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Wednesday 14 December 2022
NXP, Delta team up for next-gen EV solutions
NXP Semiconductors and Taiwan's Delta Electronics, a switching power supply provider, have struck a deal under which the pair will jointly develop next-generation electric vehicle...
Tuesday 13 December 2022
Samsung adjusts semiconductor department for advanced packaging ambition
Samsung Electronics's Device Solutions (DS) division recently adjusted its organization by adding an advanced packaging team under the Test & System Package (TSP) department,...
Monday 12 December 2022
Ennostar's subsidiary joins LEO satellite national team, will provide key RF chips
Ennostar announced that its subsidiary Hexawave has joined the "Beyond 5G LEO (low-Earth orbit) satellite project" launched by Taiwan's Ministry of Economic Affairs (MOEA) and will...
Wednesday 7 December 2022
Taiwan government to deploy team to protect key technologies
With the concern that the US may pressure the Taiwanese government to have TSMC move its newest technologies to the US, thus weakening Taiwan's importance in the semiconductor industry,...
Wednesday 16 November 2022
Rohm to team up with Shenzhen chipmaker for SiC power devices
Rohm Semiconductor has struck a strategic cooperation agreement with China's Shenzhen-based BASiC Semiconductor under which the pair will jointly develop SiC power devices for electric...
Friday 30 September 2022
J&V Energy Technology organizes Taiwan Team 2.0 for developing offshore wind farms
Renewable energy developer J&V Energy Technology has organized a team, dubbed Taiwan Team 2.0, specifically for joint participation in developing offshore wind farms in the third...
Thursday 22 September 2022
Aleees, Avenira team up for LFP battery cathode manufacturing
Taiwan-based Aleees has signed an MoU with ASX-listed Avenira to develop and operate a plant for lithium iron phosphate (LFP) battery cathode manufacturing in Darwin, the capital...
Friday 16 September 2022
ASE, TSMC team up for silicon photonics
ASE Technology is partnering with TSMC on the development of silicon photonics (SiPh), and has cut into the supply chain of Tier-1 chip vendors for co-packaged optics (CPO) products,...
Thursday 15 September 2022
Delta, SAS to team up for 3rd-gen semiconductors
Delta Electronics through its affiliate Ancora Semiconductors, which focuses on GaN technology, will be teaming up with Sino-American Silicon (SAS) in the third-generation semiconductor...
Wednesday 7 September 2022
Rohm, Nanjing SemiDrive team up for automotive solutions
Rohm Semiconductor has announced that it is partnering with SemiDrive Technology, a China-based SoC manufacturer of next-generation cockpits, to develop automotive solutions. The...
Wednesday 31 August 2022
VicOne, Delta team up for EV charging infrastructure cybersecurity
VicOne, an automotive cybersecurity solution provider wholly owned by Trend Micro, has partnered with Delta Electronics to secure EV charging infrastructure, which will help the latter's...
Thursday 25 August 2022
Cadence, UMC team up for 22nm analog and mixed-signal IC design flow certification
Cadence Design Systems' analog and mixed-signal (AMS) IC design flow has been certified for United Microelectronics' (UMC) 22ULP/ULL process technologies, according to the companies...
Monday 15 August 2022
Memory module firm Team Group reports loss in 2Q22
Memory module house Team Group swung to losses in the second quarter but remained profitable in the first half of 2022.
Friday 5 August 2022
NXP, Inventec team up for automotive electronics ecosystem in Taiwan
Automotive IC vendor NXP Semiconductors and ODM Inventec have announced they are teaming up to create an industry ecosystem locally in Taiwan for automotive electronics products.
Thursday 21 July 2022
Foxconn, NXP team up for EVs
NXP Semiconductors has signed a memorandum of understanding (MOU) with Hon Hai Technology Group (Foxconn) to jointly develop platforms for a new generation of smart connected vehicles,...