Indium Corporation announces the release of its newest informational video detailing the benefits of using low-temperature solder alloy systems based on indium and bismuth.This brief video features the company's Indium and Bismuth Product Manager, Carol Gowans, as she explains to electronics manufacturing expert Phil Zarrow, President and Principal Consultant for ITM Consulting, the properties and applications of indium and bismuth."Both alloy systems, indium and bismuth, offer significant and distinct advantages based on the manufacturing process needs," Gowans said. "These alloys are available in numerous forms from paste to ribbon to wire to preforms."This video can be found at www.indium.com/blog/phil-zarrow.Gowans has more than 30 years of experience in sales and product management, focusing on emerging markets and technologies. Covering a variety of markets, including medical, aerospace, and electronics manufacturing, her goal is to identify the requirements of each target market and to select the right tools (including products, technical support, etc.) to meet those requirements. Gowans has authored papers on Solder Fortification and improving solder joint reliability with the use of solder preforms. She also authors a blog on engineered solders, which can be found at www.indium.com/blog/carol-gowans.Zarrow has been involved with PCB fabrication and assembly for more than 35 years. In addition to his background in automated assembly and cleaning, Zarrow is recognized for his expertise in surface mount reflow soldering technology, and in the design and implementation of SMT placement equipment and reflow soldering systems. His extensive hands-on experience also includes set-up and troubleshooting through-hole, and SMT processes throughout the world.For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.

Strictly speaking, Industry 4.0 isn't just about automated production, which can only increase production efficiency and quality but can't let you enjoy the full benefits. In order to realize the vision of smart production, you will need further integration of digitized information, supported by big data analytics applications.Industry 4.0 is currently a hot topic, and it seems like everyone in the manufacturing industry is talking about it. However, if you look at most of the players in Taiwan's manufacturing industry, the degree of automation at their production lines is still low. Many manufacturing facilities still require manual labor when handling materials between different machines as well as inserting materials for production. For these types of companies, in order to achieve Industry 4.0, they will first need to build sensor technologies as well as connectivity capabilities into their production equipment. Then, they will need to build seamless production environments by designing efficient traffic routes and integrating the work flows at their factories. Even after accomplishing all of these, they will not have achieved Industry 4.0 yet."By achieving automated production manufacturers will only have achieved about 40 to 50% of what it takes to reach the ultimate goal of Industry 4.0," explains Brian Shen, president of Tatung System Technologies Inc. (tsti). The next critical milestone would be to digitize their information and upload the status of their equipment, production information, as well as logistics data into the cloud. Then, they need to integrate all of the data and information with their manufacturing execution system (MES) and enterprise resource planning (ERP) system, allowing the status at the manufacturing end to be analyzed and monitored in real time. The entire production process – the sourcing of supplies, the feeding of materials to the machines, the manufacturing and the delivery of the finished products – will be closely monitored with measures taken quickly when necessary. By achieving these, the manufacturer will have achieved 60 to 70% of what is required to achieve Industry 4.0.Achieving Industry 4.0 through Integration and Analysis of InformationIn order to achieve the last mile to Industry 4.0, manufacturers will need to build a big data platform into their ERP systems for conducting advanced analyses, making decisions and feeding the results back to the front end. For example, if the system discovers (through analyses) signs of potential changes (such as a shortage of materials or delivery delays), it will issue an alert via the indicator lights on the front-end instrument's panel and at the same time notify procurement personnel to make emergency material purchases. The system may also notify sales personnel to provide updated delivery schedules to the customer. Once these visions are realized, the manufacturer will have fully achieved the goal of Industry 4.0 smart manufacturing.Therefore, if we view building smart production capabilities into individual machines as a starting point for achieving Industry 4.0, we would subsequently need to achieve full-factory automation, integration of information and communication, and implementation of big data analytics. This is a long process involving both operational and information technologies. In today's market, only a very limited number of service providers are able to provide integration of all the aspects beginning from lower-level onsite production facility monitoring to higher-level data collecting and analysis. If this situation persists, it will surely be an obstacle to Taiwan's manufacturing industry on their road to Industry 4.0.Because of this, tsti began actively building a strong foundation in this area in 2014. Through mergers and acquisitions as well as internal assistance from its own SCADA team, tsti has vertically integrated the upper and lower level services ranging from PLC to BC (block controller), SCADA, MES, and ERP. In addition, services from OSI's PI analytics software, Microsoft's APS system, or HP's Vertica system can also be integrated, achieving a diverse scope of big data analytics in order to fully meet the requirements of Industry 4.0 and provide information integration services for smart manufacturing.Increase gross profit by closely monitoring production process according to ordersBrian Shen points out that even before Industry 4.0 began attracting so much attention, many manufacturers in Taiwan had already been putting considerable efforts into establishing automated production. By doing this, they were able to successfully enhance quality as well as efficiency. However, this did not allow them to solve the problem of low profits. Clearly, regardless of how fast or how well you are able to produce "me-too" products, your sales still won't take off. In order to overcome this predicament, you must achieve customized production and prevent inventory from accumulating, which would help increase gross profits. However, a sudden switch to low-volume high-diversity production could result in chaos in the production line. Only through the adoption of information digitization can these problems be solved.Through information digitization, upper-level information and communication systems as well as data analytics will be able to control production schedules, material deliveries from suppliers, production volumes and delivery schedules according to the specifications of the orders, thereby ensuring that all production resources are used effectively and all production requirements are met in an orderly yet flexible manner.In addition, through information digitization, stability of the production line can be guaranteed and downtime prevented, Brian Shen further explains. For example: CNC cutting tools need to be replaced periodically due to wear; in addition, after motors or cooling water pumps operate for over a year, they need to be inspected and repaired. In the past, due to a lack of detection capabilities (sensors), repairs would only be carried out after equipment failure or malfunction. This results in system downtime, which could reduce utilization rates and create considerable losses. Once IoT technologies are adopted, we will be able to conduct timely maintenance or repairs when the system shows signs of anomalies but has yet to completely fail. This avoids potential downtimes and losses.In this scenario, SCADA can be used to collect information of power characteristics, temperatures, humidity levels, CO2 levels, weights and others, which is then fed into the PI software for analysis of the conditions of the various equipment in order to detect any potential issues and fix them before any major problems develop.Tatung System Technologies President Brian Shen stresses Industry 4.0 can be truly achieved only by adopting connected sensors at the bottom level, implementing smart production, full-factory automation, information digitization, and back-end big data analytics.

DASAN Networks, a global network solution provider in Korea, announced that it has completed development of G.fast technology that enables gigabit speeds over copper infrastructure.G.fast technology is a next generation network solution that extends gigabit services with copper wire. Service providers can save installation costs significantly without major upgrades of existing infrastructure, while offering ultra-fast broadband service to customers.Defined as ITU-T standard G.9700/G.9701, G.fast technology is getting increasingly popular worldwide due to its advantage of increasing broadband capacity without re-cabling into all-fiber infrastructure, especially in areas that only have telephone lines or historical sites where, due to preservation, it is difficult to execute major construction.Leading this trend, DASAN Networks has developed G.fast solution targeting both global and local markets.DASN Networks' G.fast solution meets global market requirements by adopting global standard ITU-T G.9700/G.9701, and is designed with high reliability by effectively minimizing crosstalk through vectoring technology.DASAN Networks also provides G.fast total solution from its high capacity equipment for service provider's central office to customer premise equipment (CPE) to ensure efficient management.Mr. SeungDong Lee, DASAN Networks' CTO, says "More solutions that utilize existing network infrastructure to expand broadband are emerging quickly. Leveraging our advanced technology such as G.fast, DASAN Networks will lead the way into the global market with higher-bandwidth and economical solutions"DASAN Neworks G.fast will be first introduced at the DASAN Networks booth #D2-36 at GITEX Technology Week (18~22 Oct 2015, Dubai) and #E68 at Broadband World Forum (20~22 Oct 2015, London).AboutDASAN Networks is a leading global network solution provider that established end-to-end capabilities across the Carrier and Enterprise markets. With more than 60 customers over 25 countries, DASAN Networks has been a reliable solution provider to Korea's top 3 operators KT, SK broadband and LG U+ and continuously expanding global business followed by the company's success in Europe, Japan, Taiwan and Vietnam. Visit http://www.dasannetworks.com/ for more information.

Indium Corporation announces a soft metal alloy thermal interface material (SMA TIM) that offers high and uniform thermal resistance at lower applied stresses in compressed interfaces.The company's patented Heat-Spring SMA TIM reduces thermal resistance and enhances cooling by utilizing two key properties of indium metal: superior thermal conductivity and malleability. Unlike standard thermal interface materials, Heat-Spring offers an extremely long service life as it does not pump out under power cycling, nor does it bake out over time. This combination of high conductance, high surface contact area (due to superior conformance), and low degradation over time produces a superior thermal interface and assures optimized long-term device performances in compressed interfaces.Heat-Spring's high and uniform thermal conductivity is enhanced further when placed under compression (35 to 100 psi). Learn more at www.indium.com/heat-spring or by contacting the company at askus@indium.com.For more information about Indium Corporation, visit http://www.indium.com/ or email abrown@indium.com.

Good Way Technology's DU 3900 USB 3.0 4K mini-docking station granted the winner of HKEIA 2015 Award for outstanding innovation and technology products. This award is organized by Hong Kong Electronic Industries Association Ltd annually and displayed in the Hong Kong Electronics Fair held from October 13th to 16th 2015.The USB 3.0 4K Mini Docking Station is designed for extra connectivity demands. You can extend the connection of a computer to extra USB peripherals, Ethernet network and the audio output/input through one single USB cable.With the built-in USB 3.0 ports, the docking station enables you to enjoy the super speed data transmission between USB peripherals. Aside from USB 3.0, this product is compliant with USB 2.0/1.1 specification. You will be able to keep and use your USB 2.0/1.1 devices as usual.In addition, the docking station is equipped with video output. With the DVI and HDMI ports, you can mirror your primary screen, or extend the Window desktop allowing visibility of more applications at the same time. Enhanced expansion capability plus the stylish appearance, this compact docking station with video is the most versatile accessory that also complements your home or office space.Good Way Technology's DU 3900 USB 3.0 4K mini-docking station granted the winner of HKEIA 2015 Award

Western China (Sichuan) Import Expo & International Investment Fair ("WCIIF" for short) has held its press release on 12th Oct morning in Chengdu. Sichuan Provincial Government Secretary General Luo Qiang said during his presentation, the exhibition promotion work has nearly been finished.34 countries and regions including countries along "One Belt One Road"are already slated to exhibit.WCIIF will take place during 23rd-27th Oct in Chengdu on theme of "Investment expansion and trade development". The Former French Prime Minister,Former Russian First Deputy Prime Minister,United Nations Procurement Service Deputy Director and other foreign leaders will attend this event. Up to now, 10 foreign delegations, 14 embassies in China and 19 foreign trade and investment promotion agencies, commercial and industrial organization has set their visits to WCIIF. 16 provinces including Guangdong, Shanghai, Zhejiang, Jiangxi, Chongqing, Liaoning and Xinjiang Production and Construction Corps will send their delegations to the expo. So the total number of attendees is estimated to rise over 20,000.The exhibiting area covers over 80,000 square meters, marking Import Expo "the largest import expo in West China". As center stage for global businesses, it will showcase mainly three fields: Foreign advanced technology equipment and key components, service trade and consumer goods. There are six halls in total: Pavilion of European and American Countries, Pavilion of Japan and RKO, Pavilion of Smart Car, Pavilion of ASEAN and South Asia, Pavilion of Fashion Life. The total area covers 83,800 square meters, of which 58,300 square meters are foreign pavilions. Represented by USA, German, France, Italy, Czech, Japan, South Korea, Israel, India, Malaysia, 34 countries and regions are among the 1500+ exhibitors, including 23 one long "One Belt One Road". Many of the exhibitors are Fortune 500 companies and Multinational Company, for example, Panasonic, Dell, Hyundai, Microsoft, Bosch, Foxconn, Cannon, Haulotte, PPG.Conference Program is another highlight for the expo. 16 conference sessions of distinct theme, rich content, remarkable efficiency will take place: Import Expo Signing Ceremony,2015 EU-Sichuan Investment Cooperation Fair, Sichuan Electronics information Investment and Trade Forum, China (Sichuan) Automobile Investment Cooperation Fair, China-EU Technology and Trade Fair, Sino-French SMEs Cooperation Forum, Western China Imports Purchase & Supply Symposium 2015, The China (Western) International Flat Panel Display Summit, The China Smart Automobile Forum, China (Chengdu) General Aviation Developing Summit, Western E-Commerce Developing Summit, covering finance, investment, trade, technology, e-commerce and other regions.

Information security used to pose little threat to industrial machines due to their inability to internet access. However, with the trend of IP communication and Internet of things (IoT), cyber threats intensify, thus making information security controls unignorable issues."To mitigate increasing information security risks, many industries start paying attention to information security and installing industry firewalls to secure remote access and intercept suspicious data exchanges," said Hadwin Liu, Chief Architect of NEXCOM Network and Communication Solutions Business Group.Still, malicious users keep trying ways to disguise malware to bypass firewalls. To patch this, information security products integrate IDS/IPS and use smart control and correlation engine to filter malicious packets. With industrial protocols and behavior-based pattern matching, they can block suspicious connections to industrial networks and endpoint assets.As protection targets in industrial networks are machinery, network security products should be scattered at exit points of each subdomain for close protection. In case malware-infected machinery in one subdomain tries to infect machinery in other domains, IDS/IPS will drop data packets, cut off connections, and restrict access, containing the infection.NEXCOM's industry firewalls integrate VPN, firewall, and IDS/IPS. "Our IDS/IPS engine has rich signature database. Through log analysis and SIEM, it detects abnormal programs hiding in normal packets. While industrial machines adopt dynamic IP address, VPN helps headquarters remotely monitor production," said Liu.Security breach and consequences in industrial networks can be critical. Integrated industry firewalls shield malware and protect endpoint assets at the bottom layer from risks interrupting operation and from hackers stealing intellectual property and confidential data.For more information about NEXCOM, please visit http://www.nexcom.com/Protecting endpoint assets at the bottom layer of industrial networks requires integrated defense with VPN, firewalls, and IDS/IPS.

Western China (Sichuan) Import Expo & International Investment Fair ("WCIIF" for short) has held its press release on 12th Oct morning in Chengdu. In the replies to the questions of the journalists, the spokesman of Sichuan Bureau of Expo Affairs mentioned that, WCIIF will be more practical, more professional and more international.As reported, organizing displays around the strategy of "One Belt One Road", WCIIF has attracted enterprises, delegations and guests of honor from 23 countries and regions along New Silk Road Economic Belt, which takes up 2/3 of total exhibitors.In the aspect of industry and technology import, Sichuan province has made its overall scheme: develop top 5 fast growing industries and top 5 emerging leading service trades. Under the above guidance, the organizer has arranged world-famous enterprises to exhibit at the WCIIF: Manufacturers: ATLAS (Sweden), Haulotte (France), Schmalz (German), Foxconn……; Electronic information: Microsoft, Dell, Panasonic……; Intelligent automobile: Hyundai, Toyota……; and groups of companies (Exim Bank of China, Utrans, Suning, etc.) from trade service industries like finance, international e-commerce, tourism and culture. The event will draw global businesses to showcase the latest products and technologies entering the West China marketplace.In the Meantime, Western China Imports Purchase & Supply Symposium 2015 will be held during the WCIIF. Over 3800 buyers have registered for this session. Representatives from United Nations Procurement Department, foreign official delegations, Foreign Consulate General in Chengdu, China Federation of Logistics & Purchasing and other organizations will attend the conference. Other 8 concurrent sessions of trade including 2015 China Supply Chain Management Summit, United Nations Procurement Service, Advanced science and technology, analytical and testing instruments, energy conservation and environment protection etc. is ready to open. Attendees (world famous circulation enterprises, import agents, supply chain management, warehousing enterprises) can access the power of WCIIF during face to face discussion with exhibitors.

Apple has updated the entire iMac family, bringing a new Retina Ultra HD display to the 21.5-inch iMac for the first time and the Retina 5K display to every 27-inch iMac. The updated iMacs also feature more powerful processors and graphics, two Thunderbolt 2 ports and new storage options.Apple also introduced a new lineup of wireless accessories including the Magic Keyboard, Magic Mouse 2 and Magic Trackpad 2. The Magic devices feature rechargeable batteries that eliminate the need for disposable batteries. The new Magic Trackpad also brings Apple's Force Touch interface to the desktop.The 21.5-inch iMac is available with the all-new Retina Ultra HD display featuring a 4,096 by 2,304 resolution and 9.4 million pixels, 4.5 times more than the standard 21.5-inch iMac display. Every 27-inch iMac features a Retina 5K display, currently the highest resolution all-in-one display with a 14.7 million pixels, 7 times more pixels than an HD display.The new Retina 5K and Ultra HD displays feature a wider P3-based color gamut that provides a 25% larger color space.The new 27-inch iMac with Retina 5K display now comes with sixth-generation Intel Core processors and the latest AMD graphics that deliver up to 3.7 teraflops of compute power. The new 21.5-inch iMac with Retina Ultra HD display features a fifth-generation Intel Core processor and enhanced Intel Iris Pro Graphics. Two Thunderbolt 2 ports now come standard on all iMacs and deliver up to 20Gbps data transfer speeds for external drives and high-performance peripherals. And three stream 802.11ac Wi-Fi allows iMac to support up to 1.3Gbps wireless networking.Fusion Drive combines the large storage capacity of a hard drive with the high performance of flash to deliver shorter boot times and faster access to apps and files. Fusion Drive works in conjunction with OS X to adapt to the way consumers use their iMac and automatically moves the files and apps they use most often to flash storage. Fusion Drive pairs a 1TB hard drive with 24GB of fast flash. Fusion Drive is also available with 2TB and 3TB configurations with 128GB of fast flash for more demanding workloads. For the ultimate in storage performance, optional all flash storage is available up to 1TB and is now up to 2.5 times faster.The 27-inch iMac comes in three models starting at US$1,799, US$1,999 and US$2,299, while the 21.5-inch iMac is also available in three models starting at US$1,099 and US$1,299 and with a Retina Ultra HD display starting at US$1,499.Every new iMac comes standard with the new Magic Keyboard and Magic Mouse 2, and customers can order the new Magic Trackpad 2 as an option. Magic Keyboard is available for US$99. Magic Mouse 2 is available for US$79. And the Magic Trackpad 2 is available for US$129.Apple iMac all-in-one PC with new Retina displayPhoto: Company

The development of the IoT industry in recent years from smartphones to wearable devices has accelerated the need for miniaturized components and advanced processing technologies. Through the integration of key manufacturing technologies, Chilisin has been able to dramatically improve inductor performance while downsizing. In the highly competitive environment today, the pursuit of miniaturization has become the trend to success.HEI160808 mini molding choke demonstrates leading innovationThe miniaturization trend of components began with the evolution of smartphones. Increasing functions in smartphones are increasingly demanding higher battery usage and hence, larger battery size. Under such circumstances, aside from batteries, all other components within a smartphone are met with a downsizing requirement. In 2013, Chilisin successfully developed the HEI (High Efficiency Inductor) series molding power choke which received notable industry recognition and approval by large international smartphone makers due to its superior performance characteristics. This year, Chilisin is launching the new HEI160808 in 1.6 x 0.8 x 0.8mm dimensions, an even smaller version of the power choke. This new product has already entered into the mass production stage and has been adopted in some of this year's newly released smartphone models. Customer satisfaction and leading technological capability especially in the smartphone sector strongly reinforces Chilisin's competitive positioning and growth momentum in the coming year.Newly-launched MTF100505 to challenge the limits of thin-film manufacturing process technologyIn the second half of 2015, Chilisin expects to launch the molding thin-film inductor MTF 100505. This product uniquely utilizes tiny film sheets as coils inside a tiny molded case, a process made only possible via advanced thin-film technology in combination with molding technology. The end result is further downsizing from the previous HEI series molding power choke to achieve 1.0 x 0.5 x 0.5 mm dimensions, the smallest possible power inductor for use in smartphones. Chilisin's President Mr. Jack Chung has indicated the Company does not only seek to miniaturize components, but also to achieve a high standard of quality and more importantly to deliver superior performance characteristics in order to build long-term relationships with customers.New highlights of high-frequency wire-wound inductors: CS0201 and CHQ0402For smartphone high-frequency application, Chilisin is unveiling two newly developed miniaturized inductors. Firstly, the CS0201 series, produced using high-precision wire-winding technology, has already entered into mass production stage. On the other hand, the CHQ0402 series, produced using multilayer technology, will be ready for sampling at the start of the fourth quarter. Both of these products are among the smallest of their kind in the industry, so small that it is barely visible to the naked eye. Once again, these products demonstrate Chilisin's success towards product miniaturization in light of the IoT era.Miniaturization trend and growing automotive segment to act as double-engine to drive futureChilisin's innovation and technological leadership in the miniaturization trend lies in having four core process technologies, including thin-film, multilayer, molding and wire-winding production methods. Chilisin's favorable position in the mobile segment began with early-on efforts to penetrate high-end smartphone and other wearable device markets. Efforts to improve fundamental production technologies, build capacity, maintain close industry analysis and supplier relationships have well prepared Chilisin to deliver innovative products to the market on such a key timing and to secure its leading position on the market.Concerns about the strength of the global economy has weighed on the market in the second half of the year as electronic and component makers worldwide struggle to sustain revenue growth. Despite a downbeat atmosphere, Chilisin delivered an impressive 25% YoY growth rate on revenue from January to July. Notably in July, revenue from overseas markets (ex-Greater China region) has, for the first time in Company history, surpassed revenue from the China market. Successful developments of large international customers have attributed to such a rapid growth for overseas divisions, where the revenue target for the full year has already been surpassed in three quarters. In terms of application segment, Chilisin is focusing largely on three of the five main segments, including mobile, automotive and networking to be the growth drivers into 2018. Developments in product innovation will continue to bring Chilisin's product offerings in line with Japanese competitors, with certain product sectors such as the molding power choke series surpassing Japanese peers. Newly established sales offices in the Eastern United States and Southeast Asia will be supporting the rapid growth rate of the Company. To end the note, Chilisin's President Mr. Jack Chung stated that under the moving puzzles of the industry, quality is the constant benchmark that must be upheld in order to guarantee success.