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Friday 20 April 2018
TI, Taiwan makers team up to develop car electronics solutions
Texas Instruments (TI) and member firms of a new generation driver platform R&D alliance set up in Taiwan three years ago have jointly developed a spate of automotive electronics...
Wednesday 18 April 2018
MediaTek, Microsoft team up for IoT
MediaTek has announced it is teaming up with Microsoft to deliver the first ever Azure Sphere chip, the MT3620, which will drive IoT innovation with built-in security and connectiv...
Friday 23 March 2018
Alpha Networks and Qisda team up for IoT, 5G
Networking device maker Alpha Networks will be working with EMS service provider Qisda in the IoT and 5G markets, said Alpha chairman John Lee at a March 22 investors meeting. The...
Friday 23 February 2018
Intel, Unigroup Spreadtrum & RDA team up for 5G smartphone chips in China
Unigroup Spreadtrum & RDA has announced it is teaming up with Intel to develop a 5G smartphone platform designed for the China market.
Tuesday 13 February 2018
Taiwan and India academics team up to boost tech research momentum
Taiwan's National Chiao Tung University (NCTU) has signed a pact with the Indian Institutes of Technology (IIT) to jointly carry out research projects and promote dual-degree programs,...
Friday 2 February 2018
Google Taiwan R&D team to expand hardware development, says executive
Google's R&D team in Taiwan will not only develop smartphones but also other products, while expanding the company's hardware development, according to Rick Osterloh, senior hardware...
Wednesday 10 January 2018
Intel, Tsinghua Unigroup may team up to develop China NAND flash market
Intel is expected to enhance its presence in China's NAND flash market, with plans to ramp up the capacity of its 12-inch fab in Dalian and possibly to license its technology to Tsinghua...
Wednesday 13 December 2017
Lite-On, Tsinghua Unigroup team up to tap China storage market
Taiwan-based Lite-On Technology will team up with China's Tsinghua Unigroup to jointly develop the China market for storage products such as solid state drives (SSD), with the latter...
Monday 11 December 2017
Quanta Cloud to team up with Intel, RedHat to develop 5G cloud solutions
Quanta Cloud Technology (QCT), a datacenter solution subsidiary of Quanta Computer, will team up with Intel and RedHat to set up a telecom solution laboratory in the Silicon Valley...
Thursday 16 November 2017
Globalfoundries, Fudan to deliver next generation dual interface smart card
Globalfoundries (GF) and Fudan Microelectronics Group have announced they have produced a next generation dual interface CPU card, using GF's 55nm low power extended (55LPx) technology...
Friday 3 November 2017
Gowin, TSMC team up for 28nm FPGA chips
China-based Gowin Semiconductor has announced the development of its first 28nm FPGA product, the GW3AT-100, fabricated by Taiwan Semiconductor Manufacturing Company (TSMC).
Thursday 21 September 2017
Google buys part of HTC smartphone team for US$1.1 billion
Google and HTC have announced a definitive agreement under which certain HTC employees - many of whom are already working with Google to develop Pixel smartphones - will join Google...
Tuesday 19 September 2017
SMIC, Brite and Synopsys team up for IoT platform
Semiconductor Manufacturing International (SMIC), Brite Semiconductor and Synopsys have teamed up to develop a platform that enables designers, system integrators and OEMs to accelerate...
Friday 8 September 2017
Ambiq Micro, TSMC team up to develop Huawei fitness wearables
Ambiq Micro announced recently that Huawei has selected the Apollo2 platform, built on TSMC's 40nm Near-Vt technology platform, to power its new line of lightweight fitness wearables...
Wednesday 2 August 2017
Qualcomm, Win Semi reportedly to team up for 5G mobile infrastructure
Qualcomm has recently approached GaAs IC foundry Win Semiconductors to cooperate in an infrastructure project for 5G mobile networks, according to market sources.