Surpassing Samsung in DRAM market share for the first time in its 40-year history can be attributed mainly to SK Hynix's dominance in the high bandwidth memory (HBM) market. Samsung's...
As the US-China trade war intensifies, Chinese memory module manufacturers are ramping up procurement efforts to secure inventory for at least two to three quarters. Industry insiders...
After nearly ten months, SK Group chairman Tae-won Choi's private jet landed again in Taiwan, signaling renewed efforts to deepen ties with key players in the AI supply chain. Exclusive...
Micron Technology will reportedly add a surcharge to US product sales in response to tariffs implemented during the Trump administration. This move, aimed at offsetting import costs,...
At its GTC event in March, Nvidia unveiled the B300 and GB300 AI accelerators, both scheduled for a mid-2025 release. The GB300, featuring significantly higher performance and power...
The meteoric rise of generative AI has unleashed an insatiable demand for computational power, propelling the memory industry into a fierce technological crucible. While Samsung Electronics...
Samsung Electronics plans to increase DRAM and NAND Flash memory prices by 3-5% in response to potential new US semiconductor tariffs, according to reports from South Korean media...
These are the most-read DIGITIMES Asia stories from the week of March 31 – April 5. From sweeping US tariff hikes to strategic moves by major tech players, here's a quick look...
Towa, a prominent name in Japan's semiconductor manufacturing equipment industry, has introduced a new technology specifically designed for the sixth-generation high bandwidth memory...
The memory market has shown signs of stabilization after a notable downturn, with recent price increases indicating a positive shift. This transition comes in the wake of manufacturers...
Samsung Electronics Chairman Lee Jae-yong was recently joined by senior executives from the company's semiconductor and display departments on a rare visit to China. Industry analysts...
Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting...
Samsung Electronics Chairman Lee Jae-yong recently made a high-profile visit to China, meeting with leading Chinese automaker executives and President Xi Jinping. South Korean analysts...
Hiroshi Kawamoto, Division Officer, Finance Division of Tokyo Electron Limited (TEL), one of Japan's leading semiconductor equipment manufacturers, projects that demand for high-bandwidth...
