CONNECT WITH US
Global supply chain: Key components
Key components news coverage
IN THE NEWS
Thursday 28 November 2019
Metal stamping firm Anli to install new production lines in China
Anli International is planning to establish a sintering production line at its factory site in Zhejiang, China to provide etching process for its vapor chamber products with volume...
Thursday 28 November 2019
Innolux develops ODTG-based all-screen panels for handset applications
Innolux has introduced its own ODTG (one data triple gate) circuit technology for the production of all-screen panels for handset applications, with volume production scheduled to...
Thursday 28 November 2019
AWSC expanding 6-inch GaAs foundry capacity for 5G devices
GaAs foundry Advanced Wireless Semiconductor (AWSC) is gearing up for capacity expansion to satisfy ever-expanding demand for 5G RF (radio frequency), PA (power amplifier), WiFi 6...
Thursday 28 November 2019
CCL firm EMC gearing up for 5G handset application orders
As motherboard upgrades at 5G smartphones are gaining momentum, Taiwan-based CCL maker is poised to compete with Japanese peer Panasonic to benefit more from the first wave of 5G...
Thursday 28 November 2019
TSMC and UTokyo announce semiconductor tech collaboration
The University of Tokyo and TSMC have announced an alliance to pursue organization-wide collaboration in leading-edge semiconductor technology. Under the alliance, TSMC will provide...
Wednesday 27 November 2019
WT Micro says tender offer by WPG raises concerns among customers
WPG's tender offer for WT Microelectronics shares has raised concerns among the latter's customers as well as suppliers, according to WT Micro chairman and CEO Eric Cheng.
Wednesday 27 November 2019
Highlights of the day: MediaTek launches Dimensity 5G SoC
MediaTek has launched its next-generation 5G SoC family, Dimensity. The launch made a splash with high-ranking executives from many fellow semiconductor firms, including TSMC and...
Wednesday 27 November 2019
MediaTek intros new-gen 5G SoC
MediaTek held a press conference on November 26 to introduce the new generation of its 5G SoC chips, with guests including TSMC VP Lora Ho, a number of high-ranking executives from...
Tuesday 26 November 2019
Taiwan October manufacturing production index down on year
Taiwan recorded manufacturing production index (2016 as base year) of 114.34 for October 2019, increasing 2.78% sequentially but decreasing 3.27% on year, according to statistics...
Tuesday 26 November 2019
SiP, AiP processes to gain momentum for 5G applications in 2020
System-in-package (SiP) will gain significant growth momentum in 2020 as it will be badly needed to process wireless connectivity devices including RF front-end modules, antenna modules...
Tuesday 26 November 2019
WT Micro employees speak up against WPG acquisition bid
Taiwan-based WPG's recent unsolicited tender offer for buying 30% of fellow IC distributor WT Microelectronics shares has stoked strong opposition from the latter's employees.
Tuesday 26 November 2019
ESMT expects niche-market DRAM prices to rebound
Memory-IC design house Elite Semiconductor Memory Technology (ESMT) expects niche-market DRAM prices to rebound in 2020
Tuesday 26 November 2019
Intel, MediaTek partner to bring 5G connectivity to next-gen PC
MediaTek has announced it is partnering with Intel to bring MediaTek's new 5G modem to PCs. Through this partnership, Intel has been working with MediaTek on the 5G solution for deployment...
Monday 25 November 2019
Highlights of the day: Apple reportedly sets strong shipment goal for 5G iPhones
Sales of iPhone 11 devices reportedly have been brisk since their launch, and market observers expect shipments of the latest Apple smartphones to reach 70-80 million units during...
Monday 25 November 2019
HannStar Board 3Q19 profits hit 10-year high
PCB maker HannStar Board has posted the highest profit in 10 years in the third quarter of 2019, with gross margin nearing 20% and net earnings shooting up 62.17% on year to NT$1.514...