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    Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?
    2min ago
    NEWS TAGGED MEMORY CHIPS
    Wednesday 14 October 2026
    SK Hynix, Micron confront AI memory bottlenecks with HBM standardization, chip integration
    AI infrastructure expansion is shifting semiconductor competition beyond individual chip performance towards memory bandwidth, data-transfer power consumption, transistor scaling,...
    Wednesday 14 October 2026
    TSMC-GF interposer deal reshapes US AI supply chain, from CoWoS to HBM
    GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...
    Wednesday 14 October 2026
    Former Intel CEO Pat Gelsinger sees hardware renaissance in memory, optical interconnects
    As AI reshapes the global computing landscape, former Intel CEO Pat Gelsinger said AI is making chip design easier, while physical bottlenecks in manufacturing, memory, and energy...
    Tuesday 13 October 2026
    CXMT's server DRAM push raises margin concerns for Samsung, SK Hynix
    China's ChangXin Memory Technologies (CXMT) is raising concerns over the future pricing power of Samsung Electronics, SK Hynix, and Micron as its plans for next-generation server DRAM...
    Tuesday 13 October 2026
    SK Hynix unveils low-power processor design for SSDs
    SK Hynix has unveiled a new processor architecture designed to reduce power consumption and chip area in solid-state drive (SSD) controllers, expanding its efforts to address storage...
    Tuesday 13 October 2026
    Column: From 3D NAND to 3D DRAM — how vertical stacking is reshaping memory chip manufacturing
    After 2013, planar NAND flash memory began reaching its scaling limits at the 15–16nm process node. Capacitive coupling between the floating gates of adjacent memory cells increasingly...
    Tuesday 13 October 2026
    Solidigm adds first dedicated US govt relations exec
    Solidigm, the SK Hynix subsidiary, has reportedly created its first senior post dedicated to US government relations, a move that could matter for chip investors, regulators, and customers...
    Tuesday 13 October 2026
    Samsung, SK Hynix NAND profits seen surging on enterprise SSD demand
    Samsung Electronics and SK Hynix are expected to see a sharp increase in NAND flash profits in 2026 as surging demand for enterprise solid-state drives (SSDs) drives up memory prices...
    Monday 12 October 2026
    Samsung reportedly secures long-term contracts covering up to 80% of 2027 memory supply
    Samsung Electronics has committed 75–80% of its 2027 memory supply, including high-bandwidth memory (HBM), to long-term agreements (LTAs), the Korea Economic Daily reported...
    Monday 12 October 2026
    Nanya gross margin hits 85.7% as low-priced DRAM contracts roll off
    Nanya Technology reported record quarterly earnings in the third quarter of 2026, according to unaudited results released on October 12, as DRAM average selling prices (ASPs) rose...
    Monday 12 October 2026
    Samsung could unseat SK Hynix as HBM leader in 2027
    Samsung Electronics could overtake SK Hynix as the world's largest supplier of high-bandwidth memory (HBM) in 2027, as HBM4 prices climb and memory manufacturers compete for limited...
    Monday 12 October 2026
    Apple's iPhone 18 order cuts expose widening divide in premium demand

    Apple's iPhone 18 Pro lineup is showing mixed demand signals weeks after launch. Reports of component order cuts suggest weaker-than-expected sales,...

    Monday 12 October 2026
    SK Hynix's US$299 billion chip plan faces military base hurdle
    SK Hynix's proposed KRW400 trillion (approx. US$299 billion) semiconductor expansion in southwestern South Korea faces a major obstacle as the company races to increase memory production...
    Monday 12 October 2026
    CXMT targets 2026 debut of 4F² DDR5 RDIMM in bid to challenge server DRAM rivals

    China's ChangXin Memory Technologies (CXMT) plans to introduce DDR5 registered DIMMs (RDIMMs) based on its new 4F² DRAM architecture by the...

    Monday 12 October 2026
    Weekly news roundup: Musk's Terafab faces reality check; Samsung HBM4E clears quality validation
    This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces...
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    BIZ FOCUS
    Oct 15, 08:00
    Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI
    Wednesday 14 October 2026
    Hybrid Copper Bonding - A Manufacturing Lever for The AI Era
    Wednesday 14 October 2026
    Practical Insights & Industry Ideas
    Wednesday 14 October 2026
    GMIF 2026 Awards: Samsung, SanDisk, BIWIN, and Others Honored