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NEWS TAGGED SEAJ
Tuesday 31 January 2012
Japan fab tool book-to-bill climbs above parity
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.20 in December 2011, above parity for the first time in 10 months, according to figures from...
Tuesday 20 December 2011
Japan fab tool book-to-bill nears 1.0, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for November 2011, up from 0.83 in October, according to new figures from the Semiconductor...
Monday 21 November 2011
Japan chip gear book-to-bill ratio rises in October, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.83 for October 2011, up from 0.75 in September, according to new figures from the Semiconductor...
Thursday 20 October 2011
Japan fab-tool book-to-bill slips to 0.75 in September, says SEAJ
Japan-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September, declining for the third month in a row.
Wednesday 21 September 2011
Japan fab-tool book-to-bill continues slide in August, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.76 in August 2011, compared to 0.84 in July and 0.96 in June, according to new figures from the...
Friday 19 August 2011
Chip equipment book-to-bill lower in July 2011
North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.86 in July, down from 0.94 in June, according to SEMI. Meanwhile, data gathered by the...
Friday 24 June 2011
Japan May chip-gear orders up 4% on-month, says SEAJ
Japan-based manufacturers of semiconductor equipment posted JPY119.15 billion (US$1.48 billion) in orders in May 2011 (three-month average basis), up 4.4% from the revised level of...
Thursday 24 March 2011
Japan fab-tool book-to-bill back above parity in February 2011, says SEAJ
Japan-based manufacturers of semiconductor equipment posted JPY105.79 billion (US$1.31 billion) in orders in February 2011 (three-month average basis) and a book-to-bill ratio of...
Friday 11 March 2011
Chip equipment sales reach record growth in 2010, says SEMI
Worldwide sales of semiconductor manufacturing equipment totaled US$39.54 billion in 2010, representing a record year-over-year increase of 148%, according to SEMI.
Friday 18 February 2011
Japan fab tool book-to-bill slips below parity in January 2011
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.99 in January 2011, down from 1.07 in December and the lowest since May 2009, according to the...
Friday 21 January 2011
SEMI, SEAJ book-to-bill ratios slip in December 2010
North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.90 in December, down from 0.97 in November, according to SEMI. Meanwhile, data gathered...
Wednesday 15 December 2010
Chip gear billings and bookings rise in 3Q10, says SEMI
Chip manufacturing equipment billings and bookings worldwide enjoyed both sequential and on-year growth in the third quarter of 2010, according to SEMI.
Monday 22 November 2010
Japan chip gear book-to-bill continues to slide on-month
The book-to-bill ratio for Japan-based semiconductor equipment manufacturers slipped to 1.12 in October 2010 from 1.14 in the prior month, according to the Semiconductor Equipment...
Thursday 21 October 2010
Japan September 2010 fab tool book-to-bill slips to 1.14, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.14 in September 2010, down from 1.38 in August, according to new figures from the Semiconductor...
Tuesday 21 September 2010
Japan August chip-gear orders up slightly on-month, says SEAJ
Japan-based manufacturers of semiconductor equipment posted 127.47 billion yen (US$1.49 billion) in orders in August 2010 (three-month average basis), up 1.7% from the revised level...