Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging...
Powerchip Semiconductor Manufacturing Company (PSMC) reported a steeper net loss in the second quarter of 2025, as a stronger New Taiwan dollar and weakening wafer average selling...
The second half of 2025 is shaping up to be a pivotal period in the global semiconductor industry, as the race for technological supremacy intensifies. At the forefront are Samsung...
Samsung Electronics has reportedly succeeded in developing its sixth-generation 10nm class DRAM, known as 1c DRAM, and is preparing for mass production despite internal tensions that...
Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current...
Chinese memory giant CXMT is actively advancing its DDR5 and LPDDR5 DRAM process upgrades. According to supply chain sources, although CXMT has yet to enter mass production, recent...
China's top memory chipmakers, ChangXin Memory Technologies (CXMT) and Yangtze Memory Technology Corp. (YMTC), have nearly doubled their output in just over a year. Their rapid expansion...
Nvidia's renewed ability to sell H20 artificial intelligence chips to China following the lifting of US restrictions is driving SK Hynix to consider expanding production of advanced...
Fujifilm announced its plan to strengthen its business in materials for semiconductor back-end processes at a semiconductor materials business briefing held in Tokyo on July 15, 2025...
Yangtze Memory Technologies Co. (YMTC), China's top NAND flash maker, is advancing its push for equipment self-sufficiency. Supply chain sources say the company's first NAND production...
Coming out the other side after nearly a decade of legal troubles, Samsung Electronics stands at a crossroads. Chairman Lee Jae-yong is rebuilding the group leadership structure,...
Below are the top DIGITIMES Asia stories from July 14 to 20, 2025. The top three topics include Nvidia teams up with Micron for a major SOCAMM rollout, aiming to challenge high-bandwidth...
Samsung Electronics is preparing a major push to reclaim ground in the high-bandwidth memory (HBM) market, where it has lagged behind SK Hynix and Micron. Its sixth-generation 1c...
As demand for artificial intelligence (AI) accelerates, tech giants like Amazon, Google, and Meta are emerging as major players in the high-bandwidth memory (HBM) market. These companies...
Nvidia is reportedly preparing to enter a new phase in the memory market by planning to deploy between 600,000 and 800,000 SOCAMM modules in 2025. This initiative positions SOCAMM...
