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Thursday 13 November 2025
Mecal High-Tech Systems - provide anti-vibration solutions to EUV and high - tech equipment and foundries

Mecal High-Tech Systems is an independent global high end contracting engineering company that specializes in anti-vibration and shielding technologies for high-precision...

Thursday 13 November 2025
Fastmicro - provides surface particle measurement solutions & Cleanliness Control

Fastmicro B.V. is a manufacturer of surface particle defect detection systems and equipment established over 15 years ago. The main product lines include sample surface...

Thursday 13 November 2025
Axelera AI - integrating the Metis AI Accelerator to boost edge AI applications

Axelera AI is a startup targeting Edge AI applications. Leveraging its Metis AI Processing Unit (AIPU) chip, embedded hardware AI inference acceleration cards, and Voyager...

Thursday 13 November 2025
Brainport Industries Campus Development Organization - The largest high-tech manufacturing expansion in the Netherlands

Brainport Industries Campus (BIC) is a development project for an industrial park in Eindhoven, the Netherlands. Phase one (BIC 1) has been completed, encompassing 105,000...

Thursday 13 November 2025
Invest in Holland - supporting foreign companies in establishing and expanding their businesses in the Netherlands

Invest in Holland /Netherlands Foreign Investment Agency (NFIA) is the national investment promotion service of the Netherlands. It operates as part of the Dutch Ministry...

Thursday 13 November 2025
Trymax - Plasma-based etching, stripping and curing process equipment maker

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum,...

Thursday 13 November 2025
Tempress - Diffusion and thin film deposition equipment manufacturer

Tempress is a leading manufacturer of diffusion and thin film deposition equipment, with over 55 years of experience in thermal process technology. We support innovators...

Thursday 13 November 2025
Powertrim - power module manufacturing service and equipment provider

Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking...

Thursday 13 November 2025
HITEC Power Protection - a reliable and secure dynamic UPS solution provider

HITEC Power Protection develops, manufactures, and provides dynamic uninterruptible power (UPS) solutions to support the most vital of manufacturing and business critical...

Thursday 13 November 2025
Boschman - providing packaging solutions for auto & industrial power modules

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial...

Thursday 13 November 2025
Prodrive Technologies - delivering high-performance camera, compute, and motion control solutions

Founded in 1993, Prodrive Technologies designs and manufactures mission-critical products that combine advanced engineering, innovative manufacturing, and global expertise...

Thursday 13 November 2025
HQ Pack - global full-service provider of high-tech packaging from design to reuse

HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable...

Thursday 13 November 2025
India's Kaynes Semicon outlines OSAT roadmap from power to advanced packaging
Kaynes Semicon, the semiconductor division of India's Kaynes Technology, is expanding beyond its success in power module packaging toward advanced chiplet and co-packaged optics as...
Wednesday 22 October 2025
The Packaging Pivot Driving AI Chip Performance

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking,...

Tuesday 21 October 2025
PGC Integrates 2.5D/3D Advanced Packaging Technology to Break the Memory Wall and Accelerate AI/HPC ASIC Innovation

As AI models and computing demands continue to grow exponentially, the biggest challenge in chip design is no longer pure processing power, but the bandwidth gap between...