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NEWS TAGGED SEAJ
Monday 22 November 2010
Japan chip gear book-to-bill continues to slide on-month
The book-to-bill ratio for Japan-based semiconductor equipment manufacturers slipped to 1.12 in October 2010 from 1.14 in the prior month, according to the Semiconductor Equipment...
Thursday 21 October 2010
Japan September 2010 fab tool book-to-bill slips to 1.14, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.14 in September 2010, down from 1.38 in August, according to new figures from the Semiconductor...
Tuesday 21 September 2010
Japan August chip-gear orders up slightly on-month, says SEAJ
Japan-based manufacturers of semiconductor equipment posted 127.47 billion yen (US$1.49 billion) in orders in August 2010 (three-month average basis), up 1.7% from the revised level...
Thursday 9 September 2010
Chip equipment billings climb 22% in 2Q10, says SEMI
Worldwide semiconductor manufacturing equipment billings reached US$9.11 billion in the second quarter of 2010, according to SEMI. The billings figure is 22% higher than that in the...
Thursday 19 August 2010
Japan chip gear book-to-bill climbs to 1.53 in July 2010, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.53 in July 2010, compared to 1.40 in the prior month, according to the Semiconductor Equipment...
Wednesday 21 July 2010
Chip gear book-to-bill ratios climb in June 2010
Japan's semiconductor production equipment manufacturers have reported a book-to-bill ratio of 1.40 for June, up from 1.13 in May, according to the Semiconductor Equipment Association...
Monday 21 June 2010
SEMI, SEAJ book-to-bill ratios stay strong in May 2010
Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.13 in May 2010, up from 1.07 in April, according to the Semiconductor Equipment Association...
Monday 24 May 2010
Japan chip gear book-to-bill slips to 1.07 in April 2010, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.07 in April 2010, compared to 1.17 in the prior month, according to the Semiconductor Equipment...
Tuesday 20 April 2010
Japan chip gear book-to-bill ratio at 1.17 in March 2010, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.17 in March 2010, down from 1.34 in February but up significantly from the record level of 0.30...
Sunday 21 March 2010
Chip-gear book-to-bill almost flat in February 2010
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.22 in February 2010 compared to 1.23 in January, according to SEMI.
Thursday 11 March 2010
Global semiconductor equipment sales down 46% in 2009, says SEMI
Worldwide sales of semiconductor manufacturing equipment totaled US$15.92 billion in 2009, representing a 46% decline compared to US$29.52 billion posted in 2008, according to SEMI...
Thursday 21 January 2010
Japan chip equipment book-to-bill reaches 1.30 in December 2009, says SEAJ
Japan-based semiconductor equipment manufacturers posted about 77.39 billion yen (US$844 million) in orders in December 2009 and a book-to-bill ratio of 1.30, according to Semiconductor...
Wednesday 13 January 2010
Japan chip-gear sales to grow 38% in FY 2010, says SEAJ
Sales of Japan-made semiconductor and flat-panel display (FPD) equipment are forecast to reach 1.12 trillion yen (US$12.3 billion) in fiscal year 2010, up 37.7% from 813 billion yen...
Friday 18 December 2009
Japan chip gear book-to-bill slips to 1.18 in November 2009
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.18 in November 2009 compared to the prior month's level of 1.28, according to Semiconductor Equipment...
Thursday 19 November 2009
Japan chip-gear book-to-bill flat in October 2009, says SEAJ
Japan-based semiconductor equipment manufacturers posted a book-to-bill ratio of 1.28 in October 2009, similar to the prior month's level, according to data gathered by the Semiconductor...
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