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Monday 4 May 2026
Commentary: Intel names TSMC as key partner; insider drives its comeback
One year into his tenure, Intel CEO Lip-Bu Tan struck a markedly different tone on the company's outlook. At the first-quarter 2026 earnings call, he said the debate a year ago centred on whether Intel could survive. Today, the focus has shifted to how quickly it can expand capacity and scale its supply chain to meet surging demand
Monday 4 May 2026
Research Insight: Beijing auto show signals shift from vehicle launches to AI-driven supply chains
The 2026 Beijing Auto Show has emerged as a platform where the balance of competition is shifting from sheer vehicle counts to advanced self-driving systems, AI-powered cockpits, and integrated supply chain collaborations, DIGITIMES Research observed. The event showcased both domestic and foreign manufacturers alongside key automotive intelligence suppliers
Friday 1 May 2026
TeraFab is already changing the semiconductor landscape — before a single chip is made
Elon Musk has a habit of building what he cannot buy
Friday 1 May 2026
Commentary: Honor's robot win highlights thermal edge in robotics
The Beijing Humanoid Robot Half Marathon has concluded, but its outcome has ignited a wider industry debate. Rather than a leading robotics specialist, smartphone maker Honor emerged as the unexpected winner — raising questions over whether the company's success reflects genuine technological strength or exposes lower-than-expected barriers in the humanoid robotics sector
Thursday 30 April 2026
Analysis: Chinese smart home brands outpace Western rivals with relentless innovation
Chinese smart home appliance brands have swept across global consumer markets on the strength of youthful, innovative brand images. Analysts point to one defining trait: product iteration cycles so fast that even European and American rivals struggle to match them. That pace, combined with a recent wave of acquisitions targeting Western and Japanese brands, has given Chinese makers growing momentum and an increasingly firm grip on the global home appliance market
Wednesday 29 April 2026
Commentary: How TSMC anchors Taiwan's semiconductor supply chain from within
As competition in the semiconductor industry intensifies, TSMC maintains its lead while actively supporting the domestic supply chain. In recent years, driven by the need for cost reduction, breaking international monopolies, and the ability to respond rapidly to disruptions, TSMC has taken multiple actions to nurture local suppliers. Notably, TSMC has played a critical role as a "supply chain stabilizer," stepping in during key moments
Wednesday 29 April 2026
Commentary: China's chip-model strategy pressures Nvidia's AI economics
The global AI industry is shifting into an inference cost war in 2026, with DeepSeek V4 accelerating changes across China's semiconductor supply chain. By positioning Huawei's Ascend chips as viable alternatives to Nvidia GPUs, DeepSeek reframes competition beyond software versus hardware. The shift cuts deeper, reshaping how AI systems are architected from the ground up
Wednesday 29 April 2026
Commentary: At Beijing Auto Show, hardware takes the wheel
For years, the global auto industry has been enveloped in the promise of the software-defined vehicle. But at the 2026 Beijing International Automotive Exhibition, a more grounded reality came into focus: without sufficiently powerful hardware, software ambitions risk remaining just that—ambitions
Wednesday 29 April 2026
Texas Instruments executive discusses high-voltage power architecture for AI data centers
Texas Instruments (TI) plans to showcase its 800V power architecture-based AI data center solutions at Computex 2026, featuring applications in humanoid robots, automotive, and edge AI. Ahead of the event, TI executives have been engaging with local Taiwanese supply chains to explore collaborations
Wednesday 29 April 2026
Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key
Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level to panel-level, bringing fan-out panel-level packaging (FOPLP) into the spotlight. At the intersection of these trends, Taiwan's panel manufacturers are actively entering the semiconductor packaging field in search of new growth momentum
Tuesday 28 April 2026
Commentary: Honor retools for humanoid robotics, rewrites AI device playbook
Honor's surprise win at this year's Beijing humanoid robot half-marathon has stirred industry debate, not only for its on-track performance but for what the move signals about shifting competitive dynamics. The smartphone maker's cross-sector push into robotics has reignited questions over whether embodied AI and humanoid systems could trigger a new round of market reshuffling
Tuesday 28 April 2026
Analysis: Why Tokyo Electron's China problem goes deeper than a data breach
Amid growing geopolitical tensions over the global semiconductor supply chain, what initially appeared to be an internal personnel matter is evolving into a broader case study of the operational risks that foreign equipment vendors face in China
Tuesday 28 April 2026
Commentary: What Amap reveals about AI navigation, data control
AI-powered navigation platforms such as China's Amap are forcing a rethink of how convenience, competition, and data governance intersect. The debate in Taiwan over Amap's near-real-time traffic light countdown and high-precision navigation reflects a broader shift in how mobility data is collected, processed, and monetized
Tuesday 28 April 2026
Commentary: Tim Cook's sole omission during 15-year tenor
On December 6, 2022, Tim Cook stood on a construction site in Phoenix, Arizona, alongside President Biden, TSMC founder Morris Chang, and Nvidia CEO Jensen Huang. It was the tool-in ceremony for TSMC's first Arizona fab, a moment that crystallized how central Taiwan's semiconductor industry had become to American technology ambitions. For Cook, it was also the closest he ever got to TSMC's leadership in 15 years as Apple's CEO
Monday 27 April 2026
Analysis: Beijing Auto Show signals new phase in China's EV race
The 2026 Beijing International Automotive Exhibition opened on April 24 with a scale that stands in sharp contrast to the contraction of many global auto shows. Spanning roughly 380,000 square meters and drawing more than 2,000 exhibitors, the event has become one of the clearest barometers of where the automotive industry is heading