Home Tech Semiconductors

CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR

Charlene Chen, DIGITIMES Asia, Taipei Apr 10, 2026, 11:01, Updated: Apr 10, 2026, 11:32 0

Credit: AFP

Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According to TSMC's disclosures in an interview with CNBC, demand...

The article requires paid subscription. Subscribe Now

Email address

Password

Keep me signed in

Keep me signed in

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

Enterprise first-time login?

Forgot your password?

Create your free account

Select premium stories & daily editor picks.
Leverage AI summaries for instant insights.
Receive tech briefings & newsletters.
Track financials & stock data of Taiwan tech.

No credit card required