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Tuesday 20 August 2024
What's behind the setbacks in Huawei's 910C chip production?
Reports from the Chinese semiconductor industry suggest that Huawei's Ascend 910C...
Tuesday 20 August 2024
Challenges ahead for Europe's first 12-inch wafer fab
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
Monday 19 August 2024
Intel Foundry's push for self-sufficiency could pave way for spin-off and rebranding
Is it time for Intel Foundry (IF) to be spun off as an independent entity? During the 2008-2009 financial crisis, AMD was forced to divest its wafer fabrication division, offloading...
Monday 19 August 2024
A decade of opposites: Intel's IDM woes vs. AMD's fabless triumph
Once the undisputed leader of the semiconductor industry, Intel has seen its market capitalization dwindle significantly compared to its American rivals, Nvidia and AMD. Intel's market...
Monday 19 August 2024
TI to receive up to US$1.6 billion in CHIPS Act funding
Texas Instruments (TI) and the US Department of Commerce have signed a non-binding preliminary memorandum of terms for up to US$1.6 billion in proposed direct funding under the CHIPS...
Friday 16 August 2024
Topco Scientific continues to promote advanced packaging materials
Semiconductor materials supplier Topco Scientific is keenly promoting the use of new materials for CoWoS and other advanced packaging technologies, confident in its operations and...
Friday 16 August 2024
TSMC to see CoWoS production capacity reach 60,000 wafers in 2025
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
Thursday 15 August 2024
Samsung reportedly introducing high-NA equipment by end of 2024 to catch up in EUV
Samsung Electronics is reportedly set to introduce high-numerical aperture (High-NA) extreme ultraviolet (EUV) equipment by the end of 2024.
Thursday 15 August 2024
How ESMC project is cementing Taiwan's role in global chipmaking
Following the United States and Japan, TSMC's final overseas wafer fab, ESMC (European Semiconductor Manufacturing Company), will...
Wednesday 14 August 2024
Japanese wafer majors report falling sales amid slow chip recovery
Shin-Etsu Chemical and Sumco, which account for approximately 50% of the global wafer market, have both reported a decline in demand for the April-June 2024 quarter compared to the...
Monday 12 August 2024
SDC reportedly signs contract with Microsoft
Samsung Display (SDC) is reportedly collaborating with Microsoft to develop and supply OLED on Silicon (OLEDoS) for the next generation of Mixed Reality (MR) devices.
Friday 9 August 2024
SMIC's profit plummets amid fierce competition in China, despite record utilization rate
China-based pure-play foundry Semiconductor Manufacturing International Corporation (SMIC) reported a decline in profit despite growing revenue by more than 20% amid intense competition...
Thursday 8 August 2024
Infineon opens new SiC fab in Malaysia
Infineon Technologies is set to unveil a new silicon carbide (SiC) wafer fab at its plant site in Kulim, Malaysia, which aims to move from 6-inch to 8-inch production in 2025. Malaysia's...
Wednesday 7 August 2024
GlobalWafers cuts 2024 revenue outlook to high-single-digit drop
Silicon wafer company GlobalWafers has revised its revenue growth projection for 2024 to a decline in the high single digits. The revision was downgraded for the second time this...
Wednesday 7 August 2024
Samsung yet to escape wafer foundry struggles, may see losses in 'trillions of KRW' in 2024
Despite a strong overall performance in the second quarter of 2024, Samsung Electronics continues to grapple with losses in its wafer foundry business. Most analyses indicate that...