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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Wednesday 24 July 2024
SDC 8.6G OLED investment fuels South Korea panel equipment import surge
South Korea's imports of panel manufacturing equipment soared tenfold in the first half of 2024 compared to the same period in 2023, reaching approximately US$315 million. This dramatic...
Wednesday 24 July 2024
Who will benefit from a potential tariff war on chips?
With Taiwan Semiconductor Manufacturing Company (TSMC) chairman C. C. Wei promising to carry through overseas expansion plans regardless of the next US President, those securing TSMC's...
Wednesday 24 July 2024
Post-Biden-exodus, Democratic candidates and supply chain prospects
On July 21, US President Joe Biden announced that he would not seek re-election, a decision that adds new variables to the semiconductor and electronic manufacturing supply chain...
Wednesday 24 July 2024
Poor results from NXP raise doubt on 2H24 car chip demand
Disappointing results from NXP Semiconductors in its latest financial report may indicate that car manufacturers are becoming more conservative and the development of battery electric...
Wednesday 24 July 2024
NXP doubts Tier-1 auto customer inventory policies, details new JV with VIS
NXP reported that its performance was affected by its customers' inventory management practices. Despite this, the company expressed strong confidence in its joint venture with Taiwan-based...
Wednesday 24 July 2024
TI results offer hope amid 300mm capacity expansion for enhanced resilience
Texas Instruments (TI) provided financial guidance that is slightly lower than expectations. The company's capital expenditure (Capex) plan is progressing smoothly, indicating significant...
Wednesday 24 July 2024
TSMC sees spike in SHR orders from China
TSMC has witnessed an increase in orders from Chinese customers seeking super hot runs (SHR), for which they are willing to pay a 40% premium, according to industry sources.
Wednesday 24 July 2024
TSMC said to adopt larger glass substrates for FOPLP
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
Tuesday 23 July 2024
IC industry hopes for turnaround in 2H24 amid new AI PC solutions
When will AI PC dividends start to pay off for the chip industry? This question has been closely followed by many in the industry during the first half of 2024. The launch of Copilot+PC,...
Tuesday 23 July 2024
TSMC stands firm amid high costs and Trump's criticism, global chip mass production on target
Despite high costs and labor shortages, TSMC has adhered to its international plans to build wafer fabrication plants in Japan, the United States, and Germany.
Tuesday 23 July 2024
India's latest fabless entrant iVP Semi targets domestic market with homegrown strategy
One of the newest additions to India's growing fabless startup scene is Chennai-based iVP Semi, founded by semiconductor veteran Raja Manickam. In a recent interview with Digitimes...
Tuesday 23 July 2024
Amkor, Infineon promote supply chain decarbonization and sustainability
Amkor Technology and Infineon Technologies have signed a Memorandum of Understanding (MoU) to jointly promote sustainability and decarbonization methods across their supply chain.
Tuesday 23 July 2024
Mobile SoC suppliers expect limited growth in smartphone market in 2024
The buzz around AI smartphones is palpable, but their widespread adoption and impact on upgrade demand are expected to become more significant in approximately two years.
Tuesday 23 July 2024
NXP disappointing results imply slowing automotive demand
NXP's latest financial results indicate that the company continues to navigate the industry downturn, presenting a third-quarter outlook that falls below expectations. These disappointing...
Tuesday 23 July 2024
Huawei, MediaTek likely to settle patent dispute out of court
Huawei's patent infringement lawsuit against MediaTek is likely a move to gain bargaining chips in licensing fee negotiations between the two sides, according to industry sources.