The booming robot market has seen Aurotek keenly pivot from automated equipment manufacturing to smart robot integration solutions, riding the current wave of industry growth. Departing...
TSMC issued its first drone procurement tender for workplace safety and factory inspections at its Arizona facility, with partner selection expected in the second half of 2025. The...
Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current...
Softstar Entertainment has expanded its territory in recent years and actively deepened its presence in Taiwan's key industries, covering diverse fields such as heavy electrical equipment,...
As of July 18, 2025, negotiations between Taiwan and the United States over automotive tariffs remain unresolved, leaving consumers hesitant and domestic automakers largely immobilized...
TSMC's rapid facility expansion is driving demand beyond equipment suppliers to construction materials providers. Goldsun Building Materials, Taiwan's largest concrete manufacturer,...
Yangtze Memory Technologies Co. (YMTC), China's top NAND flash maker, is advancing its push for equipment self-sufficiency. Supply chain sources say the company's first NAND production...
According to Bernama, Malaysia has launched a MYR90 million (US$21.2 million) Science Endowment matching fund aimed at accelerating the country's push into advanced semiconductor...
Transforming from an automation equipment manufacturer, Aurotek has treated its integrated robot solution business as a second growth curve and has reaped the benefits reflected in...
ASML posted stronger-than-expected second-quarter 2025 earnings and projected a 15% jump in revenue for 2025 while maintaining a robust gross margin forecast of around 52%. However,...
LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth...
Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company...
Following the fire that broke out at Taiwan Cement Corporation (TCC) subsidiary Molicel's Kaohsiung plant in the early morning on July 14, TCC chairman Nelson Chang has conducted...
As the global telecommunications market accelerates 5G network deployment, demand for 5G customer premises equipment (CPE) continues to rise. Taiwanese networking brand D-Link has...
Dutch lithography equipment giant ASML announced it will release its second quarter 2025 earnings report at 2 pm Taiwan time on July 16, one day ahead of TSMC. A major concern for...
