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Tuesday 2 April 2024
AI reshuffles semiconductor industry rankings; Samsung dropped down to third
Samsung Electronics dropped from ranking first to third in 2023 for revenue in the global semiconductor market (excluding wafer foundries).
Tuesday 2 April 2024
South Korea's electricity tariff hike: business response?
South Korea's leading power utility, KEPCO, is poised to implement a hike in electricity tariffs following the parliamentary...
Tuesday 2 April 2024
Chip vendors gearing up for transition to 12-layer HBM memory
Primary memory manufacturers are expected to encounter increased competition in the High Bandwidth Memory (HBM) industry in the second half of 2024, as manufacturing technology specs...
Tuesday 2 April 2024
Chinese DRAM maker CXMT raises CNY10.8 billion
Chinese DRAM maker ChangXin Memory Technologies (CXMT), one of the biggest unicorn companies in China, has raised CNY10.8 billion (US$1.5 billion) in its latest round of financing.
Monday 1 April 2024
DRAM spot prices slide as stocking demand cools at channel distributors
DRAM spot prices are now reversing their steady upward trend seen since the second half of 2023, beginning to decline as channel distributors are slowing down their inventory stocking...
Monday 1 April 2024
AI-powered surge propels market valuation growth in global chip industry
According to market data, AI has become the growth driver for semiconductor companies as companies engaged in AI chips and equipment saw their market values surge.
Friday 29 March 2024
STMicroelectronics microcontrollers pave way for safer, cooler smart devices
STMicroelectronics's microcontrollers are a hit among industry players.
Friday 29 March 2024
CXL and HBM become key sections of Samsung's memory solution roadmap
Samsung Electronics recently disclosed its next-generation memory solution technology roadmap on Memory Con 2024.
Friday 29 March 2024
SK Hynix sees key DRAM opportunity in HBM customization
SK Hynix is expanding the High Bandwidth Memory (HBM) contribution to its DRAM revenues and expects a deepening effect of the customization trend of HBM.
Friday 29 March 2024
SK Hynix to break ground for state-backed advanced Yongin memory fab in 1Q25
SK Hynix is slated to officially break ground in March 2025 for a new advanced memory plant in Yongin, South Korea.
Thursday 28 March 2024
Samsung raises HBM shipping volume target, implying successful validation at Nvidia
Samsung Electronics announced an increase in its 2024 HBM shipping volume and disclosed more details about the development of its HBM4 product, showing that its specifications are...
Thursday 28 March 2024
Longsys enters backend industry with recent acquisitions
Longsys Electronics' recent acquisitions of Zilia (formerly SMART Brazil) and Longforce Technology Suzhou (formerly Powertech Technology Suzhou) mark the Chinese memory module specialist's...
Wednesday 27 March 2024
Dutch government allocates EUR 2.5 billion to keep ASML in motherland
ASML's future may be decided by Beethoven.
Wednesday 27 March 2024
SK Hynix reportedly planning new packaging facility for HBM in the US
Following the plan to construct an advanced semiconductor packaging facility in Indiana, United States, SK Hynix recently detailed its site selection in West Lafayette, as reported...
Wednesday 27 March 2024
Memory module house Innodisk bullish about 2024 growth
Industrial memory module specialist Innodisk has voiced optimism about its operations in 2024, citing solid demand for AI device applications.

According to Randy Chien,...