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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Wednesday 11 December 2019
Zhen Ding to build capacity for SiP, AiP substrates
Taiwan-based PCB specialist Zhen Ding Technology has decided to enforce a capital increment of US$50 million at its second IC substrate subsidiary to build new capacity for advanced...
Wednesday 11 December 2019
MediaTek to unveil 2nd 5G SoC later in December
MediaTek reportedly plans to unveil its second 5G SoC in the latter half of December, one month after it released the first model of its 5G SoC family product, the Dimensity 1000,...
Wednesday 11 December 2019
Competition in TWS chip market to heat up in 2020
The global market for SoCs for true wireless stereo (TWS) earbuds is poised for exponential growth in 2020, but competition will heat up, driving IC suppliers to improve their product...
Tuesday 10 December 2019
Semicon equipment makers to embrace bright prospects for 2020
With capital expenses by semiconductor firms in Taiwan and China set to regain expansion momentum in 2020, equipment supply chain players are expected to see a bright year for their...
Tuesday 10 December 2019
Backend partners to gain from Sony CIS capacity expansion in 2020
Taiwan's CMOS image sensor (CIS) packaging specialists including Kingpak Technology, Xintec,VisEra Technologies and Tong Hsing Electronic Industries are expected to benefit significantly...
Tuesday 10 December 2019
TSMC revenues up in November, UMC and VIS down
Taiwan Semiconductor Manufacturing Company (TSMC) saw its November revenues increase 1.7% sequentially, while revenues at United Microelectronics (UMC) and Vanguard International...
Tuesday 10 December 2019
Flexible PCB makers gearing up for 5G iPhone antenna orders
Taiwan-based flexible PCB makers including Zhen Ding Technology and Flexium Interconnect are gearing up to capture orders for flexible antenna boards for 5G iPhones, especially those...
Tuesday 10 December 2019
TSMC obtains Sony orders for CIS, says report
TSMC has obtained orders for CMOS image sensors from Sony, and will fabricate the chips using 40nm process technology at Fab 14A in Tainan, southern Taiwan, according to a recent...
Tuesday 10 December 2019
Nuvoton braces for impact from acquiring loss-making business from Panasonic
Acquiring Panasonic's loss-making semiconductor business will have a negative impact on Nuvoton Technology's profitability in the short term, and it may take time for the business...
Monday 9 December 2019
Highlights of the day: Memory maker slows fab construction
Although the memory market looks to be heading towards a recovery in 2020, suppliers are cautious about expanding supply. Winbond is building a new plant in Kaohsiung, southern Taiwan,...
Monday 9 December 2019
ASE reportedly grabs SiP orders for new Qualcomm PC processor
Qualcomm has launched new Arm-based processors for notebooks. Among the chips, the new Snapdragon 7c series designed for entry-level devices reportedly adopts ASE Technology's system-in-package...
Friday 6 December 2019
Highlights of the day: TSMC on track to start 3nm production in 2022
TSMC has been fast advancing its manufacturing processes. It is on track to move 5nm node to commercial production in the second half of 2020, and will soon break ground for a ...
Friday 6 December 2019
MediaTek, Realtek to ramp Wi-Fi 6 chip output in 2020
MediaTek and Realtek Semiconductors are both gearing up to ramp up their output of Wi-Fi 6 (802.11ax) chips in 2020, according to sources at IC testing solutions providers.
Friday 6 December 2019
AUO loses Motorola foldable Razr OLED orders to Chinese peers
Motorola has switched orders for flexible AMOLED panels for its new foldable smartphones to Chinese suppliers BOE Technology and China Star Optoelectronics Technology (CSOT) from...
Friday 6 December 2019
Qualcomm Snapdragon 865 flagship fabricated on TSMC 7nm without EUV
TSMC uses its N7, the foundry's 7nm process without EUV, to fabricate Qualcomm's latest flagship processor, Snapdragon 865 series. Nevertheless, its Snapdragon 765 chips are being...