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NEWS TAGGED SEMICON
Monday 21 September 2026
Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026

Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing,...

Monday 21 September 2026
India roundup: Semicon India 2026 puts commercial production and supplier investment in focus
India's semiconductor push is moving from policy to production, with new government funding, supplier investments, rising deal activity and expanding equipment, materials, testing...
Friday 18 September 2026
Global chipmakers answer India's pitch with equipment, materials, and R&D — not fabs
The multinationals that filled Semicon India 2026 committed to almost every layer of the semiconductor value chain except the one India most wants: nobody announced a new fab. Applied...
Friday 18 September 2026
Tata Electronics put 16 MoUs on the record at Semicon India, join hands with Nexperia
Tata Electronics has attached a headline number to its supplier-recruitment drive at Semicon India 2026 — 16 memoranda of understanding — but only five have been documented...
Friday 18 September 2026
Modi says India's chip mission has reached commercial production as Semicon 2.0 lifts the purse to US$13.5 billion
India's government used the opening of Semicon India 2026 to reframe what it is asking the industry to believe: not that fabs will be built, but that they are already shipping. Prime...
Monday 14 September 2026
India semiconductor deals hit a multi-year high ahead of SEMICON India 2026
India's semiconductor companies have raised nearly half of their all-time equity funding since the start of 2025, and deal activity this year is already at a multi-year high. The figures...
Monday 14 September 2026
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects

As AI-driven high-performance computing (HPC) and chip-to-chip optical interconnects continue to see rapid growth, Hauman Technologies, a leader in test and measurement...

Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
As AI continues to accelerate demand for high-speed optical connectivity, technologies such as silicon photonics, CPO, LPO, NPO and OCS are moving rapidly toward commercial deployment...
Friday 11 September 2026
DAS Expands in Taiwan and Unveils World First at SEMICON

DAS Environmental Experts continues to expand its capabilities in Taiwan and is presenting another new product at SEMICON Taiwan. Against the backdrop of ongoing investments...

Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026

Toward Technologies, Inc. concluded its participation in SEMICON Taiwan 2026, held from September 2 to 4 at Taipei Nangang Exhibition Center Hall 1. Under the theme "RELAY,...

Tuesday 8 September 2026
Corning targets AI bottlenecks with glass substrates, optics for high-speed data transmission
As AI processors advance toward higher compute density, larger package footprints, and increased bandwidth demands, advanced packaging and high-speed data transmission have emerged...
Monday 7 September 2026
SiliconAuto pushes AI chiplets as automotive SoC ties tighten
Taiwanese automotive microcontroller (MCU) maker SiliconAuto showcased its products at SEMICON Taiwan 2026, with CEO Gene Liu saying the company is now spotlighting AI chiplet architecture...
Monday 7 September 2026
India roundup: India expands chip ambitions with full Semicon 2.0 notification

India's technology sector is gaining momentum across semiconductors, connectivity, AI payments,...

Friday 4 September 2026
CPO testing shifts to mid-stage to avoid costly failures, Chroma says

Co-packaged optics (CPO) is forcing chipmakers and equipment suppliers to rethink where testing should take place, as long optical test...

Friday 4 September 2026
TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...