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Thursday 17 September 2015
Entegris expands CMP filtration technology solutions and research, analytical and manufacturing capabilities in Taiwan
Entegris, Inc. (NASDAQ: ENTG), a leader in yield-enhancing materials and solutions for highly advanced manufacturing environments, announced at a Taiwan tradeshow the development of a platform of CMP filtration solutions using nano-melt-blown (NMB) filtration technology, as well as the expansion of its CMP research, analytical services and manufacturing capabilities in Taiwan. These investments enable the company to further serve the growing demand for advanced CMP filtration solutions."CMP processes continue to grow in complexity in both the materials used and the need for greater planarity in each layer of today's devices", said Entegris Vice-President of the Liquid Microcontamination Control business unit, Clint Haris. "Entegris continues to invest in people, technology and facilities in Asia to introduce new solutions for the semiconductor market. As our customers produce integrated circuits with smaller feature sizes, our nano-fiber technology reduces the number of defect-causing contaminants from reaching the wafer."The Entegris filter platform using NMB media now includes the Planargard bulk, Solaris point-of-tool and Planarcap point-of-dispense families to provide contamination control solutions throughout the CMP process area. Developed and manufactured in Taiwan, the NMB media utilizes the increased porosity of the nano-fibers to reduce shear stress placed upon the slurry during transport and filtration operations. These innovations result in extended filter lifetime and greater removal of defect-causing contaminants.For more information, please visit http://www.bit.ly/CMPSlurryFilterEntegris expands CMP filtration technology solutions
Thursday 10 September 2015
Apple introduces new Apple TV, supporting apps
Apple has announced the new Apple TV, which users are now able to download and use Apps on the device. The new Apple TV's remote features Siri, so users can search with their voice for TV shows and movies across multiple content providers simultaneously.The new Apple TV is built with a new generation of high-performance hardware and introduces an interface using the Siri Remote. Apple TV runs the new tvOS operating system, based on Apple's iOS, enabling iOS developers to create new apps and games specifically for Apple TV and deliver them directly to users through the new Apple TV App Store.The new Siri Remote simplifies how users select, scroll and navigate through their favorite content while bringing interactivity to the new Apple TV by using a glass touch surface.tvOS is the new operating system for Apple TV, and the tvOS SDK provides tools and APIs for developers to create experiences for the living room. The new Apple TV features the Apple-designed A8 chip for performance so developers can build games and custom content apps for the TV.The new Apple TV will be available at the end of October starting at US$149 for a 32GB model and US$199 for a 64GB model.Apple TVPhoto: Company
Thursday 10 September 2015
Apple introduces iPhone 6s and iPhone 6s Plus
Apple has announced the iPhone 6s and iPhone 6s Plus, the latest iPhone models from the company, adding a new dimension to iPhone's multi-touch interface. The new iPhones introduce 3D Touch, which senses force to enable access to features and content. The iPhone 6s and iPhone 6s Plus feature Retina HD displays made from the reinforced glass and 7000 series aluminum, the same alloy used in the aerospace industry, in metallic finishes that now include rose gold.The iPhone 6s and iPhone 6s Plus also introduce a new approach to photography called Live Photos, bringing still images to life by capturing a moment in motion. Live Photos, 3D Touch and other advancements in the new iPhones are powered by the Apple-designed A9 chip.The iPhone 6s and iPhone 6s Plus introduce new ways to navigate and experience iPhone by sensing pressure to enable new gestures - Peek and Pop - so users can dip in and out of content without losing their place. Press lightly to Peek at a photo, email, web page or other content, and press a little deeper to Pop into the content itself. With Quick Actions, 3D Touch provides shortcuts to the things users do most, so users can send a message or take a selfie with a press from the Home screen.High-definition video improves with support for Ultra HD standard - with a resolution of 3,840 by 2,160, delivering over eight million pixels - and the expansion of optical image stabilization to video on the iPhone 6s Plus, for taking videos in lower light.Apple's third-generation 64-bit A9 chip is 70% faster in CPU and 90% faster in GPU compared to the A8, and has better energy efficiency for longer battery life. The A9 chip and iOS 9 are architected together for optimal performance. M9, Apple's next-generation motion coprocessor, is embedded into A9, allowing more features to run all the time at lower power, including "Hey Siri," without iPhone needing to be plugged in.The iPhone 6s and iPhone 6s Plus are equipped with wireless technologies including Wi-Fi and LTE Advanced, and support up to 23 LTE bands.The iPhone 6s and iPhone 6s Plus will be available in gold, silver, space gray and the new rose gold metallic finishes for $0 down with 24 monthly payments starting at US$27 and US$31, respectively, from Apple's retail stores in the US.Both models will be available in Australia, Canada, China, France, Germany, Hong Kong, Japan, New Zealand, Puerto Rico, Singapore, the UK and the US beginning Friday, September 25, with pre-orders beginning Saturday, September 12.Apple iPhone 6s and iPhone 6s PlusPhoto: Company
Thursday 3 September 2015
Taiwan market: Microsoft unveils cross-platform foldable keyboard
Microsoft has unveiled its Universal Foldable Keyboard that can be used across iOS, Android and Windows platforms in Taiwan.The keyboard is specifically designed for Windows tablets, iPad and iPhone and has a length of 29.5cm while opened and 14.6cm closed. The keyboard supports Bluetooth communication and has a battery longevity of three months per charge and is priced at NT$2,790 (US$86).
Wednesday 2 September 2015
Intel introduces sixth-generation Intel Core processors based on Skylake
Intel has introduced the sixth-generation Core processor family, supporting a range of device designs - from the ultra-mobile compute stick, to 2-in-1s and high-definition all-in-one desktops, to new mobile workstations.Built on the new Skylake microarchitecture on Intel's 14nm manufacturing process technology, the new Intel Core processors deliver up to two and a half times better performance, triple the battery life, and graphics that are 30 times better for gaming and video experiences compared to the average 5-year-old computer, Intel said.Intel Core M processors, which can offer twice the performance of premium tablets, will now include brand levels Intel Core m3, m5 and m7 processors to provide consumers with more clarity and choice in finding the Intel Core M processor-based device that best meets their specific needs. The Intel Compute Stick lineup expands to include a version powered by the new Intel Core M processor.The new generation of Intel processors also includes several firsts for mobile designs: a mobile K SKU that is unlocked to enable overclocking with more user control, a new quad-core Intel Core i5 processor that offers up to 60% improved mobile multitasking, and the Intel Xeon E3 processor family now powering mobile workstations. The sixth-generation Intel Core processors deliver improvements in graphics performance to offer visuals for gaming as well as Ultra HD content creation and media playback. New Intel Speed Shift technology improves the responsiveness of mobile systems so consumers can, for example, apply a photo filter up to 45% faster.In addition, the new Intel Core and Intel Xeon platforms will offer a variety of new features and experiences. More devices will feature Thunderbolt 3 for USB Type-C. A user-facing or world-facing Intel RealSense Camera will be available on a range of new Intel Core processor-based 2-in-1s, notebooks and all-in-one desktop systems, offering new depth-sensing capabilities and experiences.The new Intel Core platform will also feature Intel WiDi or Pro WiDi. The technology allows people to easily share from their computer to a TV, monitor or projector without wires and dongles.Intel sixth-generation Core processorPhoto: Company
Wednesday 2 September 2015
From standard grade to UHP grade
The semiconductor industry is a highly demanding market, which is known for complex technologies and dependence on the supply chain. Teesing has supplied components, assemblies and engineering capacity to the largest lithography system builder for years. Teesing is specialized in serving worldwide customers in a technical, flexible and fast way.Teesing is specialized in systems for the supply and discharge of cooling water and distribution of UHP gases, allowing its customers to focus on their core activities. Gases with ultra-high purity (low amount of other gases) are often used in high tech industries like analytical, pharmaceutical, petrochemical, semiconductor, metrology and aerospace industry. Pure gases often improve yields, consistency or improve the quality of the end-product. Teesing supplies complete delivery systems for transporting, filtering, monitoring and distributing UHP quality gas and cooling water.Cooling capacity is increasing together with the production output of OEMs thereby changing the requirements on components. These items must be suitable for the materials, for instance Ultra Pure Water, (demineralised) water or Glycol. Additionally, all parts and assemblies have to meet high cleanliness standards for use in clean rooms to avoid contamination. Teesing offers standard and customized products to meet the high specifications of end customers. Additionally it also thinks beyond purely technical specifications, such as ease of installation, cost reduction, maintenance, packaging and logistics. Teesing offers a complete package for thermal management and gas distribution, from source to process.Example of process lines, from industrial grade (below) to UHP grade (above)Photo: Company
Wednesday 2 September 2015
Entegris' Nano Melt Blown (NMB) CMP filtration technology further reduces defect rates related to slurry contamination
In semiconductor manufacturing, the chemical mechanical polishing (or CMP) step is used to planarize, or create a level topography, between each layer of the interconnect structure as the device is built. The polishing slurries used in CMP are key to getting good results, as the tiny particles contained in the slurries provide the abrasives needed to achieve the final surface results. The trick, though, is to keep the working particles in the slurry unchanged during the polishing process, and at the same time, remove any large slurry particle agglomerations which cause uneven planarization conditions that are more likely to cause defects in the device layers. Gel-type particles in the slurry can also easily form during the CMP process, causing defects of their own. Finally, in order to achieve the desired results, both particle and gel defectivity causes must be managed without reducing the slurry flow rate and increasing the pressure drop leave across the filter. Flow rate is a measure of the volume of liquid that passes through the filter in a period of time. Pressure drop is a measure of the pressure required to achieve a given flow rate. Reducing pressure drop can be achieved with innovative media designs and new materials of construction.CMP filtration media, such as that manufactured by Entegris, has long been used in the CMP process to maintain the desired slurry characteristics. As device geometries shrink, however, so does the abrasive size used in advanced slurries, moving generally towards sub-50 nm particle size, and to single-digit nanometer dimensions for some specific applications. As the size of the abrasive particle decreases, however, the potential for slurry-caused defects increases, and so the CMP filter retention rating has to be lowered to tighter and tighter pore size, along with the filter design (which often now requires multiple layers of media in order to be most effective). However, these CMP filters for the most advanced polishing slurries will typically result in a decrease in the slurry flow rate when using standard media types.For advanced polishing slurries, Entegris has developed a Nano Melt Blown (NMB) filtration media with improved media porosity that addresses the problems associated with flow rate reductions during filtration. The risk of large particle agglomeration is also reduced with NMB media, as the "shear" effect is greatly reduced. The high particle holding capacity of the NMB media also extends filter life, reducing the overall cost of ownership in the filtration process. The Entegris product can also be used with tighter retention ratings, and enable filtration in bulk/chemical delivery system applications where a higher particle loading capacity is required.Entegris planargard NMB filterPhoto: Company
Wednesday 2 September 2015
Holland High Tech Pavilion at SEMICON Taiwan 2015
The Netherlands Trade & Investment Office (NTIO), the Dutch representation in Taiwan, organizes together with the Dutch High Tech industry for the third time in a row the Holland High Tech Pavilion at the SEMICON 2015 in Taipei.Since the beginning of its rapid development, the Taiwanese semiconductor industry has maintained very close ties with the Dutch semiconductor industry through flagship companies like Philips, ASML and NXP and it continues to do so through every element of the value chain.The Dutch semiconductor industry is mainly located in the Eastern and Western parts of the Netherlands and has its strength in microelectronics; process/technology research, production tools/equipment, electronic components and end-user applications, and it generates an annual turnover of EUR10 billion.The Holland High Tech Pavilion will have a large stand of 99 square meters, which will accommodate nine leading Dutch semiconductor companies and also the national applied research institute, TNO. The pavilion features technologies and products in the field of mass-flow meters and control, high tech engineering, precision manufacturing, advanced surface mount technology (SMT), laser direct imaging, ALD, advanced packaging, advance particle monitoring systems, power protection and world class semiconductor R&D.
Wednesday 2 September 2015
SEMICON Taiwan 2015: Inspiring the next big idea
Celebrating its 20th anniversary, SEMICON Taiwan 2015 (September 2-4) highlights opportunity, innovation, and sustainability to inspire the next big idea. SEMICON Taiwan 2015 will be the largest ever - with over 700 exhibitors occupying more than 1,400 booths and attracting more than 40,000 visitors. SEMICON Taiwan connects attendees with the companies, people, products, and information for advancing the future of design and manufacturing in the advanced electronics industries.In 2015 alone, companies in Taiwan are forecast to spend in excess of US$1.5 billion on packaging and test equipment. With the growing importance of packaging and test, SEMI will host the System in Package (SiP) Global Summit 2015 from September 3-4, co-located with SEMICON Taiwan. The SiP Global Summit will bring together over 20 CTOs and industry leaders sharing their insights and perspectives on 3D-IC, through silicon via (TSV), 2.5D-IC with silicon interposer, and embedded substrate technologies.SEMICON Taiwan is an opportunity to meet and learn from more than 100 of the worldwide major players. Many of the speakers are presenting at the technology programs (SiP, Advanced Technologies in Accelerating Digital Era & IoT, MEMS and IC Design) and the business programs (Executive Summit, CFO Executive Summit, and Market Trends). Speakers at SEMICON Taiwan include professionals from: TSMC, UMC, ASE, SPIL, Broadcom, Etron, Amkor, Global Foundries, Advantest, Air Products, Applied Materials, ASM, Challentech , DAS, DISCO, Hauman, Hermes, Henkel, Hypersonic, Jipal, JSR, KLA-Tencor, Kromax, Kulicke & Soffa, Lam Research, Lintec, Marketech, Nippon Thompson, Nissan Chemical Industries, Premtek, Senju Metal Industry, Tokyo Electron, Xcerra and more.Learn the latest trends and explore innovative solutions at the TechXPOTs - hear about innovations and product developments from Marketech, Wholetech, Atlas, Nikko Metals Taiwan, Allied Supreme, Siemens PLM, 59Clean, Aerotech, Am-Power, Atotech, Cica-Huntek Chemical, LeadGas, Linx Consulting, MSG Lithoglas, Lumax, New Fast Technology, NTIO, Particle Measuring Systems, Precision Packaging Materials, Rockwell, Techgo, WaferPlus, Weltall, White Knight�Kand more.The Sustainable Manufacturing Forum on September 2 features presentations from ASE, Atlas, Edwards, Epistar, ERM, Everlight, Evonik, Innolux, Neo Solar, Nohmi Bosai, RCI Engineering, Sahtech, TSMC, and UMC.SEMICON Taiwan 20th anniversary celebration activities include: Daily Lucky Draws (Apple Watch and other great prizes), Jing Jing Festival Parades, Birthday Party, "Hooray 20" (Show your ID number or date of birth with the lucky number "20" to enter the lucky spin for exciting prizes).SEMI Taiwan hosts SEMICON Taiwan with TAITRA and TSIA as co-organizers. The event is advised by the Taiwan Ministry of Economic Affairs.SEMICON Taiwan is entering its 20th anniversary. The scale of the event will be bigger than ever with over 700 exhibitors and is expected to attract more than 40,000 visitors.
Tuesday 1 September 2015
Industry 4.0 Smart Services Dawn with Predictive Maintenance
Besides smart manufacturing, smart service is also a focus of Industry 4.0. Leveraging the industrial internet of things (IIoT), big data analysis, and expert systems, machinery makers can decrease routine and breakdown maintenance while increasing equipment availability, performance, and quality. The key lies in predictive maintenance (PM).PM uses real-time vibration analysis and quality analysis to monitor asset status and signs of falling productivity. With IoT gateways transferring vibration data to the cloud, PM engineers can remotely monitor machinery condition and identify machinery components with the potential defects. Once detecting abnormal vibration, PM engineers can notify customers to adjust production to prevent the production of defective goods. Meanwhile, PM engineers can pinpoint and repair worn parts, bringing machines back on line soon and increasing equipment availability.Product quality analysis is another way to enhance equipment performance and yield rate. For CNC and SMT equipment that are challenging for vibration sensor deployment, the shop flow control system could be used with defect analysis and traceability systems so that component issues can be traced and fixed.Cloud platforms and big data analysis help establish expert systems that use systematic ways to reason, store, and manage the expertise of human experts and perform analysis with this knowledge base. These data can be translated into machine utilization patterns to improve machine efficiency and best suitable successors prior to asset retirement. In case of malfunction, error message can be collected and used for design refinement.NEXCOM's comprehensive PM solutions cover hardware/software integrations and vibration analysis, which are introduced to semiconductor manufacturing and soon to be extended to petrochemical and electronics for smart services.For more information about NEXCOM, please visit http://www.nexcom.com/Predictive maintenance can decrease routine and breakdown maintenance while increasing equipment availability, performance, and quality.