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Weekly news roundup: Intel, Samsung, TSMC shift chip strategy, DDR4 surges, China rises in AI and CIS

Levi Li, DIGITIMES Asia, Taipei 0

Credit: AFP

Below are the most-read DIGITIMES Asia stories from June 9 to June 15, 2025. Highlights include major chipmaking advances, a DDR4 supply crunch, and shifting strategies from Intel, Samsung Electronics, and TSMC. From renewed EDA access in China to rising momentum among Chinese CIS suppliers, this roundup tracks the key forces reshaping the global semiconductor and AI landscape.

Intel to detail 18A milestones, strengthen supplier ties

At its Supplier Summit on June 11, Intel outlined progress on its 18A node and deepened ties with key partners, including ASML, Applied Materials, KLA, Lam Research, and Japan's Asahi Glass. Panther Lake processors have completed tape-out and are on track for a second-half 2025 launch, with mass production to follow. Intel will also debut a high-performance 18A-P variant and preview the 14A node using PowerVia and PowerDirect.

Intel spotlighted advanced packaging technologies, including Foveros Direct 3D, EMIB 2.5D, and cost-efficient FCBGA—vital to its AI and HPC strategy. Under CEO Lip-Bu Tan, the company is also expanding its foundry partnerships with US cloud leaders, including AWS and Microsoft Azure.

Samsung, Groq to produce world's fastest AI chip using 4nm process

At the SAFE Forum 2025 in San Jose, Samsung Foundry and Groq unveiled plans to mass-produce what they claim is the world's fastest AI chip in the second half of 2025. The language processing unit (LPU), built on Samsung's 4nm process, delivers major gains in throughput, efficiency, and size for robotics, autonomous vehicles, and 5G. Groq, backed by a US$1.5 billion Saudi deal, says the chip is production-ready, while Samsung is also investing and rolling out a client-centric HBM roadmap starting with HBM4.

EDA access quietly restored to some Chinese companies

After a June 5 call between US President Donald Trump and Chinese President Xi Jinping, Chinese IC firms report restored access to Synopsys' SolvNetPlus and Cadence's Support Portal—previously blocked under a May 29 export order. Though unconfirmed by either company, the move suggests a possible selective easing of restrictions for non-military users, prompting renewed focus on domestic EDA tools like Empyrean and Xpeedic.

South Korean equipment firms see Chinese memory makers flood premium orders

Amid tighter US export controls, Chinese memory firms CXMT and YMTC are urgently ordering tools from South Korean suppliers—some at up to 2x premiums, according to Hankyung. With fewer restrictions than US or Japanese vendors, South Korean firms have become key sources of DRAM and ALD equipment.

CXMT's Hefei fab is running at near full capacity with 100,000 wafers/month of 18.5nm DRAM, aiming to add 40,000 more—about 10% of global DRAM output. YMTC is pushing forward with Xtacking 3.0/4.0 NAND but faces yield issues with local tools. Both are fast-tracking supply chain localization.

TSMC adjusts global growth plans as Washington ramps up demands

TSMC is prioritizing US expansion with a US$165 billion investment while slowing projects in Japan and Germany due to weak auto chip demand and geopolitical risks. Kumamoto Fab 2 is delayed, and Fab 1 remains underutilized. In Germany, its joint fab with Bosch, Infineon, and NXP also faces delays. Capital and labor are being redirected to higher-demand US operations.

SmartSens lands Huawei flagship win as China's CIS upstarts squeeze Samsung

Huawei's Pura 80 Ultra, launching June 11, 2025, features a 1-inch CIS from China's SmartSens, the first domestic sensor in its flagship lineup. Now fifth globally with 11.2% market share, SmartSens doubled its 2024 revenue to CNY5 billion (US$696 million), driven by smartphones and automotive imaging. Alongside GalaxyCore and OmniVision, Chinese CIS players are challenging Sony and Samsung as the global market heads toward US$28.6 billion by 2029.

DDR4 crunch sends prices soaring 50%

DDR4 prices are soaring as Samsung, SK Hynix, and Micron reduce legacy output to prioritize DDR5 and HBM. Micron's DDR4 prices jumped 50% in June 2025, and Samsung's 8GB modules now fetch US$4.8, with 16GB reaching US$6, above some DDR5 prices. Nanya is stepping in, doubling 8GB DDR4 prices in China to US$2.5. Analysts expect prices to stay high through Q3, accelerating the move to DDR5.

Article edited by Jack Wu