Apple has introduced its self-developed vapor chamber (VC) cooling technology for the first time in the iPhone 17 Pro series, aiming to maintain high performance during extended use...

Taiwan wafer foundry revenue is estimated to rise mildly in the second half of 2025 from the first half, influenced by US tariff policies and a high revenue base in the first half.

In 2024, the Taiwanese government announced the launch of a 10-year NT$300 billion (approx. US$9.89 billion) Taiwan Chip-based Industrial Innovation Program (Taiwan CbI), marking...

Apple is preparing to debut vapor chamber (VC) cooling in the upcoming iPhone 17 Pro, with Taiwan's Asia Vital Components (AVC) and China's Suzhou Tianmai Thermal Technology reportedly...

The 26th China International Optoelectronic Exposition (CIOE 2025) opened in Shenzhen on September 10, attracting over 3,800 global companies across communications, optics, lasers,...

In a keynote speech delivered at the SEMICON Taiwan 2025, NXP CEO Kurt Sievers stressed that AI has ushered the semiconductor industry into a period of exponential expansion. Addressing...

After securing orders from electric vehicle maker Tesla for autonomous driving AI chips, Samsung Electronics' foundry division is reportedly in talks with xAI, an artificial intelligence...

Competition among major US cloud service providers (CSPs) and AI firms is intensifying, with Google currently perceived as holding a leading position in the overall AI market. Its...

Zhen Ding Technology Group (ZDT), the world's largest printed circuit board (PCB) manufacturer, returned to SEMICON Taiwan 2025 to highlight how the AI boom is reshaping PCBs from...

The 26th China International Optoelectronic Expo (CIOE) and the Shenzhen International Semiconductor & IC Exhibition (SEMI-e 2025) are being held at the Shenzhen International...

Taiwan-based advanced packaging equipment provider C SUN Manufacturing, Ltd. (TWSE: 2467), now in its 60th year, is undergoing a critical transformation as it expands from its roots...

Nvidia has introduced Rubin CPX, a next-generation GPU designed for massive-context AI, enabling systems to handle million-token software coding and generative video at unprecedented...

Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision...

Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in...

NXP Semiconductors has appointed Sandy Hu, a 25-year semiconductor veteran and former TI China president, as senior vice president of sales and marketing for Greater China. She will...