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Wednesday 23 September 2015
Advantest to exhibit and present papers on its newest IC test solutions at the International Test Conference, October 6-8 in Anaheim, Calif
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857, NYSE: ATE) will demonstrate both hardware and online test solutions as well as present several papers at the International Test Conference (ITC), October 6-8 in Anaheim, Calif. Advantest is a Platinum sponsor of this year's conference.Products featured in the boothLive demonstrations of Advantest's on-demand CloudTesting Service and its EVA100 tester for analog, mixed-signal and sensor ICs will be given in booth #323 in the South Hall of the Disneyland Hotel.The first-of-its-kind CloudTesting Service allows users to access various IP selections whenever needed from Advantest's website. Using this on-demand online service, designers can verify their new silicon at very low cost with no capital investment. It allows users to set up their own test environment within a few hours and be ready to test when a device arrives from the fab. With free tester leasing and repairs, Advantest's CloudTesting Service allows customers to avoid maintenance issues and unplanned expenses.With its modular architecture and high-voltage, high-precision analog parametric measurement units, the EVA100 tester has the flexibility to conduct a wide range of measurements over a broad range of analog and mixed-signal devices. The EVA100's GUI interface is highly intuitive so users do not need advanced coding skills to quickly develop test programs and rapidly receive feedback on critical design parameters. This minimizes the time to release the latest ICs to market.Paper PresentationsIn addition to its exhibits, Advantest is involved in several presentations during ITC TestWeek.On Tuesday, October 6 at 1:20 p.m. at the Corporate Forum staged within the exhibit hall of the Disneyland Hotel, Advantest's A. Lum will host a discussion on rapid test development using the EVA100 system.That same afternoon at 2:00 p.m. during technical session #3 in the Magic Kingdom Ballroom 4, a paper will be presented on a new method of measuring alias-free aperture jitter in an ADC output. The authors are T. Yamaguchi and K. Uekusa of Advantest Laboratories, K. Degawa, M. Kawabata and M. Ishida from Advantest and M. Soma of the University of Washington.On Thursday, October 8 at 9:00 a.m. in technical session #21 on RF and high-speed testing in the hotel's Magic Kingdom Ballroom 2, a paper titled "An ATE System for Testing 2.4-GHz RF Digital Communication Devices with QAM Signal Interfaces" will be given. The authors are M. Ishida and K. Ichiyama of Advantest.In addition, Advantest will be a corporate sponsor of the 6th IEEE International Workshop on Testing Three-Dimensional Stacked ICs at Anaheim’s Disneyland Hotel on Friday, October 9, the day after ITC concludes. S. Neches of Advantest will host a tabletop presentation titled "Analysis of Advanced Semiconductor IC Devices Using Terahertz Frequency Technology," describing the company's new TS9000 THZ system that uses short-pulse terahertz and sub-terahertz frequencies to analyze advanced ICs.Connect on Social MediaFor the latest updates from the global test leader, follow Advantest on Twitter @Advantest_ATE.
Friday 18 September 2015
ASRock Rack 2U & 3U server solution supports the latest NVIDIA GRID 2.0
ASRock Rack, the innovative server technology provider has announced today its high density GPGPU server "2U2N-F" and "3U8G-C612" with the new NVIDIA GRID 2.0.NVIDIA GRID recently released the newest NVIDIA GRID 2.0 at VMWorld, the world's largest cloud and virtualization conference. NVIDIA GRID 2.0 delivers double the application performance and double the user density as well as support for Linux OS and blade servers to provide unprecedented speed, efficiency and flexibility for virtualized graphics in enterprise workflows. Employees can work from almost anywhere without delays in downloading files, increasing their productivity. IT departments can equip workers with instant access to powerful applications, improving resource allocation. And data can be stored more securely by residing in a central server rather than individual systems.NVIDIA GRID 2.0 combines enterprise software and support with the latest generation Maxwell GPU architecture-based Tesla M6 and Tesla M60 GPUs that were designed to deliver maximum performance and scalability for virtualized graphics workloads. ASRock Rack 2U2N-F and 3U8G-C612 are both configurable with four to eight GPU cards to support GRID 2.0. ASRock Rack recommends a minimum of four Tesla M60 GPUs for the best graphics performance for virtualization. Other PCIe slots are available for rich functionalities such as accelerating by PCIe SSD, Remote Direct Memory Access (RDMA) by SFP+ or InfiniBand, NVR or facial recognition system by capture cards, data back up by RAID cards and other high performance graphic cards for real time transcode.ASRock Rack will showcase 2U2N-F and 3U8G-C612 in the upcoming NVIDIA GTC Japan in Tokyo. Please come to visit us at booth number 13.ASRock Rack will showcase 2U2N-F and 3U8G-C612 in the upcoming NVIDIA GTC Japan in Tokyo
Friday 18 September 2015
New Unisys security products and solutions provide advanced protection against enterprise threats
Unisys Corporation (NYSE: UIS) today announced a range of advanced security products and solutions, including a new software-based release of its award-winning Unisys Stealth solution, which helps organizations protect their digital and physical assets in cloud, mobile and enterprise environments.The new security products and solutions, a key part of the company's growth strategy, were unveiled at its annual Americas Analyst and Advisor Summit in Dallas.Designed to protect vital information and infrastructure in the face of evolving threats from hackers and malware, the new solutions include products based on the latest version of Unisys Stealth software, which delivers identity-based micro-segmentation to protect sensitive data by making communication endpoints undetectable to unauthorized parties.The new Unisys Stealth products are completely software-based and can be immediately incorporated into an organization's existing eco-system including clients, servers, clouds, industrial control systems, Internet of Things, mobile devices, customers, and even supply chain partners.New Stealth products are part of a comprehensive portfolio of security solutions for location, perimeter and surveillance security; identity management and biometrics; secure image processing and analytics; as well as efficient managed services and global consulting to address all aspects of its clients' security requirements."With enterprises becoming increasingly interconnected environments and cyber threats becoming business threats, security professionals can no longer protect their enterprises with an outdated focus on building walls and counting events," said Tom Patterson, vice president and general manager for global security solutions, Unisys. "Instead, enterprises need to accept that bad guys will get in somehow, and they must layer in advanced defenses that minimize harm with identity-based micro-segmentation."Addressing the Convergence of IT and Physical SecurityThe Unisys Stealth family of products uses an advanced approach that helps organizations mitigate attacks and hacker incidents by rendering devices, data and end users undetectable on networks. The solution establishes secure "segments" within an enterprise where only authorized users can access information. Unauthorized users cannot access the information -- or even see that it exists. Even if a bad actor gets in, Stealth sees to it that they are cryptographically contained to a single segment of the network, with no access to move laterally to other parts of the enterprise.The new release of Unisys Stealth is based on a software design that eliminates operational costs associated with additional hardware and cuts deployment times by up to half. Leveraging global Internet Protocol Security (IPSec) standards, this latest version of Stealth code allows easier configuration and integration and provides a highly-enhanced interface for configuring, monitoring and managing the Stealth environment.Key product updates and new releases include:• Stealth(Core): Secures data using micro-segmentation and cryptography to limit a user's – or potential attacker's – view of data and services to only a tiny segment of the enterprise.• Stealth(Mobile): Enables authenticated and secure access to application processing environments in the data center from mobile applications by using application wrapping software to encrypt data-in-motion from the mobile app across the Internet.• Stealth(Cloud): Extends the same level of protection to enterprises that wish to leverage the cost-savings benefits of using the public cloud but have been reluctant to do so due to security concerns.Unisys also offers related security solutions including:• Physical Security and Identity Management: Unisys Location, Perimeter, and Surveillance Security solutions deliver comprehensive, end-to-end protection and are custom-built to clients' requirements - ranging from securing a room to securing a national border. Unisys' biometrics-based, service-oriented identity management platform provides high levels of multi-factor user authentication, combining fingerprint, iris, voice, signature and face with non-biometric credentials.• Managed Security Services: Unisys manages a client's security infrastructure, enabling the organization to quickly achieve and maintain regulatory compliances while taking advantage of new technologies including cloud, virtualized environments and mobility. • Security Consulting Services: Unisys strategic and technical consultants help clients identify and manage risk and pinpoint vulnerabilities in their digital and physical environments.For more information on Unisys Security Solutions visit: http://www.unisys.com/offerings/security-solutions
Thursday 17 September 2015
Macronix introduces industry's fastest SPI NOR memory OctaFlash for diverse demanding automotive applications
The memory market for automobile electronics has a higher entry barrier compared to that for other ICT or consumer electronics, and therefore unless a new entrant is a credible, reliable and trustworthy company, it is not an easy market to enter. When Macronix decided to enter the automobile electronics memory sector, it did so with the determination to keep on perfecting memory products in terms of both design and fabrication.Founded in 1989, Macronix has, after more than two decades of refinement of delivering high quality products and maintaining a reliable manufacturing supply, incorporated 'big data analytics' in the initial factory planning stage and established the sNOVA quality improvement system long before 'big data analytics' became mainstream and ahead of other technology leaders in the world. The accumulated extensive customer service experiences, feedbacks and support are then further utilized to enhance its rapid successful expansion into the automobile electronics memory market.Macronix started its automotive journey by conducting a comprehensive study regarding the regulations relating to the reliability of automobile electronics. It then obtained a series of IC reliability certifications, including the AEC-Q100 quality certification according to standards set by the Automotive Electronics Council (AEC). Since Macronix entered the automobile electronics memory sector, it has achieved very positive results in terms of market penetration, and is seeing strong revenue growth in 2015 and will continue to do so in 2016 and onwards. Many, in fact most of the world-leading automobile electronics vendors are today in mass production of their systems utilizing Macronix flash memory, including Serial NOR Flash, Parallel NOR Flash and SLC NAND flashBased around solid, customer backed strategies, Macronix drives ongoing efforts in product R&D and innovation to meet the current and future requirements for automobile electronics. Elain Shih, Product Marketing Manager at Macronix, provides an analysis on the advancement of memory components for automobile electronics from the developmental perspective of SPI NOR Flash, where Macronix is the global market leaderOctaFlash marks a milestone in high-speed SPI NOR Flash applicationSince the launch of SPI memory featuring double transfer rate (DTR) technology in 2010, Macronix has been working on further boosting SPI data transfer rates. The introduction of the 55nm process in 2013 raised the data transfer rate to 100MHz for SPI products with DTR interface. In 2014, Macronix packaged two quad I/O chips as a dual-quad product achieving a performance simulating eight I/O with a 200MByte/s data transfer rate.In 2015, Macronix unveiled the OctaFlash series, an expansion to eight I/O on a single chip. Fabricated on the in-house, highly reliable 55nm floating gate process flash technology, the data transfer rate reaches 400MByte/s, making OctaFlash the fastest SPI NOR Flash on the market.Macronix's dual-quad memory introduced in 2014 has been able to provide complete solutions supporting in-vehicle infotainment systems. For example, dual-quad flash can satisfy "instant on" requirements to quickly load a large amount of data for temperature or dashboard controls in the in-vehicle system after the car engine is started and procedure is initiated.OctaFlash, with more powerful features, is designed specifically for in-vehicle systems, especially ADAS for road safety and telematics systems. Addressing safety concerns, the current mainstream automobile designs make use of sensors and image data processing and transmit massive amounts of data to the in-vehicle system so that the automobile can instantly react to or cope with any otherwise unforeseen circumstances on the road, instantly.As automobile electronics demand the capability to perform big data analytics, Macronix believes that the embedded memory, traditionally integrated with the core processor, is no longer sufficient as it is generally 32MB or 64MB in capacity and made with 0.13um process, which is typically unable to support big data operations. This need from the market was the driver for Macronix to develop OctaFlash, which is a specialized new memory product line targeting high capacity and high speed data transfer applications.In comparison to competitors, OctaFlash uses the conventional SPI interface and therefore provides compatibility with existing single I/O interface of SPI Flash. Also to enable application compatibility, OctaFlash retains the original SPI instruction set to free design engineers from having to spend time learning and verifying new instructions and large chunks of code, which allows engineering to re-use, improve reliability and accelerate time to market.OctaFlash aids functional safety design in support of ISO 26262OctaFlash's specifications and reliability will help both Tier 1 suppliers and automakers alike meet the requirements of the ISO 26262 standard, a functional safety standard for automobile control systems. Sampling of OctaFlash is scheduled for September 2015 to meet the urgent demand by top-tier automakers looking to enhance the performance of existing and introduce new ISO 26262-compliant vehicles.Continuing advancement in clock frequency becomes a key future development area for SPI NOR FlashShih comments that future SPI NOR Flash development will trend toward high speed and high frequency to meet market demands. Moreover, with telematics applications growing in complexity, a variety of wireless communication technologies are being introduced to automobiles also. Components with high frequency clocking for automobile electronics are increasingly important for the widely available telematics systems. For many designers using high frequency clocking, BGA package has become the package of choice; OctaFlash is capable of supporting 200MHz in a 24-pin BGA package. Macronix has also designed special data strobe (DQS) pins to enable complete high-speed data processing. Furthermore, OctaFlash follows eMMC pin definition, offering convenience to core processor vendors with respect to hardware design and PCB layout.Macronix OctaFlash offers both 1.8V and 3V power supply solutions, available in 256Mb, 512Mb and 1Gb versions.Macronix OctaFlash targets automotive telematics and high-end cameraElain Shih, Product Marketing Manager, MXIC
Thursday 17 September 2015
Entegris expands CMP filtration technology solutions and research, analytical and manufacturing capabilities in Taiwan
Entegris, Inc. (NASDAQ: ENTG), a leader in yield-enhancing materials and solutions for highly advanced manufacturing environments, announced at a Taiwan tradeshow the development of a platform of CMP filtration solutions using nano-melt-blown (NMB) filtration technology, as well as the expansion of its CMP research, analytical services and manufacturing capabilities in Taiwan. These investments enable the company to further serve the growing demand for advanced CMP filtration solutions."CMP processes continue to grow in complexity in both the materials used and the need for greater planarity in each layer of today's devices", said Entegris Vice-President of the Liquid Microcontamination Control business unit, Clint Haris. "Entegris continues to invest in people, technology and facilities in Asia to introduce new solutions for the semiconductor market. As our customers produce integrated circuits with smaller feature sizes, our nano-fiber technology reduces the number of defect-causing contaminants from reaching the wafer."The Entegris filter platform using NMB media now includes the Planargard bulk, Solaris point-of-tool and Planarcap point-of-dispense families to provide contamination control solutions throughout the CMP process area. Developed and manufactured in Taiwan, the NMB media utilizes the increased porosity of the nano-fibers to reduce shear stress placed upon the slurry during transport and filtration operations. These innovations result in extended filter lifetime and greater removal of defect-causing contaminants.For more information, please visit http://www.bit.ly/CMPSlurryFilterEntegris expands CMP filtration technology solutions
Thursday 10 September 2015
Apple introduces new Apple TV, supporting apps
Apple has announced the new Apple TV, which users are now able to download and use Apps on the device. The new Apple TV's remote features Siri, so users can search with their voice for TV shows and movies across multiple content providers simultaneously.The new Apple TV is built with a new generation of high-performance hardware and introduces an interface using the Siri Remote. Apple TV runs the new tvOS operating system, based on Apple's iOS, enabling iOS developers to create new apps and games specifically for Apple TV and deliver them directly to users through the new Apple TV App Store.The new Siri Remote simplifies how users select, scroll and navigate through their favorite content while bringing interactivity to the new Apple TV by using a glass touch surface.tvOS is the new operating system for Apple TV, and the tvOS SDK provides tools and APIs for developers to create experiences for the living room. The new Apple TV features the Apple-designed A8 chip for performance so developers can build games and custom content apps for the TV.The new Apple TV will be available at the end of October starting at US$149 for a 32GB model and US$199 for a 64GB model.Apple TVPhoto: Company
Thursday 10 September 2015
Apple introduces iPhone 6s and iPhone 6s Plus
Apple has announced the iPhone 6s and iPhone 6s Plus, the latest iPhone models from the company, adding a new dimension to iPhone's multi-touch interface. The new iPhones introduce 3D Touch, which senses force to enable access to features and content. The iPhone 6s and iPhone 6s Plus feature Retina HD displays made from the reinforced glass and 7000 series aluminum, the same alloy used in the aerospace industry, in metallic finishes that now include rose gold.The iPhone 6s and iPhone 6s Plus also introduce a new approach to photography called Live Photos, bringing still images to life by capturing a moment in motion. Live Photos, 3D Touch and other advancements in the new iPhones are powered by the Apple-designed A9 chip.The iPhone 6s and iPhone 6s Plus introduce new ways to navigate and experience iPhone by sensing pressure to enable new gestures - Peek and Pop - so users can dip in and out of content without losing their place. Press lightly to Peek at a photo, email, web page or other content, and press a little deeper to Pop into the content itself. With Quick Actions, 3D Touch provides shortcuts to the things users do most, so users can send a message or take a selfie with a press from the Home screen.High-definition video improves with support for Ultra HD standard - with a resolution of 3,840 by 2,160, delivering over eight million pixels - and the expansion of optical image stabilization to video on the iPhone 6s Plus, for taking videos in lower light.Apple's third-generation 64-bit A9 chip is 70% faster in CPU and 90% faster in GPU compared to the A8, and has better energy efficiency for longer battery life. The A9 chip and iOS 9 are architected together for optimal performance. M9, Apple's next-generation motion coprocessor, is embedded into A9, allowing more features to run all the time at lower power, including "Hey Siri," without iPhone needing to be plugged in.The iPhone 6s and iPhone 6s Plus are equipped with wireless technologies including Wi-Fi and LTE Advanced, and support up to 23 LTE bands.The iPhone 6s and iPhone 6s Plus will be available in gold, silver, space gray and the new rose gold metallic finishes for $0 down with 24 monthly payments starting at US$27 and US$31, respectively, from Apple's retail stores in the US.Both models will be available in Australia, Canada, China, France, Germany, Hong Kong, Japan, New Zealand, Puerto Rico, Singapore, the UK and the US beginning Friday, September 25, with pre-orders beginning Saturday, September 12.Apple iPhone 6s and iPhone 6s PlusPhoto: Company
Thursday 3 September 2015
Taiwan market: Microsoft unveils cross-platform foldable keyboard
Microsoft has unveiled its Universal Foldable Keyboard that can be used across iOS, Android and Windows platforms in Taiwan.The keyboard is specifically designed for Windows tablets, iPad and iPhone and has a length of 29.5cm while opened and 14.6cm closed. The keyboard supports Bluetooth communication and has a battery longevity of three months per charge and is priced at NT$2,790 (US$86).
Wednesday 2 September 2015
Intel introduces sixth-generation Intel Core processors based on Skylake
Intel has introduced the sixth-generation Core processor family, supporting a range of device designs - from the ultra-mobile compute stick, to 2-in-1s and high-definition all-in-one desktops, to new mobile workstations.Built on the new Skylake microarchitecture on Intel's 14nm manufacturing process technology, the new Intel Core processors deliver up to two and a half times better performance, triple the battery life, and graphics that are 30 times better for gaming and video experiences compared to the average 5-year-old computer, Intel said.Intel Core M processors, which can offer twice the performance of premium tablets, will now include brand levels Intel Core m3, m5 and m7 processors to provide consumers with more clarity and choice in finding the Intel Core M processor-based device that best meets their specific needs. The Intel Compute Stick lineup expands to include a version powered by the new Intel Core M processor.The new generation of Intel processors also includes several firsts for mobile designs: a mobile K SKU that is unlocked to enable overclocking with more user control, a new quad-core Intel Core i5 processor that offers up to 60% improved mobile multitasking, and the Intel Xeon E3 processor family now powering mobile workstations. The sixth-generation Intel Core processors deliver improvements in graphics performance to offer visuals for gaming as well as Ultra HD content creation and media playback. New Intel Speed Shift technology improves the responsiveness of mobile systems so consumers can, for example, apply a photo filter up to 45% faster.In addition, the new Intel Core and Intel Xeon platforms will offer a variety of new features and experiences. More devices will feature Thunderbolt 3 for USB Type-C. A user-facing or world-facing Intel RealSense Camera will be available on a range of new Intel Core processor-based 2-in-1s, notebooks and all-in-one desktop systems, offering new depth-sensing capabilities and experiences.The new Intel Core platform will also feature Intel WiDi or Pro WiDi. The technology allows people to easily share from their computer to a TV, monitor or projector without wires and dongles.Intel sixth-generation Core processorPhoto: Company
Wednesday 2 September 2015
From standard grade to UHP grade
The semiconductor industry is a highly demanding market, which is known for complex technologies and dependence on the supply chain. Teesing has supplied components, assemblies and engineering capacity to the largest lithography system builder for years. Teesing is specialized in serving worldwide customers in a technical, flexible and fast way.Teesing is specialized in systems for the supply and discharge of cooling water and distribution of UHP gases, allowing its customers to focus on their core activities. Gases with ultra-high purity (low amount of other gases) are often used in high tech industries like analytical, pharmaceutical, petrochemical, semiconductor, metrology and aerospace industry. Pure gases often improve yields, consistency or improve the quality of the end-product. Teesing supplies complete delivery systems for transporting, filtering, monitoring and distributing UHP quality gas and cooling water.Cooling capacity is increasing together with the production output of OEMs thereby changing the requirements on components. These items must be suitable for the materials, for instance Ultra Pure Water, (demineralised) water or Glycol. Additionally, all parts and assemblies have to meet high cleanliness standards for use in clean rooms to avoid contamination. Teesing offers standard and customized products to meet the high specifications of end customers. Additionally it also thinks beyond purely technical specifications, such as ease of installation, cost reduction, maintenance, packaging and logistics. Teesing offers a complete package for thermal management and gas distribution, from source to process.Example of process lines, from industrial grade (below) to UHP grade (above)Photo: Company