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Friday 19 June 2020
Highlights of the day: TSMC to start making 5G iPhone chips
TSMC is expected to the start production of A14 processor on 5nm process later this month for Apple's upcoming iPhone, which sources say will adop Qualcomm's X60 modem, allowing the...
Friday 19 June 2020
Tripod Tech expects sequential PCB sales growth in 3Q20
Rigid PCB manufacturer Tripod Technology expects its revenues for the third quarter of 2020 to grow sequentially on stronger PCB shipments for servers, network equipment and memory...
Friday 19 June 2020
Automotive IC market to grow at strong CAGR by 2024, says IC Insights
The automotive IC market is forecast to register a strong growth of 9.7% CAGR by 2024, according to IC Insights.
Friday 19 June 2020
Semiconductor equipment billings increase
Billings among North American manufacturers of semiconductor production equipment increased 2.9% sequentially and 13.1% on year, and stayed above US$2 billion for the eighth consecutive...
Friday 19 June 2020
PCB maker Compeq cautious about 2H20
PCB manufacturer Compeq Manufacturing expects to end the first half of 2020 with good business results but remains cautious about its operations in the second half of 2020 citing...
Friday 19 June 2020
Phison to acquire stake in Sony subsidiary
Phison Electronics plans to acquire a 49% stake in Nextorage, a subsidiary of Sony Storage Media Solutions (SSMS), for an undisclosed sum, according to the Taiwan-based flash storage...
Friday 19 June 2020
TSMC to start chip production for next-gen iPhones
TSMC will enter production using 5nm process technology later in June for Apple's custom-designed A14 processor and Qualcomm's Snapdragon X60 modem, with both set to power the upcoming...
Thursday 18 June 2020
Highlights of the day: Intel, TSMC head to head in 3D packaging
Intel and TSMC are head to head in 3D packaging technology. While Intel has unveiled its Lakefield processors 3D-packaged...
Thursday 18 June 2020
Xiaomi invests in BYD Semiconductor to expand into the automotive component business
China-based Xiaomi has invested a total of CNY50 million (US$7.06 million) in a Series A+ round of financing that BYD arranged for its chipmaking affiliate BYD Semiconductor. Xiaomi...
Thursday 18 June 2020
Intel, TSMC gearing up for heterogeneous 3D IC integration
Intel has launched its first heterogeneous chip architecture made using its Foveros 3D chip stacking technology, while TSMC is looking to commercialize its SoIC (system on integrated...
Thursday 18 June 2020
Mosel, Actron team up for auto-use ULLD, IGBT components
Six-inch foundry Mosel Vitelic and diode maker Actron Technology are revving up their collaboration on diverse automotive power chips such as low loss diode (LLD), ultra LLD (ULLD)...
Thursday 18 June 2020
China, Taiwan IC designers keen on developing OLED DDI chips
Fabless chipmakers in Taiwan and China specializing in display driver ICs and fingerprint sensor chips are keenly developing OLED DDI chip solutions for smartphones seeking to build...
Thursday 18 June 2020
Nan Ya PCB looks to ABF, SiP substrates for profit growth in 2020
Nan Ya PCB will be striving to boost its profits in 2020 by focusing more on shipments of high-value products such as ABF and SiP substrates, according to company chairman CC Wu.
Wednesday 17 June 2020
EMC lands new orders for servers
CCL maker Elite Material (EMC) has gained validation from server brands and datacenter clients with their orders gradually picking up recently, according to the company.
Wednesday 17 June 2020
IC vendors to gain from strong IP camera demand through 3Q20
Chip demand for IP network camera applications has grown significantly to support remote work and education activities driven by the coronavirus pandemic, and Taiwan specialty IC...