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Global supply chain: Key components
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IN THE NEWS
Tuesday 6 January 2026
CES 2026: Qualcomm unveils Dragonwing IQ10 robotics processor and general-purpose physical AI stack
Qualcomm Technologies introduced a next-generation robotics architecture at CES 2026, featuring the Dragonwing™ IQ10 Series processor for advanced industrial autonomous mobile...
Tuesday 6 January 2026
CES 2026: Nvidia unveils 'Vera Rubin' architecture with 10x cost efficiency, lays out roadmap to Kyber
Nvidia CEO Jensen Huang officially introduced the "Vera Rubin" platform at CES 2026 on January 6, 2026. The launch marks a pivotal shift in the company's hardware innovation cycle...
Tuesday 6 January 2026
Nvidia showcases end-to-end AI stack from deskside supercomputers to autonomous driving
At CES 2026, Nvidia unveiled a suite of AI innovations spanning data center, enterprise, robotics, and autonomous vehicles. Highlights include the Rubin six-chip AI platform, DGX...
Tuesday 6 January 2026
CES 2026: Qualcomm unveils Snapdragon X2 Plus platform to power next-generation Copilot+ PCs

Qualcomm unveiled the Snapdragon X2 Plus platform at CES 2026, expanding its Snapdragon X Series lineup for Windows 11 Copilot+ PCs....

Tuesday 6 January 2026
Nvidia at CES: Alpamayo, Rubin, and the rise of reasoning AI
On January 5, Nvidia CEO Jensen Huang opened the company's CES keynote in Las Vegas by welcoming the live and global audience, wishing attendees a Happy New Year, and setting expectations...
Tuesday 6 January 2026
Portwell Acquires Wincomm Stake to Expand Medical Industrial Edge AI

Portwell, Inc., a leading provider of industrial and embedded computing solutions and a subsidiary of Posiflex Technology Inc., today announced its strategic investment...

Tuesday 6 January 2026
HKC reportedly eyes OLED debut as industry pivots to bigger panels
HKC, a major Chinese display manufacturer, is weighing a potential entry into organic light-emitting diode production through a proposed sixth-generation facility. The move would...
Monday 5 January 2026
Qualcomm cloud AI ASIC business strategy
Qualcomm advances from edge to cloud AI ASIC, challenging the existing cloud computing power supply chain landscape.
Monday 5 January 2026
Weekly news roundup: TSMC widens 2 nm edge as South Korea boosts chip spending; Huawei eyes memory bottlenecks
These are the most-read DIGITIMES Asia stories in the week of Dec 29 - Jan 4.
Monday 5 January 2026
Taiwan fortifies silicon shield with 2026 push to set global chip agenda
As AI server and semiconductor companies look set to close out a profitable 2025, recent Chinese military encirclement exercises and live-fire drills around Taiwan have once again...
Monday 5 January 2026
TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung
As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...
Monday 5 January 2026
Trump orders divestment of EMCORE chip assets, tightening US scrutiny of foreign semiconductor deals
US President Donald Trump has ordered the divestment of certain semiconductor assets of EMCORE Corporation following a national security review that identified risks linked to foreign...
Monday 5 January 2026
India roundup: OSAT players claim legacy packaging price parity

Indian OSAT players aim for price competitiveness on par with Malaysian rivals, as L&T Semiconductor...

Monday 5 January 2026
Taiwan IC design industry faces intensifying G2 pressures in 2026
Taiwan's integrated circuit (IC) design sector faces intensified challenges as 2026 begins that may push its global revenue ranking to third place, largely due to competitive pressures...
Saturday 3 January 2026
Analysis: Chip boom squeezes device makers as surging component costs threaten margins
The global semiconductor market is projected to reach US$1 trillion as early as 2026, significantly ahead of previous industry forecasts targeting 2030. The World Semiconductor Trade...