SK Hynix adopts hybrid bonding for 300-layer NAND to challenge Samsung

Sherri Wang, Jessica Tsai, DIGITIMES Asia Tuesday 9 December 2025 0

Credit: SK Hynix

South Korean memory giant SK Hynix is fast-tracking the development of its next-generation 300-layer V10 NAND flash memory, according to reports in Korean media outlets Hankyung and Nate. The company plans to implement hybrid bonding...

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