On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
In June 2024, Vanguard International Semiconductor (VIS) and NXP unveiled plans to collaborate on establishing VSMC in Singapore, where they will build a 12-inch wafer fabrication...
World leaders in wafer and microelectronic subsystem assembly have chosen Québec for its strong government support and industry knowledge through the whole value chain particularly...
Despite short-term fluctuations in the global automotive market, Felicity Carson, Senior Vice President of Onsemi, told DIGITIMES that the goal for its silicon carbide (SiC)...
China's largest pure-play foundry, SMIC, reported a significant decline in profitability despite revenue growth in its latest financial results. The company remains cautious despite...
In a significant leap forward for semiconductor manufacturing, ifm, a global leader in sensor technology, exhibited a comprehensive suite of smart sensing solutions at SEMICON Taiwan...
SEMICON Taiwan 2024, is set to take place on September 4, with over 200 industry leaders from the global high-tech and semiconductor sectors expected to attend.
The scope of the US Chips Act appears to have exceeded that of the China Integrated Circuit Industry Investment Fund II (Big Fund II), but the American government's goal of reshoring...
Generalplus, a leading microcontroller (MCU) manufacturer, anticipates steady revenue growth despite ongoing global economic fluctuations. Yixing Jia, General Manager of Generalplus,...
TSMC's first European wafer fab is set to be located in Dresden, Germany, a region already recognized as a significant chip manufacturing hub in both Germany and Europe. This decision...
ESMC has commenced construction on a new semiconductor fabrication facility in Dresden, Germany. The joint venture between TSMC, Robert Bosch, Infineon, and NXP is investing over...
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
