Autonomous driving and smart cockpit technologies are pushing vehicles to demand far more computing power and data processing. Memory has become a critical component in automotive system performance. But as demand surges, AI applications are reshaping the global memory supply chain — reallocating capacity and creating structural pressures that are tightening supply and driving up prices

Amid the rapid advancement of generative AI and the simultaneous rise of autonomous vehicles and robotics, industry competition is shifting away from pure computing power and hardware scaling toward deeper control of "perception capabilities" and "real-world data.

China is reportedly planning targeted export rules for heterojunction (HJT) solar equipment. The move has sparked broad industry debate in 2026, as energy transition and aerospace development grow increasingly intertwined. More than a trade measure, it reflects a cross-domain effort to protect technological sovereignty and keep core R&D value within China

The AI chip race is increasingly running into a different kind of limit — not compute, but packaging, as supply constraints around advanced technologies such as CoWoS begin to tighten

One year into his tenure, Intel CEO Lip-Bu Tan struck a markedly different tone on the company's outlook. At the first-quarter 2026 earnings call, he said the debate a year ago centred on whether Intel could survive. Today, the focus has shifted to how quickly it can expand capacity and scale its supply chain to meet surging demand

The 2026 Beijing Auto Show has emerged as a platform where the balance of competition is shifting from sheer vehicle counts to advanced self-driving systems, AI-powered cockpits, and integrated supply chain collaborations, DIGITIMES Research observed. The event showcased both domestic and foreign manufacturers alongside key automotive intelligence suppliers

Elon Musk has a habit of building what he cannot buy

The Beijing Humanoid Robot Half Marathon has concluded, but its outcome has ignited a wider industry debate. Rather than a leading robotics specialist, smartphone maker Honor emerged as the unexpected winner — raising questions over whether the company's success reflects genuine technological strength or exposes lower-than-expected barriers in the humanoid robotics sector

Chinese smart home appliance brands have swept across global consumer markets on the strength of youthful, innovative brand images. Analysts point to one defining trait: product iteration cycles so fast that even European and American rivals struggle to match them. That pace, combined with a recent wave of acquisitions targeting Western and Japanese brands, has given Chinese makers growing momentum and an increasingly firm grip on the global home appliance market

As competition in the semiconductor industry intensifies, TSMC maintains its lead while actively supporting the domestic supply chain. In recent years, driven by the need for cost reduction, breaking international monopolies, and the ability to respond rapidly to disruptions, TSMC has taken multiple actions to nurture local suppliers. Notably, TSMC has played a critical role as a "supply chain stabilizer," stepping in during key moments

The global AI industry is shifting into an inference cost war in 2026, with DeepSeek V4 accelerating changes across China's semiconductor supply chain. By positioning Huawei's Ascend chips as viable alternatives to Nvidia GPUs, DeepSeek reframes competition beyond software versus hardware. The shift cuts deeper, reshaping how AI systems are architected from the ground up

For years, the global auto industry has been enveloped in the promise of the software-defined vehicle. But at the 2026 Beijing International Automotive Exhibition, a more grounded reality came into focus: without sufficiently powerful hardware, software ambitions risk remaining just that—ambitions

Texas Instruments (TI) plans to showcase its 800V power architecture-based AI data center solutions at Computex 2026, featuring applications in humanoid robots, automotive, and edge AI. Ahead of the event, TI executives have been engaging with local Taiwanese supply chains to explore collaborations

Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level to panel-level, bringing fan-out panel-level packaging (FOPLP) into the spotlight. At the intersection of these trends, Taiwan's panel manufacturers are actively entering the semiconductor packaging field in search of new growth momentum

Honor's surprise win at this year's Beijing humanoid robot half-marathon has stirred industry debate, not only for its on-track performance but for what the move signals about shifting competitive dynamics. The smartphone maker's cross-sector push into robotics has reignited questions over whether embodied AI and humanoid systems could trigger a new round of market reshuffling