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Friday 22 February 2019
PCBECI equipment networking pilot team formed in Taiwan
A PCBECI equipment networking pilot team, organized by Taiwan Printed Circuit Association (TPCA), has kicked off operation seeking to boost network connectivity of Taiwan-made PCB...
Wednesday 9 January 2019
Micron, Qualcomm team up for automotive infotainment
Micron Technology has announced its automotive-grade LPDDR4X memory devices are being adopted for Qualcomm's third-generation Snapdragon automotive cockpit compute systems. The companies...
Monday 3 December 2018
DNP, Winbond team up for eSIM
Dai Nippon Printing (DNP) has announced it is teaming up with Winbond Electronics to develop eSIM and other secure elements for IoT devices.
Friday 23 November 2018
Qualcomm expands R&D team in Taiwan
Qualcomm has been expanding its local R&D team in Taiwan to bring the company closer to its Taiwan-based partners such as TSMC for the development of 5G mobile chips, according...
Friday 16 November 2018
Tsinghua and Longsys team up for NAND flash
Tsinghua Unigroup has signed a strategic alliance with memory module firm Shenzhen Longsys Electronics in a move to accelerate its ambition in the NAND flash sector.
Friday 9 November 2018
Jorjin Technologies of the TW 5G Alliance - CHT pilot team to showcase AR/MR smart glasses at NGMN IC&E 2018
Jorjin Technologies, as a member of the TW 5G Alliance - CHT pilot team, will participate in NGMN IC&E 2018 Vancouver this year, to share our results and advances in smart glass...
Monday 29 October 2018
Himax, Kneron team up for AI-enabled security solution
Himax Technologies and Kneron, an artificial intelligence (AI) startup company, have jointly announced a collaboration to accelerate the development and commercialization of a high...
Friday 19 October 2018
Team Group to debut on TWSE as early as year-end 2018
Memory module maker Team Group expects to start trading its shares on the main board of the Taiwan Stock Exchange (TWSE) as early as the end of 2018.
Wednesday 12 September 2018
Memory module firm Team Group applies for TWSE listing
Taiwan-based memory module maker Team Group has applied to be listed on the Taiwan Stock Exchange (TWSE).
Friday 17 August 2018
Taiwan team unveils low-cost AI chip
A team of Taiwan researchers and an IC design house have jointly unveiled a deep-learning image-recognition AI chip whose production cost could be as low as only US$1.
Tuesday 3 July 2018
Brand value to determine winners in gaming market, says Team president
The rampant development of the global gaming industry has significantly driven the shipment growth and spec upgrades of gaming devices, but it is brand value that will determine who...
Friday 29 June 2018
HTC, China Mobile team up for 5G program
HTC has signed a MoU agreement with China Mobile to join forces on a 5G program in China, according to a company announcement.
Tuesday 5 June 2018
Memory module maker Team Group plans to apply for listing on TWSE mainboard
Memory module maker Team Group expects to list on the mainboard of the Taiwan Stock Exchange (TWSE) as early as the end of 2018.
Tuesday 22 May 2018
Chialin and CY Precision team up for China automotive market
Terminal connector makers Chialin Precision Industrial and CY Precision have signed a pact to co-develop automotive components and devices for the China market.
Friday 20 April 2018
TI, Taiwan makers team up to develop car electronics solutions
Texas Instruments (TI) and member firms of a new generation driver platform R&D alliance set up in Taiwan three years ago have jointly developed a spate of automotive electronics...