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Thursday 4 September 2025
Commentary: YMTC's 3D DRAM push challenges CXMT and global memory leaders
China's push to localize its memory supply chain is gathering momentum. YMTC has begun trial production at its first fully localized NAND flash fab, while market chatter indicates...
Thursday 4 September 2025
Korean industry sees US VEU revocations as rare earth talk leverage
Analysts say the US government's decision to revoke Verified End-User (VEU) authorizations for semiconductor equipment exports to Samsung Electronics and SK Hynix's Chinese factories...
Thursday 4 September 2025
Tech Forum 2025: ASICs, packaging, and HBM reshape the AI chip race
The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new "decentralized"...
Wednesday 3 September 2025
SK Hynix installs first high-NA EUV lithography system at Icheon fab
SK Hynix announced that it has successfully assembled the industry's first high-NA extreme ultraviolet (EUV) lithography system for mass production at its M16 fabrication plant in...
Tuesday 2 September 2025
SK Hynix strikes pay deal, lifting average worker bonus to US$78,600

SK Hynix ended a protracted labor dispute by scrapping a ceiling on worker bonuses, easing the risk of strikes after nearly three months...

Tuesday 2 September 2025
China's YMTC moves into DRAM, teams with CXMT to target HBM market
Yangtze Memory Technologies Corp. (YMTC), China's largest NAND flash producer, is expanding into the DRAM sector as part of Beijing's broader drive to compete in advanced memory markets...
Tuesday 2 September 2025
SK Hynix expected to outpace Samsung, Micron in HBM share
SK Hynix is expected to retain more than half of the global high-bandwidth memory (HBM) market through at least 2027, cementing its role as Nvidia's top supplier while broadening...
Tuesday 2 September 2025
US strips Samsung, SK Hynix of China exemptions, dealing major blow to Korean chipmakers
The US Commerce Department plans to revoke long-standing waivers that have allowed Samsung Electronics and SK Hynix to operate their Chinese chip plants using American equipment....
Tuesday 2 September 2025
Samsung and SK Hynix VEU exemption revocation opens door for Micron and Chinese chipmakers
On August 29, 2025, local time, the US Department of Commerce (DOC) announced it will revoke the Validated End-User (VEU) exemptions previously granted to South Korean manufacturers...
Tuesday 2 September 2025
Hanwha Semitech advances fluxless bonding to address HBM packaging strains
As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech...
Tuesday 2 September 2025
South Korea's Nextin lands SK Hynix deal, plans expansion in Japan, US, and Europe
South Korea-based optical wafer inspection equipment manufacturer Nextin has made strides in the high-bandwidth memory (HBM) segment, gaining traction after launching its dedicated...
Monday 1 September 2025
APCB faces pressure after capacity reduction, eyes boost from DDR5, optical modules in 2026
Taiwan-based PCB manufacturer APCB is launching two new products in 2025, following significant capacity downsizing in 2024. However, the company noted that the new QSFP optical module...
Monday 1 September 2025
Huawei launches AI SSDs to ease China's chip bottlenecks
China's drive for self-sufficiency in AI has taken a new turn with Huawei's launch of AI solid-state drives (SSDs), aimed at easing severe shortages of high-bandwidth memory (HBM)...
Monday 1 September 2025
DDR4 demand eases at high levels, contract prices climbing through year-end
Memory spot prices surged in the second quarter of 2025 but have since stabilized at high levels. DDR4 supply remains constrained, yet the earlier rush to secure inventory has eased,...
Monday 1 September 2025
South Korea’s HBM pioneer highlights hybrid bonding and compute-in-memory trends
As artificial intelligence and high-performance computing continue to advance rapidly, high-bandwidth memory (HBM) paired with GPUs has become a critical battleground in the semiconductor...