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IN THE NEWS
Friday 6 December 2019
Semiconductor market suffers another plunge in 3Q19, says IHS
With revenues plunging by 14.7% in the third quarter, the global semiconductor market appears destined for a year of double-digit decline despite some signs of growth in the critical...
Friday 6 December 2019
Taiwan IC design houses see orders slow down from China
Taiwan-based IC design houses have seen their China-based customers start slowing down their pace of orders due to year-end inventory checks at the clients, which may drag down revenues...
Thursday 5 December 2019
Lian Hong sees opportunity in notebook hinge business
Although the global notebook market's annual shipments have remained at around 160 million units for the past several years, Taiwan-based notebook hinge maker Lian Hong still sees...
Thursday 5 December 2019
Highlights of the day: 5G to see intense competition in midrange phone segment
Qualcomm has introduced its new 5G SoC lineup - the Snapdragon 865 series for smartphone vendors' flagship models...
Thursday 5 December 2019
Taiwanese IC designers seeking closer partnerships with Chinese foundries
More Taiwan-based IC design houses are moving to strengthen partnerships with foundries in China so as to land more orders from Chinese brand vendors seeking to cut reliance on US...
Thursday 5 December 2019
Powerchip seeing strong demand for smartphone sensors
Powerchip Semiconductor Manufacturing (PSMC), a foundry subsidiary of Powerchip Technology, has enjoyed robust demand for smartphone-use sensors which is filling its 12-inch fab ca...
Thursday 5 December 2019
Taiwan PC monitor shipments to stop growing in 4Q19
Taiwan's PC monitor shipments registered increases of 8.2% sequentially and 5.8% on year in the third quarter of 2019, according to Digitimes Research. But shipments are unlikely...
Thursday 5 December 2019
NAND flash to grow fastest in 2020, says IC Insights
NAND flash is expected to see the fastest growth in 2020 among all IC segments, according to IC Insights.
Thursday 5 December 2019
Nan Ya may double capex in 2020 to hike ABF, SiP substrate capacity
Taiwan-based Nan Ya PCB is expected to double its 2020 capex from NT$3.5 billion (US$114.8 billion) in 2019 to expand capacity for ABF substrates for 5G network applications and SiP...
Thursday 5 December 2019
Midrange 5G handset chips market to heat up in 1H20
The main battlefield in the 5G mobile chip market is expected to shift from flagship models to mostly midrange ones in the first half of 2020, as around 70% of over 200 million 5G...
Thursday 5 December 2019
ST closes acquisition of silicon carbide wafer specialist Norstel AB
STMicroelectronics has announced the closing of the full acquisition of Swedish silicon carbide (SiC) wafer manufacturer Norstel AB. ST exercised its option to acquire the remaining...
Thursday 5 December 2019
Qualcomm intros new 5G SoC lineup
Qualcomm has introduced its new Snapdragon 865 and 765 seies SoC chips designed for 5G-capable Android smartphones slated for launch in 2020. TSMC and Samsung Foundry reportedly are...
Wednesday 4 December 2019
Global semiconductor sales increase in October
Worldwide semiconductor sales grew nearly 3% sequentially in October. However, sales posted an on-year decline for the 10th consecutive month.
Wednesday 4 December 2019
Worldwide semiconductor equipment billings rise 12% in 3Q19, says SEMI
Worldwide semiconductor equipment manufacturers posted third-quarter 2019 billings of US$14.9 billion, a sequential increase of 12% but a 6% decrease on year, according to SEMI.
Wednesday 4 December 2019
BOE, CSOT to stop investing in LCD panel segment
BOE Technology and China Star Optoelectronics Technology (CSOT) have both disclosed plans to stop their investments in LCD display technology development and capacity expansion.