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IN THE NEWS
Friday 22 May 2026
AUO ditches panel era with three new business lines for next decade
Looking ahead to 2026, AUO said the global economy is stabilizing and returning to growth, but that international trade disputes and regional conflicts still pose risks. It added that...
Friday 22 May 2026
BOE, Corning target glass substrates for AI chip packaging

BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the...

Friday 22 May 2026
US-Japan cooperation could protect Taiwan '99%', defense investors told at Silicon Valley summit
Taiwan's semiconductor industry and the military implications of a potential cross-strait conflict dominated the aerospace and defense track on the second day of the Plug and Play...
Friday 22 May 2026
Tech Forum 2026: AI agents drive Arm CPU demand surge; 2026 shipments expected to exceed 6 million units
On May 20, 2026, DIGITIMES held its Tech Forum, where senior analyst Jim Hsiao delivered a presentation, "AI server market outlook and trends amid the explosion of agent applications."...
Friday 22 May 2026
Nvidia characterizes LPX as niche silicon optimized for high-speed premium tokens
Nvidia has positioned its specialized LPX accelerator as a niche product designed specifically for low-latency, high-speed token generation rather than broad-market enterprise workloads...
Thursday 21 May 2026
AMD CEO meets with TSMC CEO in Taiwan as it expands US chip output
Advanced Micro Devices (AMD) CEO Lisa Su stated that the company plans to invest more than US$10 billion in Taiwan's industrial ecosystem to accelerate the development of artificial...
Thursday 21 May 2026
Nvidia's China hopes dim as Beijing doubles down on domestic AI chips
Nvidia's H200 was a major focus after the Trump-Xi meeting, but hopes for sales into China have faded after US President Donald Trump's latest remarks. Trump said Chinese President...
Thursday 21 May 2026
AMD commits over US$10 billion to Taiwan ecosystem to expand AI packaging and infrastructure capacity
AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for...
Thursday 21 May 2026
How Nvidia plans to sell Vera CPUs: Four deployment models explained
Nvidia has unveiled a strategic expansion of its silicon portfolio, detailing a four-pronged commercial approach for its new Vera central processing unit. The chipmaker expects the...
Thursday 21 May 2026
Nvidia targets long-term ACIE dominance as enterprise AI eclipses hyperscalers
Nvidia has detailed a significant structural shift in its data center revenue reporting, introducing a new market segmentation that separates traditional hyperscale cloud providers...
Thursday 21 May 2026
Demand surge for power semiconductors reshapes data-center power and cooling, pushing suppliers toward SiC and GaN
Demand for power components is surging as AI servers adopt high-voltage direct current power delivery and advanced cooling technologies. This shift could increase component density...
Thursday 21 May 2026
Auras Technology raises 2026 revenue outlook as AI-driven liquid cooling demand grows
Auras Technology said strong AI server demand will sustain growth in thermal management through 2028, driving the company to raise its full-year revenue growth forecast for 2026. Executives...
Thursday 21 May 2026
Tech Forum 2026: How much longer can semiconductors sustain Taiwan?
During a keynote discussion session at Tech Forum 2026, DIGITIMES senior reporter Monica Chen and semiconductor analyst Andrew Lu shared their views on current AI server technology...
Thursday 21 May 2026
Nvidia introduces ACIE sub-segment, adds Anthropic as partner, and breaks out Physical AI
Nvidia introduced a new segment reporting framework on its first quarter of fiscal 2027 call, splitting data center revenue into Hyperscale and ACIE (AI Clouds, Industrial, Enterprise)...
Thursday 21 May 2026
Nvidia prices rivals out of AI factory race with Blackwell, Vera CPU, and Rubin
Nvidia used its first quarter of fiscal year 2027 earnings call on May 20, 2026 to lay out a three-tier silicon cadence that should make any rival roadmap look thin: a Blackwell ramp...