GlobalFoundries (GF) has reached a multiyear manufacturing agreement with TSMC to expand silicon interposer capacity at its Malta fab in New York, supplying TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced-packaging ecosystem. The agreement is expected to be worth US$2 billion over an initial five-year term.

China's planned cut to export tax rebates for new energy vehicles could ripple through global auto markets, intensifying pressure on low-cost exporters while reshaping trade tensions with Europe. The move signals a wider rollback of industry support and may accelerate consolidation among weaker carmakers and raise prices for some overseas buyers.

After 2013, planar NAND flash memory began reaching its scaling limits at the 15–16nm process node. Capacitive coupling between the floating gates of adjacent memory cells increasingly disrupted their threshold voltages, making stored data harder to read reliably. The problem became particularly acute with the adoption of triple-level cell (TLC) NAND, which requires precise threshold-voltage detection. Changes in the charge stored by neighbouring cells could alter those voltages, making further planar scaling increasingly difficult.

Elon Musk's recent confirmation that his "TeraFab" initiative is in talks with Taiwan Semiconductor Manufacturing Co. (TSMC) signals that a project originally framed as a challenge to the established foundry model is pivoting toward a more pragmatic industrial path, according to DIGITIMES analyst Luke Lin.

Microsoft's in-house Azure Maia chips will become the main platform for its own AI services, including Microsoft 365 Copilot, GitHub Copilot and Microsoft Foundry. However, the company will keep using GPUs from Nvidia and AMD, Andrew Wall, general manager of the Azure Maia program, told DIGITIMES.

Meta's recent introduction of its personal AI agent, Muse, has renewed interest in AI assistants capable of operating across devices. Unlike conventional AI features tied to individual smartphones, computers or vehicles, personal AI agents use memory, reasoning and tools to understand user needs and maintain personalised experiences across services and devices. DIGITIMES observes that this shift could extend AI agents into vehicles, transforming smart cockpits from standalone in-car systems into connected environments integrated with smartphones, wearables and personal digital services.

Largan chairman Adam Lin spoke about the company's cautious smartphone outlook while taking a more aggressive stance on co-packaged optics (CPO) during a recent online earnings briefing. His comments on order trends, gross margins, and 2026 visibility highlight three simultaneous pressures facing the smartphone camera-lens industry.

AI data centers are shifting toward faster networking architectures, with optical transceivers advancing from 800G and 1.6T toward 3.2T. Yet China's ability to retain its position in the global AI data center supply chain may increasingly depend on more than technology and manufacturing capacity. Potential US supply-chain restrictions are emerging as another critical variable.

AI is changing the logic of telecom traffic growth, with Ericsson and industry researchers warning that mobile networks must now handle not only more data, but also more uplink traffic, real-time interaction, and connected-on-the-move usage. As generative AI, agentic AI, and multimodal interactions spread, telecom operators are being pushed to rethink network investment beyond downlink capacity.

As the demand for green energy surges in parallel with order volumes and production capacity, scheduling for energy storage systems has become a critical technology to solve the problem of excess power for major tech firms, according to Kelsey Kuan, general manager of HD Renewable Energy subsidiary Star Trade. In an interview with DIGITIMES, Kuan also highlighted the rising technological barriers for electricity sellers, as the business now requires AI forecasting, transfer matching, energy storage, and integrated renewable-energy capabilities.

The European enterprise networking market has cleared its multi-year inventory digestion period. According to CONTEXT, sell-through via European distribution channels is growing in the low double digits entering 2026 across core infrastructure categories, including switches and enterprise wireless access points. That contrasts with the "heavy double-digit declines" the channel saw during COVID-19, said CONTEXT principal analyst Aaron Smith.

Elon Musk has moved to quell uncertainty over Intel's position in the Terafab chip project, stressing that his companies will build and operate the planned semiconductor complex themselves while limiting any potential TSMC involvement to subleasing part of the site.

The boundary for adopting external capacity is changing, as workloads that previously needed memory offload because of insufficient high-bandwidth memory (HBM) can now run directly on next-generation GPUs. As a result, demand for external capacity is shifting toward scenarios with higher memory requirements and deployments designed to extend the usable life of existing GPUs.

Chinese notebook original design manufacturers (ODMs) are rapidly catching up, with supply chain sources saying Huaqin and Luxshare have won major orders from HP and Dell, sending shock waves through Taiwan's supply chain and threatening the future position of Taiwanese ODMs. Industry sources said the impact extends beyond 4-5 ODMs and will also hit more than 100 component suppliers.

Largan Precision will hold its earnings call on October 8, when the optical lens maker is due to report third-quarter results and outline its fourth-quarter outlook. With September revenue recovering and the company stepping up property acquisitions, investors are likely to focus on three issues: progress in co-packaged optics (CPO), capacity expansion and the pace of fourth-quarter customer orders.