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Tuesday 2 September 2025
US strips Samsung, SK Hynix of China exemptions, dealing major blow to Korean chipmakers
The US Commerce Department plans to revoke long-standing waivers that have allowed Samsung Electronics and SK Hynix to operate their Chinese chip plants using American equipment....
Tuesday 2 September 2025
Samsung and SK Hynix VEU exemption revocation opens door for Micron and Chinese chipmakers
On August 29, 2025, local time, the US Department of Commerce (DOC) announced it will revoke the Validated End-User (VEU) exemptions previously granted to South Korean manufacturers...
Tuesday 2 September 2025
Hanwha Semitech advances fluxless bonding to address HBM packaging strains
As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech...
Tuesday 2 September 2025
South Korea's Nextin lands SK Hynix deal, plans expansion in Japan, US, and Europe
South Korea-based optical wafer inspection equipment manufacturer Nextin has made strides in the high-bandwidth memory (HBM) segment, gaining traction after launching its dedicated...
Monday 1 September 2025
APCB faces pressure after capacity reduction, eyes boost from DDR5, optical modules in 2026
Taiwan-based PCB manufacturer APCB is launching two new products in 2025, following significant capacity downsizing in 2024. However, the company noted that the new QSFP optical module...
Monday 1 September 2025
Huawei launches AI SSDs to ease China's chip bottlenecks
China's drive for self-sufficiency in AI has taken a new turn with Huawei's launch of AI solid-state drives (SSDs), aimed at easing severe shortages of high-bandwidth memory (HBM)...
Monday 1 September 2025
DDR4 demand eases at high levels, contract prices climbing through year-end
Memory spot prices surged in the second quarter of 2025 but have since stabilized at high levels. DDR4 supply remains constrained, yet the earlier rush to secure inventory has eased,...
Monday 1 September 2025
South Korea’s HBM pioneer highlights hybrid bonding and compute-in-memory trends
As artificial intelligence and high-performance computing continue to advance rapidly, high-bandwidth memory (HBM) paired with GPUs has become a critical battleground in the semiconductor...
Saturday 30 August 2025
Huawei develops AI SSDs to cut reliance on HBM, putting Korean chipmakers on edge
Huawei is preparing to commercialize solid-state drives tailored for artificial intelligence, a move that industry analysts say could challenge the dominance of high-bandwidth memory...
Saturday 30 August 2025
Samsung, SK Hynix lose US waiver for China fabs
The U.S. Department of Commerce has announced the revocation of waivers that allowed a select group of foreign semiconductor manufacturers to export U.S.-origin semiconductor manufacturing...
Thursday 28 August 2025
Silicon Motion accelerates PCIe Gen5 production as Windows 10 retirement fuels PC upgrade surge
PC demand remains soft under macroeconomic pressures, but the phase-out of Windows 10 is expected to drive an upgrade cycle that will accelerate PCIe Gen5 adoption. NAND flash controller...
Thursday 28 August 2025
Micron CEO reportedly meets Samsung's MX division head, bolstering grip on Galaxy's DRAM supply
Micron is tightening its grip on Samsung's flagship smartphone supply chain, even as the South Korean tech giant works to steady its own memory production business.
Thursday 28 August 2025
Samsung’s hush on HBM4 fuels doubts over Nvidia supply readiness
South Korean media report that Samsung Electronics' sixth-generation high-bandwidth memory (HBM4) has cleared Nvidia's preliminary tests and could enter pre-production (PP) by late...
Thursday 28 August 2025
South Korea races to close gap in hybrid bonding as global rivals move ahead
South Korean experts are raising alarms that domestic semiconductor equipment manufacturers may be falling behind in developing hybrid bonding technology—critical for advancing...
Wednesday 27 August 2025
Nvidia's Huang meets Samsung, SK leaders at US summit as HBM battle escalates
The South Korea-US summit offered a rare gathering of tech heavyweights, as Nvidia CEO Jensen Huang met with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Chey Tae-won...