's next growth driver — but not everyone gets a seat
Where will cloud AI's next wave of growth come from? Increasingly, the market is answering with two words: sovereign AI.
Thursday 9 July 2026
Interview: UK courts Taiwan suppliers for AI hardware buildout
The UK is pitching itself as a new base and technology partner for Taiwanese electronics suppliers, seeking to turn its AI infrastructure push into a market and investment opportunity for companies in chips, packaging, servers, cooling, power, and data centers.
Tuesday 7 July 2026
Exclusive: Geckos bets on AI materials beyond nano copper powders and CPO waveguides
As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos chairman Raymond Shen said that once chip manufacturing advances to 2nm and beyond, improvements in AI computing power are no longer just a chip-design issue, but are increasingly constrained by materials' heat dissipation and high-frequency signal transmission capabilities.
Tuesday 7 July 2026
Interview: Corning's GlassBridge points to longer-term packaging shifts, not an immediate FAU replacement
Corning has unveiled an early-stage fiber-to-chip connector concept that could reshape optical packaging if it matures, though the company says the technology is still far from commercial use. GlassBridge is aimed at passive alignment in advanced systems, underscoring the convergence of AI infrastructure, photonics, and packaging.
Monday 6 July 2026
Exclusive Interview: Dutch startup Nearfield bets on process control to rival EUV in AI chip manufacturing
As Moore's Law approaches its physical limits, simply shrinking semiconductor process nodes is no longer the sole path to improving chip performance.
Monday 6 July 2026
Exclusive Interview: Dutch startup Nearfield targets AI chip process control expansion after US$380 million funding round
Dutch semiconductor equipment startup Nearfield Instruments has completed a US$380 million Series D funding round, the largest-ever fundraising for a Dutch deep-tech company. The company is now targeting an initial public offering (IPO) in 2028.
Monday 6 July 2026
Analysis: AI supercycle could drive semiconductor market beyond US$2 trillion by 2030
The global semiconductor market is entering a historically significant growth phase. According to WSTS's latest June forecast, global semiconductor revenue is projected to grow by nearly 90% in 2026, reaching approximately US$1.5 trillion. Growth is expected to remain exceptionally strong in 2027, with year-on-year expansion of around 27%, pushing total market revenue close to US$1.9 trillion.
Monday 6 July 2026
Analysis: Taiwan's semiconductor sector enters 2026 helium crunch, with nearly 90% dependent on Qatar
Taiwan's chipmakers walked into the 2026 helium supply shock more exposed to Qatar than any other major buyer, sourcing nearly 88% of their rare-gas imports from the Gulf state in 2025, up from 46% four years earlier. With war disrupting the Strait of Hormuz, that concentration leaves fabs vulnerable and the outlook uncertain.
Sunday 5 July 2026
From Bloomberg to DIGITIMES: building a media model for the AI era
Manhattan is where financial giants gather. By the weekend, the crowds become so dense that near Times Square, even moving through the streets can be difficult. At moments like this, a walk through Central Park becomes the best choice. With its forests, streams, and seemingly natural ecology, and with plane trees, pines, and olive trees arranged in irregular patterns, Central Park truly is the best place for New Yorkers to rest in the heart of the city.
Saturday 4 July 2026
Commentary: Korea's KRW800tn chip bet risks US fab pressure while Apple profits from memory shock
South Korean President Lee Jae-myung, Samsung Electronics, and SK Hynix have announced the country's largest-ever semiconductor expansion plan, while soaring memory prices have opened a separate fight between Micron and Apple.
Friday 3 July 2026
Analysis: China moves against oversized EV batteries to address fiscal and supply-chain concerns
China's state media is increasingly framing large-capacity electric vehicle (EV) batteries as a policy issue, not just a market trend. The messaging points to two priorities: reducing fiscal strain from EV incentives and strengthening state control over strategic materials and pricing across the new-energy sector.
Friday 3 July 2026
Analysis: Innoscience-Infineon clash shows China's courts becoming a weapon in the global GaN race
A rare gallium nitride (GaN) patent clash dominated the opening day of electronica Shanghai 2026, after China's Innoscience accused Infineon of displaying GaN power products covered by a Chinese court injunction.