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Monday 15 April 2024
Samsung gets US$6.4 billion from CHIPS Act, promises to bring HBM and advanced packaging to Texas
The US Department of Commerce (DOC) and Samsung Electronics signed a non-binding preliminary memorandum of terms (PMT) on April 15 to provide up to US$6.4 billion in direct funding...
Monday 15 April 2024
Amkor, Infineon collaborate to fortify European semi supply chain
Infineon Technologies recently announced a multi-year partnership with Amkor Technology, a leading provider of semiconductor packaging and test services. Both companies have agreed...
Monday 15 April 2024
TSMC unveils BOD nominees, including vice chair of US DOC advisory council
TSMC has nominated ten candidates for its board of directors, including three new independent directors.
Monday 15 April 2024
Samsung executives visited Taiwan and TSMC in secret for HBM collaboration
According to sources in Taiwan's semiconductor supply chain, Samsung Electronics visited Taiwan at the end of March.
Monday 15 April 2024
Renesas revamps old plant, powers up semiconductor production for EVs
Renesas has repurposed an old wafer fabrication facility in Yamanashi Prefecture, Japan, into a power semiconductor plant.
Monday 15 April 2024
Veolia offers solutions to meet semiconductor industry's needs for sustainability
As many countries are building up their semiconductor supply chains, Veolia Water Technologies, a global leader specializing in water treatment technologies and services, is seeing...
Monday 15 April 2024
China-based SICC becomes second-largest SiC wafer provider globally
As silicon carbide (SiC) substrates continued to evolve toward larger sizes, the 200mm substrate has become a hotly contested technology field.
Monday 15 April 2024
Rapidus announces US subsidiary, California office, and GM
Rapidus has announced the formation of a US subsidiary, Rapidus Design Solutions (RDS), the establishment of an Americas office in Santa Clara, California, and the appointment of...
Monday 15 April 2024
Hanmi won HBM equipment orders from Micron, Samsung next?
In recent years, due to the development of the High Bandwidth Memory (HBM) market, the thermal compression (TC) bonder equipment produced by Hanmi Semiconductor has attracted attention...
Monday 15 April 2024
SMIC-backed chipmaker plays catchup as China formulates silicon IP strategy
According to reports from various Chinese media outlets such as National Business Daily and 21st Century Business Herald, top Chinese IC design service providers...
Monday 15 April 2024
SK Hynix and Samsung forge path to sustainable neon gas usage
South Korean giants SK Hynix and Samsung Electronics are spearheading a transformative shift towards sustainable practices by pioneering the recycling of neon gas—a critical...
Monday 15 April 2024
Weekly news roundup: JCET has offered advanced packaging services for chips below 5nm, the company says
These are the most-read DIGITIMES Asia stories in the week of April 8 - April 12.
Monday 15 April 2024
China's chip equipment industry gains momentum in import substitution, alarming foreign suppliers
China currently relies heavily on imports for over 85% of its semiconductor equipment needs, showcasing a self-supply rate of only about 14%.
Monday 15 April 2024
India roundup: Elon Musk visit to India may entail an EV plant
Elon Musk is scheduled to visit India and meet with Indian Prime Minister Narendra Modi. Global IC design houses speeded up investments in India by setting up global capability cen...
Friday 12 April 2024
Chipmaking push makes US attractive AI hub, Celesta Capital says
The US is a standout destination for investors in artificial intelligence because of its push to develop more advanced chipmaking at home, according to Silicon Valley-based Celesta...