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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Friday 17 October 2025
Apple releases M5 chip with 30% higher memory bandwidth and enhanced NPU
Apple quietly launched new MacBook, iPad, and Vision Pro products equipped with its latest M5 chip on the evening of October 15, 2025, in Taiwan, generating considerable public attention...
Friday 17 October 2025
AI, HPC, memory, and new devices drive Taiwan PCB makers to peak season growth
As the generative AI (GenAI) boom becomes a central focus in tech development, high-performance computing (HPC) opportunities continue to expand, recently causing supply-demand gaps...
Friday 17 October 2025
Airoha leverages MediaTek Wi-Fi chips to diversify into global telecom market
Airoha Technology has continued to secure new collaboration opportunities in the international telecom market in 2025, with some of its previously developed markets now entering mass...
Friday 17 October 2025
Taiwan PCB makers seize semiconductor opportunity amid load board shortage
As the AI boom drives demand for advanced packaging, chip testing at the backend is facing challenges in temperature, frequency, and speed. In response, the testing interface industry...
Friday 17 October 2025
Rebellions joins Arm Total Design to advance next-gen AI infrastructure
AI inference chip startup Rebellions announced on October 15 that it has joined Arm's Total Design ecosystem. The announcement, made at the OCP Global Summit 2025, positions the company...
Friday 17 October 2025
Audix sales driven by AI, EV, and medical growth in 3Q25
Electronic components distributor Audix has demonstrated operational resilience with steady revenue growth in the third quarter of 2025, when gross margin surged past 30% to reach...
Friday 17 October 2025
OCP Summit: Broadcom claims 90% AI efficiency jump, reshaping optical and interconnect supply chains

At the OCP Global Summit, Broadcom unveiled major advances in Co-Packaged Optics (CPO), claiming the technology has reached the maturity...

Thursday 16 October 2025
Tsinghua University breaks imaging limits with Rafael chip, launching sub-angstrom era
The Department of Electronic Engineering at Tsinghua University (THU) in Beijing has developed the world's first "sub-angstrom snapshot spectral imaging chip" named Rafael. The research...
Thursday 16 October 2025
Qualcomm faces China antitrust probe over Autotalks acquisition
Ten years ago, Qualcomm paid the largest antitrust fine in China's market regulation history. It has yet again violated China's policies, this time because its acquisition case was...
Thursday 16 October 2025
How a viral Taiwan dinner photo put Nvidia and its partners under Washington’s microscope
A publicly shared photo from a private gathering in Taiwan has set off debate over whether US export rules on advanced technology are being skirted, putting Taiwanese hardware makers...
Thursday 16 October 2025
Intel pursues open AI architecture and annual GPU updates to catch up
Intel has unveiled its most ambitious artificial intelligence (AI) roadmap to date, featuring the next-generation Panther Lake AI PC processor, Clearwater Forest server processor,...
Thursday 16 October 2025
Column: Macroscopic quantum tunneling discovery redefines limits of quantum mechanics and fuels quantum technology advances
The 2025 Nobel Prize in Physics has been awarded to John Clarke, Michel Devoret, and John Martinis for their groundbreaking experimental work demonstrating macroscopic quantum tunneling,...
Thursday 16 October 2025
China's 10.5 generation panel depreciation to boost TV panel market dominance
China leads in LCD TV panel production, with BOE and TCL CSOT expected to control over 72% of the market by 2026. Over the past decade, global LCD TV panel capacity has become highly...
Thursday 16 October 2025
Apple unveils Vision Pro, MacBook Pro, and iPad Pro powered by the new M5 chip
On October 15, 2025, Apple announced three major product launches — the upgraded Apple Vision Pro, a new 14-inch MacBook Pro, and the latest iPad Pro — each powered by...
Thursday 16 October 2025
OCP Summit: Arm expands ecosystem to support AI workloads and chiplet integration
Arm is strengthening its ecosystem for next-generation AI applications by adding partners across firmware, ASIC design, networking, and packaging. The company is also advancing chiplet...