Is it time for Intel Foundry (IF) to be spun off as an independent entity? During the 2008-2009 financial crisis, AMD was forced to divest its wafer fabrication division, offloading...
Once the undisputed leader of the semiconductor industry, Intel has seen its market capitalization dwindle significantly compared to its American rivals, Nvidia and AMD. Intel's market...
Texas Instruments (TI) and the US Department of Commerce have signed a non-binding preliminary memorandum of terms for up to US$1.6 billion in proposed direct funding under the CHIPS...
Semiconductor materials supplier Topco Scientific is keenly promoting the use of new materials for CoWoS and other advanced packaging technologies, confident in its operations and...
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
