Unisys Corporation (NYSE: UIS) today announced a range of advanced security products and solutions, including a new software-based release of its award-winning Unisys Stealth solution, which helps organizations protect their digital and physical assets in cloud, mobile and enterprise environments.
The memory market for automobile electronics has a higher entry barrier compared to that for other ICT or consumer electronics, and therefore unless a new entrant is a credible, reliable and trustworthy company, it is not an easy market to enter...
Entegris, Inc. (NASDAQ: ENTG), a leader in yield-enhancing materials and solutions for highly advanced manufacturing environments, announced at a Taiwan tradeshow the development of a platform of CMP filtration solutions using nano-melt-blown (NMB) filtration technology, as well as the expansion of its CMP research, analytical services and manufacturing capabilities in Taiwan...
Apple has announced the new Apple TV, which users are now able to download and use Apps on the device. The new Apple TV's remote features Siri, so users can search with their voice for TV shows and movies across multiple content providers simultaneously.
Apple has announced the iPhone 6s and iPhone 6s Plus, the latest iPhone models from the company, adding a new dimension to iPhone's multi-touch interface. The new iPhones introduce 3D Touch, which senses force to enable access to features and content...
Intel has introduced the sixth-generation Core processor family, supporting a range of device designs - from the ultra-mobile compute stick, to 2-in-1s and high-definition all-in-one desktops, to new mobile workstations.
The semiconductor industry is a highly demanding market, which is known for complex technologies and dependence on the supply chain. Teesing has supplied components, assemblies and engineering capacity to the largest lithography system builder for years. Teesing is specialized in serving worldwide customers in a technical, flexible and fast way.
In semiconductor manufacturing, the chemical mechanical polishing (or CMP) step is used to planarize, or create a level topography, between each layer of the interconnect structure as the device is built. The polishing slurries used in CMP are key to getting good results, as the tiny particles contained in the slurries provide the abrasives needed to achieve the final surface results...
The Netherlands Trade & Investment Office (NTIO), the Dutch representation in Taiwan, organizes together with the Dutch High Tech industry for the third time in a row the Holland High Tech Pavilion at the SEMICON 2015 in Taipei.
