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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Wednesday 21 October 2026
Advanced PCB drilling faces growing demand from AI and high-speed applications
Topoint Technology is positioning its precision PCB drilling business for rising demand from AI servers, high-performance computing, and high-speed transmission applications. At TPCA...
Wednesday 21 October 2026
LX Semicon uses AI agents to cut display chip design time by 80%
South Korean IC design firm LX Semicon has deployed AI agents in the development of display driver ICs (DDIs), reducing the design time for a benchmark image-processing engine from...
Wednesday 21 October 2026
AI customers seek 3-year partnerships as Unimicron calls for Taiwan PCB supply chain collab
TPCA Show Taipei 2026, organized by the Taiwan Printed Circuit Association (TPCA), opened on October 20. Unimicron Technology chairman S.C. Chien delivered a keynote at the opening...
Wednesday 21 October 2026
Nvidia's Vera CPU signals a broader shift in AI infrastructure
Nvidia is positioning its Vera CPU as a central component of data-center infrastructure for agentic artificial intelligence, as multistep reasoning and tool calls increase demand for...
Wednesday 21 October 2026
Packaging-to-board integration emerges as key gap as AI reshapes electronics supply chain
Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board...
Tuesday 20 October 2026
Unimicron chairman sees substrate sizes reaching 14x current scale by 2030
TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance...
Tuesday 20 October 2026
AI server demand lifts Tongtai drilling orders through 2027
Tongtai Machine & Tool said it had order visibility for its printed circuit board (PCB) drilling equipment through the end of 2027 as AI infrastructure demand increased pressure...
Tuesday 20 October 2026
AUO selects glass substrate specs for semiconductor processes, not size rivalry
AUO is tailoring its glass core substrate specifications specifically to semiconductor process requirements rather than competing on panel dimensions with Innolux, according to Chairman...
Tuesday 20 October 2026
Hygon's revenue jumps 58% on AI chip demand, but growth slows amid 51% stock slump
China's Hygon Information Technology reported a 57.58% increase in revenue for the first nine months of 2026, reflecting sustained demand for domestic high-performance processors and...
Tuesday 20 October 2026
DeepSeek-Huawei chip co-design could shift AI training away from Nvidia
DeepSeek is reportedly working closely with Huawei to influence the design of its future AI chips, a link reportedly closer than typical supplier-customer relationships. The collaboration...
Tuesday 20 October 2026
OLED monitor panel shipments set to overtake TV panels in 2028
Gaming demand is reshaping the OLED panel market, with OLED monitor panel shipments forecast to surpass TV panel shipments for the first time in 2028. South Korean panel makers are...
Tuesday 20 October 2026
China's S2C–HyperSilicon merger targets hardware emulation gap in domestic EDA with Empyrean backing
China's electronic design automation (EDA) industry is consolidating, with Shanghai-based S2C and Wuxi-based HyperSilicon merging into a unified digital front-end EDA platform. Backed...
Tuesday 20 October 2026
Intel says it is the only high-volume fab for 12-inch InP silicon photonics as co-packaged optics nears deployment
Intel is pitching its foundry as the industry's supplier of light sources for AI data center optics, claiming at the 2026 Open Compute Project (OCP) Global Summit that it is the only...
Tuesday 20 October 2026
Alibaba's XuanTie tops 6 billion RISC-V chip shipments, expands into AI servers with C950
Cumulative shipments of chips incorporating Alibaba DAMO Academy's RISC-V processor intellectual property (IP), branded XuanTie, have surpassed 6 billion, marking a milestone for the...
Tuesday 20 October 2026
Yale develops fluidic memory chip using water flow, microfibers
A research team at Yale University in the US has found that flowing networks made of water or other fluids can store memory like computer chips, leading to the development of a fluidic...