The continuous surge in generative AI applications is driving strong demand for High Bandwidth Memory (HBM), significantly benefiting Japanese suppliers of materials and equipment...
With the capacity expansions of its foundry customers and the opening of new facilities, fab toolmaker Marketech International anticipates a sharp increase in revenue next year, reaching...
Taiwan's PCB and semiconductor equipment manufacturers are poised to enhance their footprint in Southeast Asia by establishing manufacturing operations or bolstering their customer...
ASML, a Dutch equipment firm with a stranglehold on lithography equipment and a monopoly on high-end extreme ultraviolet (EUV) exposure machines, has become accustomed to having tens...
In the dynamic realm of AI, TSMC has secured the vast majority of customer orders, and foundry quotes now surpassing US$10,000 per wafer are primarily centered on the lucrative process...
With ASML recently stating that 20% of their recent orders are held by Chinese customers and nearly half of their revenue comes from China, the future operation trend of the world's...
Amidst a backdrop of sluggish capital expenditures from telecom giants, the beleaguered telecom equipment market is bracing for an even more challenging 2024. Ericsson signaled caution,...
Taiwan's Financial Supervisory Commission (FSC) released data showing that as of December 2023, 1,209 Taiwanese companies had invested NT$2,735.6 billion (US$84.2 billion) in China,...
VP of Taiwan Display Union Association (TDUA) James Yang says he is optimistic about Taiwan's MicroLED industry and the technology's potential, despite Apple's recent decision to...
China's production of ICs and semiconductor equipment continued to grow in the first quarter of 2024, fueled by the recovery in the economy and efforts to achieve self-reliance despite...
In a market landscape fraught with geopolitical tensions, Huawei has managed to retain its top position globally in the communication equipment sector for 2023.
In recent years, due to the development of the High Bandwidth Memory (HBM) market, the thermal compression (TC) bonder equipment produced by Hanmi Semiconductor has attracted attention...
Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer, plans to open a new facility in Japan. Construction is anticipated to begin in 2024, with...
